Micro-lensed light emitting device
View Patent ↗A micro-lensed, light emitting device including, a backplane, light emitting diodes (LEDs) disposed on the backplane, an encapsulation layer encapsulating the LEDs, and micro-lenses disposed on the encapsulation layer and configured to reduce an emission angle of light emitted from the LEDs.
1. A micro-lensed, light emitting device, comprising:
a backplane;
light emitting diodes (LEDs) disposed on the backplane;
an encapsulation layer encapsulating the LEDs;
micro-lenses disposed on the encapsulation layer and configured to reduce an emission angle of light emitted from the LEDs;
conductive bonding structures located between the backplane and the LEDs, the conductive bonding structures operatively connected to a first side of the LEDs; and
conductive interconnect structures located in the encapsulation layer, the conductive interconnect structures operatively connected to a second side of the LEDs, wherein the second side is opposite the first side.
2. The device of claim 1 , wherein the device is configured such that each micro-lens receives at least 75% of light emitted from one of the LEDs.
3. The device of claim 1 , wherein the device is configured such that each micro-lens receives at least 75% of light emitted from at least three of the LEDs.
4. The device of claim 1 , further comprising an interlayer disposed between the encapsulation layer and the micro-lenses.
5. The device of claim 1 , wherein the encapsulation layer is transparent.
6. The device of claim 1 , wherein the conductive bonding structures are electrically attached to a circuitry located in the back plane.