Phase change memory element
A phase-change memory element is provided. The phase-change memory element may include an electrode; a phase-change material that contacts the electrode; a first conductor that contacts the phase-change material; and a second conductor that contacts the phase-change material. The second conductor may be electrically connected to the first conductor only through the phase-change material, and each of the first and second conductors may be electrically connected to the electrode only through the phase-change material.
1. A phase-change memory, comprising:
a plurality of electrodes;
a phase-change material that contacts the plurality of electrodes; and
at least one conductor that contacts the phase-change material;
wherein the at least one conductor is electrically connected to the plurality of electrodes only through the phase-change material.
2. The phase-change memory of claim 1 , wherein the plurality of electrodes are co-planar and formed on a substrate.
3. The phase-change memory of claim 1 , wherein the plurality of electrodes are formed on a dielectric layer that is formed on a substrate.
4. The phase-change memory of claim 1 , further comprising a dielectric layer formed on sidewalls of each electrode of the plurality of electrodes.
5. The phase-change memory of claim 1 , wherein the at least one conductor comprises a plurality of conductors.
6. The phase-change memory of claim 5 , wherein the plurality of conductors comprises four conductors.
7. The phase-change memory of claim 1 , wherein a first electrode of the plurality of electrodes is formed above a second electrode of the plurality of electrodes.
8. The phase-change memory of claim 1 , wherein the phase change material comprises In, Ge, Sb, Te, Ga, Sn, or combinations thereof.
9. The phase-change memory of claim 1 , wherein the plurality of electrodes comprises Al, W, Mo, Ti, TiN, TiAlN, TiW, or TaN.
10. The phase-change memory of claim 1 , further comprising:
a substrate below the plurality of electrodes; and
a transistor formed on a surface of the substrate, wherein a source or a drain of the transistor is electrically connected to an electrode of the plurality of electrodes.
11. The phase-change memory of claim 10 , wherein at least a portion of the transistor is located below the surface of the substrate.
12. The phase-change memory of claim 1 , further comprising:
a substrate below the plurality of electrodes; and
a diode formed on a surface of the substrate, wherein a terminal of the diode is electrically connected to an electrode of the plurality of electrodes.
13. The phase-change memory of claim 1 , further comprising:
a substrate below the plurality of electrodes; and
a complementary metal oxide semiconductor (CMOS) circuit formed on a surface of the substrate, wherein a terminal of the CMOS circuit is electrically connected to an electrode of the plurality of electrodes.
14. The phase-change memory of claim 1 , wherein an electrode of the plurality of electrodes is electrically connected to a bit line via a metal plug.
15. The phase-change memory of claim 1 , wherein the at least one conductor comprises a pair of conductors, and wherein a first conductor of the pair of conductors is electrically connected to a second conductor of the pair of conductors only through the phase-change material.
16. The phase-change memory of claim 15 , wherein the pair of conductors comprises a first pair of conductors, wherein the at least one conductor further comprises a second pair of conductors, and wherein a first conductor of the second pair of conductors is electrically connected to a second conductor of the second pair of conductors only through the phase-change material.
17. The phase-change memory of claim 1 , wherein the at least one conductor comprises a plurality of conductors, wherein a first conductor of the plurality of conductors has a first shape and a second conductor of the plurality of conductors has a second shape that is different than the first shape, and wherein the first conductor is electrically connected to the second conductor only through the phase-change material.
18. The phase-change memory of claim 17 , wherein the first shape includes a pointed top.
19. The phase-change memory of claim 17 , wherein a memory cell corresponding to the plurality of conductors comprises a multi-level memory cell.
20. The phase-change memory of claim 1 , wherein a portion of the phase-change material is located between a conductor of the at least one conductor and an electrode of the plurality of electrodes.