Method for forming a lid structure for a semiconductor device package
A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a die structure formed over the substrate. The semiconductor device structure also includes a lid structure formed over the die structure. The lid structure includes a top portion with a top length and a bottom portion with a bottom length, and the top length is greater than the bottom length. The semiconductor device structure also includes a package layer formed between the lid structure and the die structure, and a sidewall of the bottom portion of the lid structure is not aligned with a sidewall of the die structure.
1. A method for forming a semiconductor device structure, the method comprising:
attaching a first die to a substrate;
attaching a lid to the first die with an adhesive, wherein after the attaching the lid to the first die the adhesive is in physical contact with at least a portion of a sidewall of the first die;
attaching a ring structure at a peripheral region of the substrate prior to the attaching the first die to the substrate; and
encapsulating the first die and the lid with an encapsulant, wherein after the encapsulating the encapsulant has at least three different widths as it extends from adjacent to the first die to adjacent to the lid.
2. The method of claim 1 , wherein the lid has a T-like shape.
3. The method of claim 1 , wherein after the attaching the lid an edge of the adhesive is aligned with an edge of the lid.
4. The method of claim 1 , further comprising attaching a second die to the first die.
5. The method of claim 1 , wherein the lid has at least one sloped sidewall.
6. The method of claim 1 , wherein the encapsulating the first die and the lid further comprises:
applying a first material;
curing the first material; and
applying a second material after the curing the first material.
7. The method of claim 1 , wherein the ring structure extends higher than the first die.
8. A method for forming a semiconductor device structure, the method comprising:
attaching a first die to a substrate;
attaching a second die to the substrate;
attaching a lid to both the first die and the second die with an adhesive, wherein the adhesive has at least one surface aligned with a sidewall of the first die and at least one surface aligned with a sidewall of the second die; and
after the attaching the lid, placing a molding material into a first space located directly between the first die and the lid and into a second space located directly between the second die and the lid.
9. The method of claim 8 , wherein the lid has a first surface in physical contact with the at least one surface aligned with the sidewall of the first die and a second surface in physical contact with the at least one surface aligned with the sidewall of the second die.
10. The method of claim 8 , wherein the adhesive has at least one surface misaligned with a sidewall of the first die.
11. The method of claim 10 , wherein the adhesive has at least one surface misaligned with a sidewall of the second die.
12. The method of claim 8 , wherein the lid has at least three different widths.
13. The method of claim 8 , further comprising singulating the substrate.
14. The method of claim 8 , wherein the lid has a flat top surface.
15. A semiconductor device comprising:
a first die;
a second die adjacent the first die;
a lid structure with a first portion and a second portion;
a first adhesive connecting the lid structure to the first die;
a second adhesive connecting the lid structure to the second die, wherein a third portion of the lid structure extends below a top surface of the first adhesive, and wherein the third portion of the lid structure extends continuously from a first sidewall of the first adhesive to a second sidewall of the second adhesive; and
a molding material in physical contact with each of the first die, the first portion, the second portion, and the first adhesive, wherein the molding material has a first width adjacent to the first portion, and a second width larger than the first width adjacent to the second portion.
16. The semiconductor device of claim 15 , wherein the first die is part of a chip scale package.
17. The semiconductor device of claim 16 , wherein the first die is part of a flip chip scale package.
18. The semiconductor device of claim 15 , wherein the first die is part of a flip chip ball grid array package.
19. The semiconductor device of claim 15 , wherein the first die is part of a two-and-a half dimension integrated circuit structure.
20. The semiconductor device of claim 15 , wherein the first die is part of a three-dimensional IC structure.