High aspect ratio electroplated structures and anisotropic electroplating processes
Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
1. A circuit comprising:
a substrate; and
at least one trace including a metal crown portion formed over at least a portion of the trace, the metal crown formed on a top surface and sidewalls of the portion of the trace, the metal crown having a final height to width aspect ratio greater than an initial height to width aspect ratio of the trace.
2. The circuit of claim 1 , wherein the circuit is formed on a flexure.
3. The circuit of claim 1 , wherein the metal crown portion is formed on a portion of the trace that is not over the substrate.
4. The circuit of claim 1 , wherein the metal crown portion is formed on the portion of the trace to tune the impedance of the trace.
5. A circuit comprising:
a substrate; and
at least one trace including a metal crown portion formed over at least a portion of the trace to mechanically strengthen the at least one trace, the metal crown formed on a top surface and sidewalls of the portion of the trace, the metal crown having a final height to width aspect ratio greater than an initial height to width aspect ratio of the trace.
6. The circuit of claim 5 , wherein the at least one trace including the metal crown portion formed over at least the portion of the trace to mechanically strengthen the at least one trace is strengthened for a bonding or joining operation.
7. The circuit of claim 5 , wherein the at least one trace is formed on a flexure.