Semiconductor device comprising oxide conductor
The reliability of a transistor including an oxide semiconductor can be improved by suppressing a change in electrical characteristics. A transistor included in a semiconductor device includes a first oxide semiconductor film over a first insulating film, a gate insulating film over the first oxide semiconductor film, a second oxide semiconductor film over the gate insulating film, and a second insulating film over the first oxide semiconductor film and the second oxide semiconductor film. The first oxide semiconductor film includes a channel region in contact with the gate insulating film, a source region in contact with the second insulating film, and a drain region in contact with the second insulating film. The second oxide semiconductor film has a higher carrier density than the first oxide semiconductor film.
1. A semiconductor device comprising:
an oxide semiconductor film including a channel region;
a gate insulating film over the oxide semiconductor film;
an oxide conductor over the gate insulating film;
a conductive film over the oxide conductor; and
a first insulating film over the oxide semiconductor film and the conductive film,
wherein the oxide conductor and the conductive film overlap the channel region,
wherein an upper end portion of the gate insulating film is aligned with a lower end portion of the oxide conductor or positioned outside the lower end portion of the oxide conductor,
wherein the first insulating film is in contact with a top surface of the oxide semiconductor film and a side surface of the oxide conductor, and
wherein the oxide conductor has a higher carrier density than the oxide semiconductor film.
2. The semiconductor device according to claim 1 , wherein the oxide conductor includes at least oxygen, In, Zn, and M (M is Al, Ga, Y, or Sn).
3. The semiconductor device according to claim 1 , wherein the first insulating film is in contact with top and side surfaces of the conductive film.
4. The semiconductor device according to claim 1 , wherein the first insulating film contains at least one of nitrogen and hydrogen.
5. The semiconductor device according to claim 1 , further comprising:
a second insulating film over the first insulating film; and
a source electrode and a drain electrode in contact with the oxide semiconductor film through a first opening in the first insulating film and the second insulating film.
6. The semiconductor device according to claim 1 , wherein the oxide semiconductor film includes at least oxygen, In, Zn, and M (M is Al, Ga, Y, or Sn).
7. The semiconductor device according to claim 1 ,
wherein at least one of the oxide semiconductor film and the oxide conductor contains a crystal part, and
wherein the crystal part has c-axis alignment.
8. A semiconductor device comprising:
a first conductive film;
a first insulating film over the first conductive film;
a first oxide semiconductor film over the first insulating film, the first oxide semiconductor film including a channel region;
a gate insulating film over the first oxide semiconductor film;
an oxide conductor over the gate insulating film;
a second conductive film over the oxide conductor; and
a second insulating film over the first oxide semiconductor film and the second conductive film,
wherein the oxide conductor and the second conductive film overlap the channel region,
wherein an upper end portion of the gate insulating film is aligned with a lower end portion of the oxide conductor or positioned outside the lower end portion of the oxide conductor, and
wherein the oxide conductor has a higher carrier density than the first oxide semiconductor film.
9. The semiconductor device according to claim 8 , wherein the oxide conductor includes at least oxygen, In, Zn, and M (M is Al, Ga, Y, or Sn).
10. The semiconductor device according to claim 8 , wherein the second insulating film is in contact with a top surface of oxide semiconductor film and a side surface of the oxide conductor.
11. The semiconductor device according to claim 8 , wherein the second insulating film is in contact with top and side surfaces of the second conductive film.
12. The semiconductor device according to claim 8 , wherein the first conductive film is connected to the oxide conductor through a first opening in the first insulating film and the gate insulating film.
13. The semiconductor device according to claim 8 , further comprising:
a second oxide semiconductor film over the first oxide semiconductor film.
14. The semiconductor device according to claim 13 , further comprising:
a third oxide semiconductor film over the second oxide semiconductor film.
15. The semiconductor device according to claim 8 , wherein the second insulating film contains at least one of nitrogen and hydrogen.
16. The semiconductor device according to claim 8 , further comprising:
a third insulating film over the second insulating film; and
a source electrode and a drain electrode in contact with the first oxide semiconductor film through a second opening in the second insulating film and the third insulating film.
17. The semiconductor device according to claim 8 , wherein the first oxide semiconductor film includes at least oxygen, In, Zn, and M (M is Al, Ga, Y, or Sn).
18. The semiconductor device according to claim 8 ,
wherein at least one of the first oxide semiconductor film and the oxide conductor contains a crystal part, and
wherein the crystal part has c-axis alignment.