Electronic device including vapor (two phase) chamber for absorbing heat
An electronic device according to an embodiment of the present disclosure includes a printed circuit board (PCB), a first component disposed in a first region on the PCB and a second component disposed in a second region on the PCB, and a chamber disposed on the first and second components and having a region including the first and second regions, in which fluid absorbing heat radiating from the first and second components is included in the chamber.
1. An electronic device comprising:
a housing comprising a metal part forming a surface of the electronic device;
a cover glass coupled to the housing, the cover glass together with at least the housing forming an inner space;
a metal bracket positioned in the inner space and connected to the metal part of the housing;
a display disposed between the metal bracket and the cover glass, the display disposed on a first side of the metal bracket;
a printed circuit board (PCB) disposed on a second side of the metal bracket;
a first component disposed on the PCB and a second component disposed on the PCB; and
a chamber comprising a first metal surface disposed on the first component and the second component, and a second metal surface disposed on the metal bracket; wherein the first metal surface includes a first region over and corresponding to the first component, and a second region over and corresponding to the second component, wherein the first and second regions of the chamber are spaced apart from each other,
a column-shaped powder is provided inside the chamber for serving as a passage through fluid, extending from the first metal surface toward the second metal surface; and
wherein the first metal surface, the powder, the second metal surface, the metal bracket, and the metal part of the housing form a heat dissipation path of a heat dissipating from the first component and the second component.
2. The electronic device of claim 1 , wherein the column-shaped powder is disposed on a surface of the internal space of the chamber.
3. The electronic device of claim 1 , further comprising:
a frame disposed on the PCB, and surrounding the first and second components,
wherein the chamber is disposed on the frame.
4. The electronic device of claim 3 , further comprising:
an adhesive layer disposed between the frame and the chamber for adhering the frame and the chamber together.
5. The electronic device of claim 3 , wherein the frame includes a plurality of holes,
wherein the chamber includes a plurality of projections in regions corresponding to the plurality of holes, and
wherein the plurality of holes and the plurality of projections are coupled together.
6. The electronic device of claim 1 , further comprising:
wherein the chamber is directly coupled with the metal bracket.
7. The electronic device of claim 1 , wherein the chamber comprises copper.
8. The electronic device of claim 1 , wherein the first component comprises an application processor (AP) and the second component comprises a memory.
9. An electronic device comprising:
a housing comprising a metal part forming a surface of the electronic device;
a cover glass coupled to the housing, the cover glass together with the housing forming an inner space;
a metal bracket positioned in the inner space;
a printed circuit board (PCB) disposed on a second side of the metal bracket;
a first component disposed on the PCB and a second component disposed on the PCB;
a frame disposed on the PCB and surrounding the first and second components;
a chamber comprising a first metal surface disposed on the first component and the second component, and a second metal surface disposed on the metal bracket; wherein the first metal surface includes a first region over and corresponding to the first component, and a second region over and corresponding to the second component, wherein the first and second regions of the chamber are spaced apart from each other;
wherein a portion of the second metal surface extends toward the PCB to surround at least a portion of the frame;
a liquid thermal interface material (TIM) disposed between the first component and the metal surface at the bottom of the chamber, for transferring heat radiated from the first component to the metal surface of the chamber;
a column-shaped powder is provided inside the chamber for serving as a passage through fluid, extending from the first metal surface toward the second metal surface; and
wherein the first metal surface, the powder, the second metal surface, the metal bracket, and the metal part of the housing form a heat dissipation path of a heat dissipating from the first component and the second component.
10. The electronic device of claim 9 , wherein the column-shaped powder is disposed on a surface of the first metal surface and on a surface of the second metal surface.
11. The electronic device of claim 9 , wherein the column-shaped powder is disposed as a plurality of columns on a surface of the first metal surface and supports the second metal surface.
12. The electronic device of claim 9 , further comprising: wherein the second metal surface is coupled with the metal bracket.
13. The electronic device of claim 9 , wherein the first and second metal surfaces comprise copper.
14. The electronic device of claim 9 , further comprising:
an adhesive layer disposed between the frame and the first metal surface for adhering the frame and the first metal surface together.
15. The electronic device of claim 9 , wherein the frame includes a plurality of holes,
wherein the first metal surface includes a plurality of projections in regions corresponding to the plurality of holes, and
wherein the plurality of holes and the plurality of projections are coupled together.
16. The electronic device of claim 9 , wherein the first component comprises an application processor (AP) and the second component comprises a memory.