Thermal insulation for three-dimensional memory arrays
Methods, systems, and devices for a three-dimensional memory array are described. Memory cells may transform when exposed to elevated temperatures, including elevated temperatures associated with a read or write operation of a neighboring cell, corrupting the data stored in them. To prevent this thermal disturb effect, memory cells may be separated from one another by thermally insulating regions that include one or several interfaces. The interfaces may be formed by layering different materials upon one another or adjusting the deposition parameters of a material during formation. The layers may be created with planar thin-film deposition techniques, for example.
1. A method of forming a three dimensional memory array, comprising:
forming a stack comprising a set of conductive layers, wherein:
each conductive layer of the set of conductive layers is separated from an adjacent conductive layer of the set of conductive layers by a set of layers, the adjacent conductive layer having a first thermal resistance and the set of layers having a second thermal resistance greater than the first thermal resistances;
the set of layers comprises at least two layers that comprise a first electrically insulating material;
the set of layers comprises at least one layer that comprises a second material that is different from the first electrically insulating material; and
the second material comprises at least one of a metal, a metal alloy, carbon, or a compound comprising silicon and nitrogen;
forming a via through the stack, wherein at least a portion of the via passes through each conductive layer of the set of conductive layers;
forming a recess in at least one conductive layer of the set of conductive layers, wherein the recess is adjacent the via; and
forming a memory cell within the recess.
2. The method of claim 1 , wherein forming the set of layers comprises:
forming a first electrically insulating layer that comprises the first electrically insulating material having a first stoichiometry; and
forming a second electrically insulating layer positioned on top of the first electrically insulating layer, wherein the second electrically insulating layer comprises the first electrically insulating material having a second stoichiometry that is different from the first stoichiometry.
3. The method of claim 2 , further comprising:
forming the first electrically insulating layer using a reactant in a first concentration; and
forming the second electrically insulating layer using the reactant in a second concentration that is different from the first concentration.
4. The method of claim 1 , wherein the set of layers comprises at least three layers that each comprise the first electrically insulating material.
5. The method of claim 4 , wherein forming the set of layers comprises:
forming a first electrically insulating layer that comprises the first electrically insulating material having a first stoichiometry;
forming a second electrically insulating layer positioned on top of the first electrically insulating layer, wherein the second electrically insulating layer comprises the first electrically insulating material having a second stoichiometry that is different from the first stoichiometry; and
forming a third electrically insulating layer positioned on top of the second electrically insulating layer, wherein the third electrically insulating layer comprises the first electrically insulating material having a third stoichiometry that is different from the second stoichiometry.
6. The method of claim 5 , wherein the third stoichiometry is different from the first stoichiometry.
7. The method of claim 1 , wherein the first electrically insulating material comprises an electrically insulating oxide material.
8. The method of claim 1 , wherein forming the set of layers comprises:
forming a first electrically insulating layer that comprises the first electrically insulating material;
forming a second layer positioned on top of the first electrically insulating layer, wherein the second layer comprises the second material; and
forming a third layer positioned on top of the second layer, wherein the third layer comprises the first electrically insulating material.
9. The method of claim 1 , wherein forming the stack, the set of layers, and the memory cell comprises:
depositing material using one of chemical vapor deposition, metal-organic chemical vapor deposition, physical vapor deposition, or atomic layer deposition.
10. The method of claim 1 , further comprising:
forming a first conductive element on a surface of the via, wherein the first conductive element is coupled to the memory cell;
forming an intervening component on a surface of the first conductive element in the via, wherein the intervening component is coupled to the first conductive element; and
forming a second conductive element, wherein the second conductive element fills a remainder of the via and is coupled to the intervening component.
11. The method of claim 1 , further comprising:
forming an intervening material on the memory cell, wherein both the intervening material and the memory cell are formed within the recess;
forming an intervening component on a surface of the via, wherein the intervening component is coupled to the intervening material and the intervening material separates the intervening component and the memory cell; and
forming a conductive element, wherein the conductive element fills a remainder of the via and is coupled to the intervening component.
12. The method of claim 1 , further comprising:
forming a conductive element in the via, wherein the conductive element fills an entirety of the via and is coupled to the memory cell; and
forming an end component at an end of the conductive element and coupled to the conductive element, wherein the end component comprises one of a diode, a bipolar junction device, an ovonic threshold selector, a field effect transistor, or a chalcogenide material.
13. The method of claim 1 wherein the memory cell comprises a chalcogenide material.
14. A method of forming a three dimensional memory array, comprising:
forming a stack comprising a set of conductive layers, wherein:
a first conductive layer of the set of conductive layers is separated from a second conductive layer of the set of conductive layers by an insulating region comprising a set of at least two layers, the second conductive layer having a first thermal resistance and the insulating region having a second thermal resistance greater than the first thermal resistance;
the set of at least two layers comprises a first layer that comprises a first electrically insulating material and a second layer that comprises the first electrically insulating material; and
the set of at least two layers comprises a third layer that comprises a second material that is different from the first electrically insulating material; and
the second material comprises at least one of a metal, a metal alloy, carbon, or a compound comprising silicon and nitrogen;
forming a via through the stack, wherein at least a portion of the via passes through the first conductive layer and the second conductive layer;
forming a recess in at least one of the first conductive layer and the second conductive layer; and
forming a memory cell within the recess.
15. The method of claim 14 , further comprising:
forming a conductive element that fills the via and is in electronic communication with the memory cell; and
forming an intervening material in contact with the memory cell, wherein the intervening material separates the memory cell and the conductive element.
16. The method of claim 15 , wherein the intervening material and the memory cell are formed within the recess.
17. A method of forming a three dimensional memory array, comprising:
forming a set of conductive layers, wherein:
each conductive layer of the set of conductive layers has a first thermal resistance and is separated from another conductive layer of the set of conductive layers by a set of at least two layers, the set of at least two layers having a second thermal resistance greater than the first thermal resistance;
the set of at least two layers comprises a first layer that comprises a first electrically insulating material and a second layer that comprises the first electrically insulating material; and
the set of at least two layers comprises a third layer that comprises a second material that is different from the first electrically insulating material; and
the second material comprises at least one of a metal, a metal alloy, carbon, or a compound comprising silicon and nitrogen;
forming a via that passes through at least a subset of the set of conductive layers;
forming a recess in at least one conductive layer of the set of conductive layers through which the via passes; and
forming a memory cell within the recess.