IP Library Granted Patent US 10,274,675
Granted Patent B2
US 10,274,675 · App. 15/859,106 · Granted Apr 30, 2019

Apparatuses and methods for photonic communication and photonic addressing

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,274,675
App. No.
15/859,106
Granted
Apr 30, 2019
Kind
B2
Abstract

Apparatuses and methods for photonic communication and photonic addressing are disclosed herein. An example apparatus includes a plurality of photonic sources, a plurality of memory die, a logic die. Each of the plurality of photonic sources provides a photonic signal of a different wavelength and are provided to a first photonic path. Each memory die of the plurality of memory die includes a photonic modulation circuit coupled to the first photonic path, and further includes a photonic detector circuit coupled to a second photonic path. Each memory die of the plurality of memory die is associated with and addressed by a respective wavelength of a photonic signal. The logic die is coupled to the first and second photonic paths, and includes a plurality of photonic circuits. Each of the photonic circuits of the plurality of photonic circuits is associated with a respective wavelength of a photonic signal.

Claims (43)

1. An apparatus, comprising:

first and second photonic paths;

a first layer at least coupled to the first photonic path, the first layer configured to provide a plurality of photonic signals to the first photonic path, wherein each of the plurality of photonic signals has a different wavelength; and

a plurality of second layers coupled to the first and second photonic paths, wherein each second layer of the plurality of second layers is associated with a photonic signal of the plurality of photonic signals based on a respective wavelength, wherein each second layer of the plurality of second layers comprises:

a first photonic modulator circuit coupled to the first photonic path, wherein a first photonic filter is configured to receive the plurality of photonic signals from the first photonic path, filter a photonic signal of a respective wavelength from the plurality of photonic signals and provide the plurality of photonic signals including the filtered photonic signal of the respective wavelength to the first photonic path; and

a second photonic filter coupled to the second photonic path, wherein the second photonic filter is configured to receive the plurality of photonic signals from the second photonic path, filter a photonic signal of a respective wavelength from the plurality of photonic signals and provide the remaining plurality of photonic signals to the second photonic path.

2. The apparatus of claim 1 , further comprising a third layer coupled to the first and second photonic paths and including a photonic circuit that is configured to filter a photonic signal of a respective wavelength from the plurality of photonic signals, and to provide the filtered photonic signal of the respective wavelength to the second photonic path.

3. The apparatus of claim 2 , wherein the third layer includes a plurality of photonic circuits each configured to filter a respective photonic signal of a respective wavelength from the plurality of photonic signals, and to provide the respective filtered photonic signal of the respective wavelength to the second photonic path.

4. The apparatus of claim 1 , wherein the first photonic modulator circuit comprises a first photonic modulator configured to modulate the filtered photonic signal of the respective wavelength and provide the modulated photonic signal of the respective wavelength to the first photonic path.

5. The apparatus of claim 4 , wherein a second layer of the plurality of second layers further comprises a second photonic detector coupled to the second photonic filter, where the second photonic detector is configured to receive the modulated photonic signal of the respective wavelength from the second photonic filter and convert the filtered, modulated photonic signal of the respective wavelength to corresponding electrical signals.

6. The apparatus of claim 1 , wherein the first and second photonic paths comprise a respective plurality of photonic through substrate vias (PTSVs) coupled to respective first, second, and third layers.

7. The apparatus of claim 1 , wherein the respective plurality of photonic through substrate vias (PTSVs) are coupled to the respective first, second, and third layers via surface couplers.

8. The apparatus of claim 1 , wherein the first layer comprises a plurality of photonic sources configured to provide a photonic signal of a respective wavelength.

9. An apparatus, comprising:

first and second photonic paths;

a first layer at least coupled to the first photonic path, the first layer configured to provide a plurality of photonic signals to the first photonic path, wherein each of the plurality of photonic signals has a different wavelength;

a second layer coupled to the first and second photonic paths, wherein the second layer is associated with a photonic signal of the plurality of photonic signals based on a respective wavelength, wherein the second layer comprises a first photonic modulator circuit configured to filter a photonic signal of a respective wavelength from the plurality of photonic signals;

a second photonic filter configured to filter a photonic signal of a respective wavelength from the plurality of photonic signals; and

a third layer including a photonic circuit, the third layer coupled to the first and second photonic paths, the photonic circuit associated with a photonic signal of the plurality of photonic signals based on a respective wavelength, wherein the photonic circuit is configured to receive the plurality of photonic signals, filter the photonic signal of the respective wavelength from the plurality of photonic signals, and provide the filtered photonic signal of the respective wavelength to the second photonic path.

10. The apparatus of claim 9 , wherein the first photonic modulator circuit is coupled to the first photonic path, and wherein the second photonic filter is coupled to the second photonic path.

11. The apparatus of claim 9 , wherein the first photonic modulator circuit is configured to provide the plurality of photonic signals to the first photonic path, and wherein the second photonic filter is configured to provide a remaining plurality of photonic signals minus the filtered photonic signal to the second photonic path.

12. The apparatus of claim 9 , wherein the photonic circuit comprises:

a third photonic filter configured to filter the modulated photonic signal of the respective wavelength; and

a first photonic detector coupled to the third photonic filter via a photonic switch, the first photonic detector configured to convert the filtered, modulated photonic signal of the respective wavelength to the corresponding electrical signals.

13. The apparatus of claim 12 , wherein the first photonic detector comprises:

a first photodiode configured to convert the filtered, modulated photonic signal of the respective wavelength to the corresponding electrical signals; and

a first transimpedance amplifier configured to amplify the corresponding electrical signals.

14. The apparatus of claim 9 , wherein the plurality of photonic signals provided by the first layer are in an unmodulated state.

15. The apparatus of claim 9 , wherein the first layer includes a photonic source configured to provide a photonic signal of a respective wavelength of the plurality of photonic signals.

16. The apparatus of claim 15 , wherein the photonic source includes a vertical cavity surface emitting laser.

17. A method, comprising:

providing a plurality of photonic signals to a first photonic path from a first layer, wherein each of the plurality of photonic signals has a different wavelength;

receiving, at a first modulator circuit of a second layer of a plurality of second layers, the plurality of photonic signals from the first photonic path;

filtering a photonic signal of a respective wavelength from the plurality of photonic signals;

providing the plurality of photonic signals including the filtered photonic signal of the respective wavelength to the first photonic path;

receiving the plurality of photonic signals from a second photonic path at a second photonic filter of the second layer;

filtering, via the second photonic filter, a photonic signal of a respective wavelength from the plurality of photonic signals; and

providing remaining photonic signals of the plurality of photonic signals to the second photonic path.

18. The method of claim 17 , further comprising:

filtering, via a photonic circuit of a third layer coupled to the first and second photonic paths, a photonic signal of a respective wavelength from the plurality of photonic signals; and

providing the filtered photonic signal of the respective wavelength to the second photonic path.

19. The method of claim 17 , wherein providing the plurality of photonic signals to the first photonic path comprises providing the plurality of photonic signals through a plurality of photonic through substrate vias (PTSVs).

20. The method of claim 17 , wherein providing the plurality of photonic signals to the first photonic path comprises providing the plurality of photonic signals to the first photonic path in an unmodulated state.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 7 TO PATENT SECURITY AGREEMENT Recorded Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2017
From: QUINLAN, SION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 044508/0665 →