Multi-band antenna package structure, manufacturing method thereof and communication device
A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.
1. A multi-band antenna package structure, comprising:
a first redistribution layer, comprising a first dielectric material layer and first metal patterns formed in openings of the first dielectric material layer;
an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns, and the metal pillar is electrically connected to the integrated circuit chip and one of the first metal patterns;
a second redistribution layer, formed on the integrated circuit layer, comprising a second dielectric material layer and second metal patterns formed in openings of the second dielectric material layer, wherein the metal via is electrically connected to one of the second metal patterns;
a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit; and
a first shielding layer, formed between the first antenna unit layer and the second redistribution layer, comprising a second dielectric layer and fourth metal patterns formed in openings of the second dielectric layer, wherein the fourth metal patterns are electrically connected to the third metal patterns and portions of the second metal patterns.
2. The multi-band antenna package structure according to claim 1 , wherein the integrated circuit chip comprises a second antenna unit disposed on an integrated circuit of the integrated circuit chip.
3. The multi-band antenna package structure according to claim 1 , further comprising:
a first protection layer, wherein the first redistribution layer is disposed on the first protection layer;
a second protection layer, formed on the first antenna unit layer; and
bump balls, wherein the multi-band antenna package structure is mounted on a substrate through the bump balls.
4. The multi-band antenna package structure according to claim 1 , wherein the first antenna unit is a multiple input multiple output phase antenna.
5. The multi-band antenna package structure according to claim 1 , wherein the integrated circuit chip has a height the same as that of the metal via, or alternatively less than that of the metal via.
6. The multi-band antenna package structure according to claim 1 , further comprising:
a second antenna unit layer, comprising a third dielectric layer and fifth metal patterns formed in openings of the third dielectric layer, wherein at least one of the fifth metal patterns is electrically connected to one of the first metal patterns, the fifth metal patterns form a second antenna unit, and the second redistribution layer is formed on the second antenna unit layer.
7. The multi-band antenna package structure according to claim 6 , further comprising:
a second shielding layer, formed between the second antenna unit layer and the second redistribution layer, comprising a fourth dielectric layer and sixth metal patterns formed in openings of the fourth dielectric layer, wherein the sixth metal patterns are electrically connected to the fifth metal patterns and portions of the first metal patterns.
8. The multi-band antenna package structure according to claim 7 , further comprising:
a first protection layer, wherein the first redistribution layer is disposed on the first protection layer;
a second protection layer, formed on the first antenna unit layer; and
bump balls, wherein the multi-band antenna package structure is mounted on a substrate through the bump balls.
9. The multi-band antenna package structure according to claim 6 , wherein the second antenna unit is a multiple input multiple output phase antenna.
10. A communication device, comprising:
a multi-band antenna package structure, comprising:
a first redistribution layer, comprising a first dielectric material layer and first metal patterns formed in openings of the first dielectric material layer;
an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns, and the metal pillar is electrically connected to the integrated circuit chip and one of the first metal patterns;
a second redistribution layer, formed on the integrated circuit layer, comprising a second dielectric material layer and second metal patterns formed in openings of the second dielectric material layer, wherein the metal via is electrically connected to one of the second metal patterns;
a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit; and
a first shielding layer, formed between the first antenna unit layer and the second redistribution layer, comprising a second dielectric layer and fourth metal patterns formed in openings of the second dielectric layer, wherein the fourth metal patterns are electrically connected to the third metal patterns and portions of the second metal patterns;
wherein the integrated circuit is a processing circuit, and the integrated circuit chip has a second antenna unit on the integrated circuit, or alternatively the integrated circuit chip does not have the second antenna unit, but the multi-band antenna package structure further comprises:
a second antenna unit layer, comprising a third dielectric layer and fifth metal patterns formed in openings of the second dielectric layer, wherein at least one of the fourth metal patterns is electrically connected to one of the first metal patterns, the fourth metal patterns form a second antenna unit, and the first redistribution layer is formed on the second antenna unit layer.
11. The communication device according to claim 10 , wherein the communication device is an encrypted communication device or a frequency conversion device.