Semiconductor devices having electrically and optically conductive vias, and associated systems and methods

1. A semiconductor device, comprising:

a first semiconductor die having a first optical component for receiving and/or transmitting optical signals;

a second semiconductor die adjacent to the first semiconductor die and having a second optical component for receiving and/or transmitting optical signals; and

a via extending at least between the first optical component and the second optical component, the via having a transparent and electrically conductive material disposed therein, wherein the transparent and electrically conductive material (a) optically couples the first and second optical components and (b) electrically couples the first and second semiconductor dies.

2. The semiconductor device of claim 1 wherein the first and second optical components are at least one of an optical transceiver, a photodiode, or a light emitting diode.

3. The semiconductor device of claim 1 wherein the first and second optical components comprise a semiconductor material.

4. The semiconductor device of claim 1 wherein the via extends entirely through a substrate of the first semiconductor die.

5. The semiconductor device of claim 1 wherein the first optical component is (a) positioned off an optical axis of the via and (b) optically coupled to the transparent and electrically conductive material by an optical element.

6. The semiconductor device of claim 1 wherein the second optical component is axially aligned with the via, and wherein an end portion of the via abuts the second optical component.

7. The semiconductor device of claim 1 wherein the transparent and electrically conductive material is indium tin oxide.

8. The semiconductor device of claim 1 wherein the first optical component is formed on a first surface of a semiconductor substrate of the first semiconductor die, and wherein the second optical component is formed on a second surface of a semiconductor substrate of the second semiconductor die.

9. The semiconductor device of claim 1 wherein the first optical component is formed at least partially in a recess of a semiconductor substrate of the first semiconductor die, and wherein the second optical component is formed at least partially in a recess of a semiconductor substrate of the second semiconductor die.

10. The semiconductor device of claim 1 wherein the via further includes an insulating material disposed at least partially between the transparent and electrically conductive material and the a semiconductor material of the first and second semiconductor dies.

11. The semiconductor device of claim 1 wherein the transparent and electrically conductive material is electrically coupled to one of a power supply or a ground.

12. The semiconductor device of claim 4 wherein the second semiconductor die is stacked over the first semiconductor die.

13. The semiconductor device of claim 5 wherein the optical element is at least one of a waveguide or a diffraction grating.

14. The semiconductor device of claim 8 wherein the first and second surfaces face the same direction, and wherein the via extends entirely through the semiconductor substrates of the first and second semiconductor dies.

15. The semiconductor device of claim 8 wherein the first and second surfaces face each other, wherein the second optical component is superimposed over the first optical component, and wherein the via is axially aligned with the first and second optical components.

16. The semiconductor device of claim 10 wherein the insulating material is silicon nitride.

17. The semiconductor device of claim 10 wherein the insulating material has a lower index of refraction than the transparent and electrically conductive material.

18. A method of forming a semiconductor device, comprising:

positioning a first semiconductor die adjacent to a second semiconductor die;

forming a via extending at least partially through the first and second semiconductor dies;

disposing a transparent and electrically conductive material in the via, wherein the transparent and electrically conductive material optically couples the first semiconductor die to the second semiconductor die; and

electrically coupling the transparent and electrically conductive material to one of a power supply or a ground.

19. The method of claim 18 , further comprising:

forming a first optical component on the first semiconductor die; and

forming a second optical component on the second semiconductor die, wherein the via extends at least between the first and second optical components.

20. The method of claim 18 wherein forming the via further includes:

forming a first via extending at least partially through the first semiconductor die;

forming a second via extending at least partially through the second semiconductor die; and

wherein positioning the first semiconductor die adjacent to the second semiconductor die includes axially aligning the first and second vias.

21. The method of claim 18 , further comprising:

before disposing the transparent and electrically conductive material in the via, forming an electrically insulative material along at least a portion of a sidewall of the via.

22. The method of claim 19 wherein forming the first optical component includes forming a first epitaxial semiconductor material on a substrate of the first semiconductor die, and wherein forming the second optical component includes forming a second epitaxial semiconductor material on a substrate of the second semiconductor die.

23. The method of claim 19 , further comprising:

forming a first connection structure on a surface of a substrate of the first semiconductor die, wherein the first connection structure electrically couples a first circuit of the first semiconductor die to the transparent and electrically conductive material; and

forming a second connection structure on a surface of a substrate of the second semiconductor die, wherein the second connection structure electrically couples a second circuit of the second semiconductor die to the transparent and electrically conductive material.

24. The method of claim 20 wherein disposing the transparent and electrically conductive material in the via includes, before positioning the first semiconductor die adjacent to the second semiconductor die, disposing the transparent and electrically conductive material in the first via and the second via.

25. A semiconductor device, comprising:

a stack of semiconductor dies, each semiconductor die including an optical component configured to receive and/or transmit optical signals; and

a via extending at least partially through the stack of semiconductor dies and having an optically and electrically conductive material disposed therein, wherein the optically and electrically conductive material (a) optically couples the optical components of the semiconductor dies and (b) electrically couples the semiconductor dies to one of a power source or a ground.

26. The semiconductor device of claim 25 wherein the optical component of each semiconductor die is an optical transceiver formed from a semiconductor material.

27. The semiconductor device of claim 25 wherein the stack of semiconductor dies includes a pair of adjacent semiconductor dies arranged front-to-front, and wherein the via extends entirely through a connection structure of each semiconductor die of the pair of adjacent semiconductor dies.

28. The semiconductor device of claim 25 wherein the stack of semiconductor dies includes an uppermost semiconductor die and a plurality of lower semiconductor dies, and wherein the via extends entirely through the lower semiconductor dies.