Producing wafer level packaging using leadframe strip and related device
View Patent ↗A method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a mold with an active side of each die facing a surface of the mold; placing a leadframe strip on the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die; placing a mold cover over the mold and dies; and adding mold compound in spaces between the dies and mold cover.
1. A device comprising:
dies attached to a mold;
a leadframe strip attached to the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die;
a mold cover formed over the mold and dies; and
a mold compound formed in spaces between the dies and mold cover,
wherein the etched portions of the leadframe strip contact the mold and mold cover, and
wherein a height of the etched portions of the leadframe strip is higher than a height of each die, and an interface of the mold and mold cover is coplanar to a top surface of the leadframe strip on opposite side of the active side.
2. The device according to claim 1 , wherein the mold compound is formed on upper surfaces of the half etched portion of the leadframe strip.
3. The device according to claim 1 , wherein the leadframe strip comprises a metal.
4. The device according to claim 3 , wherein the half-etched portions of the leadframe strip are adjacent to sides of the dies.
5. The device according to claim 3 , wherein the metal comprises copper.
6. The device according to claim 3 , wherein the metal comprises copper coated with a protective coating.
7. The device according to claim 1 , wherein an active side of each die faces a surface of the mold.
8. A device comprising:
dies attached to a mold;
a leadframe strip attached to the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die;
a mold cover formed over the mold and dies, wherein the etched portions of the leadframe strip are of sufficient height to contact the mold cover; and
a mold compound formed in spaces between the dies and mold cover,
wherein a height of the etched portions of the leadframe strip is higher than a height of each die, and an interface of the mold and mold cover is coplanar to a top surface of the leadframe strip on opposite side of the active side.
9. The device according to claim 8 , wherein the mold compound is formed on upper surfaces of the half etched portion of the leadframe strip.
10. The device according to claim 8 , wherein the leadframe strip comprises a metal.
11. The device according to claim 10 , wherein the half-etched portions of the leadframe strip are adjacent to sides of the dies.
12. The device according to claim 10 , wherein the metal comprises copper.
13. The device according to claim 10 , wherein the metal comprises copper coated with a protective coating.
14. The device according to claim 8 , wherein an active side of each die faces a surface of the mold.
15. A device comprising:
dies formed into a mold with an active side of each die facing a surface of the mold;
a leadframe strip formed on the mold;
a mold cover formed over the mold and dies; and
a polymer mold compound formed in spaces between the dies and mold cover,
wherein the metal leadframe strip comprises etched and half etched portions positioned between each die and the half-etched portions of the metal leadframe strip are adjacent to sides of the dies, and
wherein a height of the etched portions of the leadframe strip is higher than a height of each die, and an interface of the mold and mold cover is coplanar to a top surface of the leadframe strip on opposite side of the active side.
16. The device according to claim 15 , wherein the metal leadframe strip comprises copper.
17. The device according to claim 15 , wherein the leadframe strip comprises a metal.
18. The device according to claim 17 , wherein the metal leadframe strip comprises copper coated with a protective coating.
19. The device according to claim 18 , wherein the protective coating comprises nickel.
20. The device according to claim 17 , wherein the etched portions of the leadframe strip contact the mold and mold cover.