Semiconductor devices with post-probe configurability

1. A semiconductor device assembly, comprising:

a substrate;

a die coupled to the substrate, the die including:

a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element,

a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and

a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad;

wherein the substrate includes a substrate contact electrically coupled to the plated pad on the die, and

wherein the die further includes a fifth contact pad electrically coupled to a fifth circuit on the die including only passive circuit elements, and wherein the plated pad further electrically couples at least the part of the first contact pad and at least the part of the second contact pad to at least a part of the fifth contact pad, such that the substrate contact is electrically coupled to the fifth contact pad.

2. The semiconductor device assembly of claim 1 , wherein the die is a first die, further comprising:

a second die including:

a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and

a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements;

wherein the substrate contact is electrically coupled to the third contact pad on the second die.

3. The semiconductor device assembly of claim 2 , wherein the fourth contact pad on the second die is electrically disconnected from the substrate contact.

4. The semiconductor device assembly of claim 2 , wherein the second die further includes another plated pad electrically coupling at least a part of the third contact pad to at least a part of the fourth contact pad.

5. The semiconductor device assembly of claim 4 , wherein the first and second dies are identical dies, wherein the first contact pad on the first die corresponds to the third contact pad on the second die, and the second contact pad on the first die corresponds to the fourth contact pad on the second die.

6. The semiconductor device assembly of claim 2 , wherein the first and second dies are stacked in a shingled configuration.

7. The semiconductor device assembly of claim 1 , wherein the first circuit is a driver circuit.

8. The semiconductor device assembly of claim 1 , wherein the second circuit includes one or more capacitors to provide electrostatic discharge (ESD) protection.

9. The semiconductor device assembly of claim 1 , wherein the substrate contact is electrically coupled to the plated pad by a wirebond.

10. The semiconductor device assembly of claim 1 , wherein the die is a NAND memory die.