Integrated circuit structure without gate contact and method of forming same
One aspect of the disclosure relates to an integrated circuit structure. The integrated circuit structure may include: a gate structure between a pair of gate spacers within a dielectric layer and substantially surrounding a fin, wherein the gate structure is disposed adjacent to a channel region within the fin; and a source/drain contact extending within the dielectric layer to a source/drain region within a fin, the source/drain contact being separated from the gate structure by at least one gate spacer in the pair of gate spacers, wherein the channel region and the source/drain region provide electrical connection between the gate structure and the source/drain contact.
1. An integrated circuit structure comprising:
a gate structure between a pair of gate spacers within a dielectric layer and substantially surrounding a fin, wherein the gate structure is disposed adjacent to a doped channel region within the fin; and
a source/drain contact extending within the dielectric layer to a source/drain region within the fin, the source/drain contact being separated from the gate structure by at least one gate spacer of the pair of gate spacers,
wherein the doped channel region and the source/drain region provide electrical connection between the gate structure and the source/drain contact.
2. The integrated circuit structure of claim 1 , wherein the doped channel region within the fin includes at least one n-type or p-type dopant.
3. The integrated circuit structure of claim 1 , wherein the at least a portion of the gate structure is disposed over a portion of a shallow trench isolation (STI) region.
4. The integrated circuit structure of claim 1 , wherein the integrated circuit structure is free from a gate contact directly to the gate structure.
5. The integrated circuit structure of claim 1 , where the gate structure directly contacts the doped channel region.
6. An integrated circuit structure comprising:
a source/drain contact to a source/drain region, the source/drain contact being adjacent to a gate structure and being directly connected to a gate conductor of the gate structure by direct contact with a sidewall of the gate conductor.
7. The integrated circuit of claim 6 , wherein the source/drain contact is connected to the gate conductor through opposing sidewalls of the gate structure.
8. The integrated circuit structure of claim 6 , wherein at least a portion of the gate structure is disposed over a portion of a shallow trench isolation (STI) region.
9. The integrated circuit structure of claim 6 , further comprising:
a gate cap layer over the gate structure,
wherein the source/drain contact is directly connected to the gate conductor beneath the gate cap layer.
10. An integrated circuit structure comprising:
a gate structure between a pair of gate spacers within a dielectric layer and substantially surrounding a fin, wherein the gate structure is disposed adjacent to a doped channel region within the fin, the doped channel region including a silicide region therein; and
a source/drain contact extending within the dielectric layer to a source/drain region within the fin, the source/drain contact being separated from the gate structure by at least one gate spacer of the pair of gate spacers,
wherein the doped channel region including the silicide region and the source/drain region provide electrical connection between the gate structure and the source/drain contact.
11. The integrated circuit structure of claim 10 , wherein the gate structure further includes a conductor over the silicide region.
12. The integrated circuit structure of claim 10 , wherein the at least a portion of the gate structure is disposed over a portion of a shallow trench isolation (STI) region.
13. The integrated circuit structure of claim 10 , wherein the integrated circuit structure is free from a gate contact directly to the gate structure.
14. The integrated circuit structure of claim 10 , wherein the gate structure directly contacts the silicide region.