Method of selectively etching first region made of silicon nitride against second region made of silicon oxide

1. A method of etching a first region made of silicon nitride selectively against a second region made of silicon oxide, comprising:

preparing a processing target object having the first region and the second region within a chamber provided in a chamber main body of a plasma processing apparatus;

generating plasma of a first gas including a gas containing hydrogen within the chamber to form a modified region by modifying a part of the first region with active species of the hydrogen; and

generating plasma of a second gas including a gas containing fluorine within the chamber to remove the modified region with active species of the fluorine,

wherein the processing target object further has a third region made of silicon, and

the first gas further includes a gas containing oxygen.

2. The method of claim 1 ,

wherein the first region is provided to cover the second region and the third region.

3. The method of claim 1 ,

wherein a flow rate ratio of the gas containing oxygen in the first gas to the gas containing hydrogen in the first gas is set to be in a range from 3/100 to 9/100.

4. The method of claim 1 ,

wherein the gas containing oxygen is an O 2 gas.

5. The method of claim 1 ,

wherein the second gas further contains oxygen.

6. The method of claim 1 ,

wherein the second gas further contains hydrogen.

7. The method of claim 1 ,

wherein in the generating of the plasma of the first gas, a bias power is supplied to a stage configured to hold the processing target object mounted thereon, and a high frequency power is supplied to an inductively coupled plasma antenna.

8. The method of claim 1 ,

wherein in the generating of the plasma of the second gas, a high frequency power is supplied to an inductively coupled plasma antenna.

9. The method of claim 1 ,

wherein in the generating of the plasma of the first gas, a bias power is supplied to a stage which is configured to hold the processing target object mounted thereon.

10. The method of claim 9 ,

wherein in the generating of the plasma of the second gas, a high frequency power is supplied to an inductively coupled plasma antenna.

11. A method of etching a first region made of silicon nitride selectively against a second region made of silicon oxide, comprising:

preparing a processing target object having the first region and the second region within a chamber provided in a chamber main body of a plasma processing apparatus;

generating plasma of a first gas including a gas containing hydrogen within the chamber to form a modified region by modifying a part of the first region with active species of the hydrogen; and

generating plasma of a second gas including a gas containing fluorine within the chamber to remove the modified region with active species of the fluorine,

wherein a plurality of sequences each of which includes the generating of the plasma of the first gas and the generating of the plasma of the second gas are performed in sequence,

the processing target object further has a third region made of silicon,

the first region is provided to cover the second region and the third region before the plurality of sequences are performed,

the plurality of sequences include one or more first sequences performed until a time immediately before the third region is exposed or until the third region is exposed; and one or more second sequences performed to oxidize a surface of the third region after the one or more first sequences, and

the first gas further includes a gas containing oxygen in at least one second sequence.

12. The method of claim 11 ,

wherein the first gas does not contain the gas containing oxygen in the one or more first sequences.

13. The method of claim 11 ,

wherein the plurality of sequences further include one or more third sequences performed after the one or more second sequences, and

the first gas does not include the gas containing oxygen in the one or more third sequences.