IP Library Granted Patent US 10,410,928
Granted Patent B2
US 10,410,928 · App. 15/824,537 · Granted Sep 10, 2019

Homogeneous densification of fill layers for controlled reveal of vertical fins

Inventors: Kangguo Cheng (Schenectady, NY); Choonghyun Lee (Rensselaer, NY); Juntao Li (Albany, NY); Heng Wu (Guilderland, NY); Peng Xu (Santa Clara, CA)
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
H01L21/823481H01L21/31111H01L21/31133H01L21/76224H01L21/76237H01L21/823431H01L27/0886H01L29/0653H01L29/66795H01L29/7851
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Quick Facts
Patent No.
US 10,410,928
App. No.
15/824,537
Granted
Sep 10, 2019
Kind
B2
Abstract

In accordance with an embodiment of the present invention, a method of forming a densified fill layer is provided. The method includes forming a pair of adjacent vertical fins on a substrate, forming an inner liner on the sidewalls of the adjacent vertical fins, and forming a sacrificial layer on the inner liner. The method further includes forming a fill layer between the pair of adjacent vertical fins, wherein the fill layer is in contact with at least a portion of the sacrificial layer, removing at least a portion of the sacrificial layer in contact with the fill layer to form sidewall channels adjacent to the fill layer, and subjecting the fill layer to a densification process to form the densified fill layer.

Claims (30)

1. A method of forming a densified fill layer, comprising:

forming a pair of adjacent vertical fins on a substrate;

forming an inner liner on the sidewalls of the adjacent vertical fins;

forming a sacrificial layer on the inner liner;

forming a fill layer between the pair of adjacent vertical fins, wherein the fill layer is in contact with at least a portion of the sacrificial layer;

removing at least a portion of the sacrificial layer in contact with the fill layer to form sidewall channels adjacent to the fill layer; and

subjecting the fill layer to a densification process to form the densified fill layer subsequent to removing the at least a portion of the sacrificial layer.

2. The method of claim 1 , further comprising, forming a channel packing layer in the sidewall channels.

3. The method of claim 1 , wherein the densification process includes introducing a densification agent or densification agent precursor into the sidewall channels.

4. The method of claim 3 , wherein the fill layer is a flowable oxide, the densification process is a steam anneal, and the densification agent is gaseous water (H 2 O).

5. The method of claim 1 , wherein the inner liner is made of a material selected from the group consisting of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), silicon borocarbonitride (SiBCN), and a combination thereof.

6. The method of claim 5 , wherein the inner liner has a thickness in the range of about 3 nm to about 8 nm.

7. The method of claim 1 , wherein the sacrificial layer is made of a material selected from the group consisting of germanium dioxide (GeO 2 ) and amorphous carbon (a-C).

8. The method of claim 7 , wherein the sacrificial layer has a thickness in the range of about 2 nm to about 10 nm.

9. The method of claim 7 , further comprising, introducing a dopant into a portion of the sacrificial layer, wherein the sacrificial layer is germanium dioxide (GeO 2 ), and wherein a portion of the GeO 2 sacrificial layer remains undoped, wherein the undoped portion of the GeO 2 sacrificial layer is removed using deionized water (DI-H 2 O).

10. A method of controlling the revealed height of a plurality of vertical fins, comprising:

forming a plurality of vertical fins on a substrate;

forming an inner liner on the sidewalls of each of the plurality of vertical fins;

forming a sacrificial layer on the inner liner;

introducing a dopant into a portion of the sacrificial layer, wherein a portion of the sacrificial layer remains undoped;

forming a flowable oxide fill layer between each adjacent pair of the plurality of vertical fins, wherein the fill layer is in contact with the undoped portion of the sacrificial layer;

removing at least a portion of the undoped portion of the sacrificial layer in contact with the fill layer to form sidewall channels adjacent to the fill layer;

subjecting the fill layer to a densification process to form a densified fill layer; and

forming a channel packing layer in the sidewall channels.

11. The method of claim 10 , wherein the channel packing layer is made of a material selected from the group consisting of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), silicon borocarbonitride (SiBCN), silicon carbonitride (SiCN), silicon oxycarbide (SiOC), silicon borocarbide (SiBC), and combinations thereof.

12. The method of claim 11 , further comprising, reducing the height of the densified fill layer and the channel packing layer to expose an upper portion of the inner liner on the sidewalls of each of the plurality of vertical fins.

13. The method of claim 10 , further comprising, removing the inner liner on the sidewalls of each of the plurality of vertical fins.

14. The method of claim 13 , wherein the sidewall channels have a width in the range of about 5 nm to about 18 nm.

15. The method of claim 13 , further comprising, reducing the height of the densified fill layer and the channel packing layer to expose an upper portion of each of the plurality of vertical fins.

16. The method of claim 15 , further comprising, forming a gate structure on the exposed upper portion of each of the plurality of vertical fins.

Assignments (5)
CHANGE OF NAME Recorded Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0439 →
CHANGE OF NAME Recorded Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0823 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2017
From: CHENG, KANGGUO; LEE, CHOONGHYUN; LI, JUNTAO; WU, HENG; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044238/0794 →
Continuity (1)
Related Publication 20190164843A1 · May 30, 2019