IP Library Granted Patent US 10,546,632
Granted Patent B2
US 10,546,632 · App. 15/842,496 · Granted Jan 28, 2020

Multi-level self-selecting memory device

Inventors: Andrea Redaelli (Casatenovo, IT); Innocenzo Tortorelli (Cernusco sul Naviglio, IT); Agostino Pirovano (Milan, IT); Fabio Pellizzer (Boise, ID)
Assignee: Micron Technology, Inc.
G11C11/5678G11C13/0004G11C13/004G11C13/0069H01L45/141G11C13/0002G11C13/0007G11C2213/30G11C2213/31G11C2213/71
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Quick Facts
Patent No.
US 10,546,632
App. No.
15/842,496
Granted
Jan 28, 2020
Kind
B2
Abstract

Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

Claims (39)

1. A method, comprising:

determining a desired logic state of a self-selecting memory cell, the desired logic state representing more than one bit of data, wherein the self-selecting memory cell comprises a chalcogenide alloy, a first side of the chalcogenide alloy interfacing with a first electrode and a second side of the chalcogenide alloy interfacing with a second electrode, and wherein the desired logic state of the self-selecting memory cell is associated with a threshold voltage distribution and the threshold voltage distribution of the self-selecting memory cell is set based at least in part on a local composition of the chalcogenide alloy;

determining a polarity and an amplitude of a programming pulse based at least in part on the desired logic state of the self-selecting memory cell;

applying the programming pulse to the self-selecting memory cell based at least in part on determining the polarity and the amplitude of the programming pulse; and

modifying the local composition of the chalcogenide alloy by establishing an electric field across the chalcogenide alloy and heating the chalcogenide alloy based at least in part on the polarity and the amplitude of the programming pulse.

2. The method of claim 1 , wherein at least one part of the chalcogenide alloy includes silicon (Si), selenium (Se), arsenic (As), or germanium (Ge), the method further comprising:

producing a net movement of the at least one part under the electric field to alter the local composition of the chalcogenide alloy based at least in part on applying the programming pulse to the self-selecting memory cell.

3. The method of claim 1 , wherein the programming pulse comprises a voltage difference applied to the self-selecting memory cell or a current flowing through the self-selecting memory cell.

4. The method of claim 1 , further comprising:

determining the polarity of the programming pulse based at least in part on a present state of the self-selecting memory cell and the desired logic state of the self-selecting memory cell.

5. The method of claim 1 , further comprising:

setting a voltage amplitude of the programming pulse having a polarity to be maintained during one or more durations; or

setting a current amplitude of the programming pulse associated with a first electrode during one or more durations.

6. The method of claim 1 , further comprising:

determining the polarity or the amplitude of the programming pulse based at least in part on a current logic state of the self-selecting memory cell and the desired logic state of the self-selecting memory cell, wherein the polarity and the amplitude define a shape of the programming pulse.

7. The method of claim 1 , wherein the programming pulse comprises:

a first voltage amplitude having a first polarity;

a second voltage amplitude having the first polarity;

the first voltage amplitude having a second polarity; or

the second voltage amplitude having the second polarity.

8. The method of claim 1 , wherein the programming pulse comprises:

a first current amplitude of a current flowing from a first electrode;

a second current amplitude of the current flowing from the first electrode;

the first current amplitude of a current flowing to the first electrode; or

the second current amplitude of the current flowing to the first electrode.

9. A memory device, comprising:

a cross-point memory array comprising self-selecting memory cells;

a controller coupled with the cross-point memory array, the controller being operable to:

determine a desired logic state of the self-selecting memory cell, the desired logic state representing more than one bit of data, wherein the self-selecting memory cell comprises a chalcogenide alloy, a first side of the chalcogenide alloy interfacing with a first electrode and a second side of the chalcogenide alloy interfacing with a second electrode, wherein the desired logic state of the self-selecting memory cell is associated with a threshold voltage distribution and the threshold voltage distribution of the chalcogenide alloy;

determine a polarity and an amplitude of a programming pulse based at least in part on the desired logic state of the self-selecting memory cell;

apply the programming pulse to the self-selecting memory cell based at least in part on determining the polarity and the amplitude of the programming pulse; and

modify a local composition of the chalcogenide alloy by establishing an electric field across the chalcogenide alloy and heating the chalcogenide alloy based at least in part on the polarity and the amplitude of the programming pulse.

10. The memory device of claim 9 , wherein the controller is further operable to:

determine the polarity of the programming pulse based at least in part on a present state of the self-selecting memory cell and the desired logic state of the self-selecting memory cell.

11. The memory device of claim 9 , wherein the controller is further operable to:

set a voltage amplitude of the programming pulse having a polarity to be maintained during one or more durations; or

set a current amplitude of the programming pulse associated with an electrode during one or more durations.

12. The memory device of claim 11 , further comprising:

a periphery circuit that produces the polarity of the programming pulse.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2018
From: REDAELLI, ANDREA; TORTORELLI, INNOCENZO; PIROVANO, AGOSTINO; PELLIZZER, FABIO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047901/0913 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 7 TO PATENT SECURITY AGREEMENT Recorded Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Continuity (1)
Related Publication 20190189203A1 · Jun 20, 2019
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