IP Library Granted Patent US 10,096,358
Granted Patent B2
US 10,096,358 · App. 15/832,557 · Granted Oct 9, 2018

Semiconductor memory device which stores plural data in a cell

Inventors: Noboru Shibata (Kawasaki, JP); Tomoharu Tanaka (Yokohama, JP)
Assignee: TOSHIBA MEMORY CORPORATION
G11C11/5628G11C11/5642G11C16/0483G11C16/10G11C16/12G11C16/3454G11C16/3459G11C2211/5621G11C2211/5648
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Quick Facts
Patent No.
US 10,096,358
App. No.
15/832,557
Granted
Oct 9, 2018
Kind
B2
Abstract

A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage.

Claims (17)

1. A semiconductor memory device, comprising:

a memory cell array including a plurality of memory cells, each of the memory cells being connected to a word line and a bit line and being capable of storing data based on first to n-th threshold voltages is a natural number equal to or larger than 3) which are higher in order; and

a control circuit which controls potentials of the word line and bit line according to input data and which writes data to the memory cell, wherein

the control circuit writes one of the first to n-th threshold voltages to the memory cell by performing h write operations (h is a natural number),

each of the h write operations including a plurality of program operations and a program voltage is applied to the word line in each of the program operations,

in a first program operation of the h-th write operation, the control circuit writes k threshold voltages (k is a natural number less than n) of the n-th threshold voltage to k memo cells of the plurality of memory cells, the k threshold voltages including each of (n−1)-th threshold voltage, . . . , to (n−k+1)-th threshold voltage, and

in a second program operation of the h-th write operation, the control circuit writes threshold voltages to memory cells of the plurality of memory cells, each threshold voltage of the threshold voltages being equal to or lower than an (n−k)-th threshold voltage.

2. The semiconductor memory device according to claim 1 , wherein the memory cells constitute a NAND flash memory.

3. A semiconductor memory device, comprising:

a memory cell array including a plurality of memory cells, each of the memory cells being connected to a word line and a bit line and being capable of storing data based on first to n-th threshold voltages (n is a natural number equal to or larger than 3) which are higher in order; and

a control circuit which controls potentials of the word line and bit line according to input data and which writes data to the memory cell, wherein

the control circuit writes one of the first to n-th threshold voltages to the memory cell by performing h write operations (h is a natural number),

each of the h write operations including a plurality of program operations and a program voltage is applied to the word line in each of the program operations,

in a first program operation of the h-th write operation, the control circuit writes k1 threshold voltages (k1 is a natural number smaller than n) of the n-th threshold voltage to k1 memory cells of the plurality of memory cells, the k1 threshold voltages including each of (n−1)-th threshold voltage, . . . to (n−k1+1)-th threshold voltage,

in a second program operation of the h-th write operation, the control circuit writes k2 threshold voltages (k2 is a natural number smaller than n) to k2 memory cells of the plurality of memory cells, the k2 threshold voltages including each of the (n−k1)-th threshold voltage, (n−k1−1)-th threshold voltage, . . . , to (n−k1−k2+1)-th threshold voltage, and

in an i-th program operation (i is a natural number equal to or larger than 3) of the h-th write operation, the control circuit writes (ki−1) threshold voltages (ki≥k2, and ki is a natural number smaller than n) to (ki−1) memory cells of the plurality of memory cells, the (ki−1) threshold voltages including each of the ki-th threshold voltage, (ki−1)-th threshold voltage, . . . , to a second threshold voltage.

4. The semiconductor memory device according to claim 3 , wherein the memory cells constitute a NAND flash memory.

Assignments (3)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
Priority Claims (2)
JP 2004-024475 · Jan 30, 2004 · national
JP 2004-160165 · May 28, 2004 · national
Continuity (11)
Continuation 15453302 · Mar 8, 2017
Continuation 15175806 · Jun 7, 2016
Continuation 14825858 · Aug 13, 2015
Continuation 14017611 · Sep 4, 2013
Continuation 13754057 · Jan 30, 2013
Continuation 13413779 · Mar 7, 2012
Division 12775571 · May 7, 2010
Continuation 12117767 · May 9, 2008
Division 11759627 · Jun 7, 2007
Division 10988592 · Nov 16, 2004
Related Publication 20180096723A1 · Apr 5, 2018