IP Library Granted Patent US 10,824,503
Granted Patent B2
US 10,824,503 · App. 15/812,949 · Granted Nov 3, 2020

Systems and methods for performing a write pattern in memory devices

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Quick Facts
Patent No.
US 10,824,503
App. No.
15/812,949
Granted
Nov 3, 2020
Kind
B2
Abstract

A semiconductor device may include a memory bank and a plurality of mode registers that communicatively couple to each of the plurality of memory banks. The plurality of mode registers may include a pattern of data stored therein. The semiconductor device may also include a bank control that receives a write pattern command that causes the bank control to write the pattern of data into the memory bank, send a signal to a multiplexer to couple the plurality of mode registers to the memory bank, and write the pattern of data to the memory bank via the plurality of mode registers.

Claims (19)

1. A semiconductor device comprising:

a memory bank;

a bank control associated with the memory bank;

a plurality of mode registers configured to communicatively couple to the memory bank, wherein the bank control is configured to:

receive a write pattern command and a parallel dataset associated with the write pattern command, wherein the write pattern command is configured to cause the bank control write the parallel dataset a plurality of times into the memory bank;

write the parallel dataset into the plurality of mode registers;

perform an error correction code (ECC) operation on the parallel dataset stored within the plurality of mode registers, thereby generating an error-corrected dataset stored within the plurality of mode registers;

store one or more parity bits in a latch circuit coupled to the plurality of mode registers; and

transmit the error-corrected dataset to the memory bank directly from the plurality of mode registers the plurality of times after performing the ECC operation.

2. The semiconductor device of claim 1 , comprising a deserializer component configured to:

receive serial data to be written into the plurality of mode registers;

convert the serial data into the parallel dataset; and

transmit a respective portion of the parallel dataset to a respective one of the plurality of mode registers.

3. The semiconductor device of claim 1 , wherein the bank control is configured to transmit the error-corrected dataset to the memory bank directly from the plurality of mode registers to the memory bank the plurality of times

without performing an additional ECC operation.

4. The semiconductor device of claim 1 , wherein the bank control is configured to control an operation of a multiplexer configured to transmit the error-corrected dataset to the memory bank.

5. The semiconductor device of claim 1 , wherein a first number of the plurality of mode registers is equal to a second number of a plurality of DQ inputs received via an input/output interface.

6. The semiconductor device of claim 1 , wherein each of the plurality of mode registers comprises a portion of the parallel dataset, wherein the portion of the parallel dataset comprises only zero values or only one values.

7. The semiconductor device of claim 1 , comprising a multiplexer configured to multiplex the error-corrected data to the memory bank via the plurality of mode registers or a second parallel dataset from a plurality of DQ inputs.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 7 TO PATENT SECURITY AGREEMENT Recorded Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2017
From: HOWE, GARY L.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 044153/0462 →