Freezing a sacrificial material in forming a semiconductor
The present disclosure includes apparatuses and methods related to freezing a sacrificial material in forming a semiconductor. In an example, a method may include solidifying, via freezing, a sacrificial material in an opening of a structure, wherein the sacrificial material has a freezing point below a boiling point of a solvent used in a wet clean operation and removing the sacrificial material via sublimation by exposing the sacrificial material to a particular temperature range.
1. A method for forming a semiconductor device, comprising:
displacing a solvent used in a wet clean operation in an opening of a structure with a sacrificial material at a wet cleaning tool, wherein the sacrificial material is applied above room temperature, and wherein the sacrificial material has a freezing point below a boiling point of the solvent;
solidifying, via freezing, the sacrificial material in the opening of the structure at the wet cleaning tool, wherein the sacrificial material includes naphthalene and the freezing point of the sacrificial material is between 30 and 60 degrees Celsius;
exposing the structure with the sacrificial material to oxygen after solidifying the sacrificial material and prior to removing the sacrificial material via sublimation in response to moving the structure from the wet cleaning tool to a deposition tool; and
removing the sacrificial material via sublimation by exposing the sacrificial material to a particular temperature range at the deposition tool.
2. The method of claim 1 , wherein solidifying the sacrificial material obstructs the opening of the structure.
3. The method of claim 1 , wherein solidifying the sacrificial material includes cooling the sacrificial material below its freezing point.
4. The method of claim 1 , wherein the sacrificial material is a camphor and naphthalene mixture.
5. The method of claim 1 , wherein solidifying the sacrificial material prevents pattern collapse while the structure dries.
6. A method for forming a semiconductor device, comprising:
forming a plurality of features in a structure at a dry etch tool;
performing a wet clean operation on the structure using a solvent at a wet cleaning tool;
displacing the solvent with a sacrificial material at the wet cleaning tool, wherein the sacrificial material is applied above room temperature, and wherein the sacrificial material has a freezing point below a boiling point of the solvent;
solidifying, via freezing, the sacrificial material in openings of the plurality of features at the wet cleaning tool, wherein the sacrificial material includes camphor and the freezing point of the sacrificial material is between 30 and 60 degrees Celsius;
exposing the structure with the sacrificial material to oxygen after solidifying the sacrificial material and prior to removing the sacrificial material via sublimation in response to moving the structure from the wet cleaning tool to a deposition tool; and
removing the sacrificial material via sublimation by exposing the sacrificial material to a particular temperature range at the deposition tool.
7. The method of claim 6 , wherein the sacrificial material is a eutectic mixture.
8. A method for forming a semiconductor device, comprising:
forming a plurality of features in a structure at a dry etch tool;
performing a wet clean operation on the structure using a solvent at a wet cleaning tool;
displacing the solvent with a sacrificial material at the wet cleaning tool, wherein the sacrificial material is applied above room temperature, and wherein the sacrificial material has a freezing point below a boiling point of the solvent;
solidifying, via freezing, the sacrificial material in an opening of the plurality of features at the wet cleaning tool, wherein the sacrificial material is a camphor and naphthalene mixture and the freezing point of the sacrificial material is between 30 and 60 degrees Celsius;
exposing the structure with the sacrificial material to oxygen after solidifying the sacrificial material and prior to removing the sacrificial material via sublimation in response to moving the structure from the wet cleaning tool to a deposition tool; and
removing the sacrificial material via sublimation by exposing the sacrificial material to a particular temperature range at the deposition tool.
9. The method of claim 8 , wherein the freezing point of the sacrificial material is above a temperature at which sublimation occurs.
10. The method of claim 8 , wherein the freezing point of the sacrificial material is below the boiling point of the solvent to prevent the solvent from boiling.
11. The method of claim 8 , wherein vapor bubbles form when the solvent boils.
12. The method of claim 11 , wherein the vapor bubbles cause pattern collapse.
13. The method of claim 8 , wherein the solvent is isopropyl alcohol (IPA).