Image pickup element, method of manufacturing image pickup element, and electronic apparatus
An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
1. An imaging device comprising:
a substrate;
a first photoelectric conversion region disposed in the substrate;
a second photoelectric conversion region disposed in the substrate;
a trench disposed between the first photoelectric conversion region and the second photoelectric conversion region;
a first silicon oxide film disposed in the trench, the first silicon oxide film contacting the substrate;
a hafnium oxide film disposed in the trench, the hafnium oxide film disposed at an inner side of the first silicon oxide film;
a tantalum oxide film disposed in the trench, the tantalum oxide film disposed at an inner side of the hafnium oxide film;
a second silicon oxide film disposed in the trench, the second silicon oxide film disposed at an inner side of the tantalum oxide film; and
tungsten material disposed in the trench, the tungsten material disposed at an inner side of the second silicon oxide film,
wherein,
the first silicon oxide film is disposed over the first photoelectric conversion region and contacts the substrate,
the hafnium oxide film is disposed over the first photoelectric conversion region and contacts the first silicon oxide film,
the tantalum oxide film is disposed over the first photoelectric conversion region and contacts the hafnium oxide film,
the second silicon oxide film is disposed over the first photoelectric conversion region and contacts the tantalum oxide film, and
a thickness of the second silicon oxide film over the first photoelectric conversion region is larger than a thickness of the second silicon oxide film between the tantalum oxide film and the tungsten material in the trench.
2. The imaging device according to claim 1 , wherein the hafnium oxide film is contiguous from a first side of the trench to a second side of the trench.
3. The imaging device according to claim 1 , further comprising:
a second trench including:
the first silicon oxide film;
the hafnium oxide film;
the tantalum oxide film;
the second silicon oxide film; and
second tungsten material.
4. The imaging device according to claim 1 , wherein a thickness of the first silicon oxide film is about 1 nm.
5. The imaging device according to claim 1 , further comprising a microlens disposed above the first photoelectric conversion region.
6. The imaging device according to claim 5 , further comprising second tungsten material located between the microlens and the substrate.
7. The imaging device according to claim 6 , wherein the second tungsten material is between the second silicon oxide film and the microlens.
8. The imaging device according to claim 1 , further comprising second tungsten material between the substrate and a film including silicon and oxygen.
9. The imaging device according to claim 1 , further comprising a wiring layer at a side of the substrate.
10. The imaging device according to claim 9 , wherein the wiring layer is located at a side of the substrate opposite to a side of the substrate contacting the first silicon oxide film.
11. An apparatus comprising:
an imaging device including:
a substrate,
a first photoelectric conversion region disposed in the substrate,
a second photoelectric conversion region disposed in the substrate,
a trench disposed between the first photoelectric conversion region and the second photoelectric conversion region,
a first silicon oxide film disposed in the trench, the first silicon oxide film contacting the substrate,
a hafnium oxide film disposed in the trench, the hafnium oxide film disposed at an inner side of the first silicon oxide film,
a tantalum oxide film disposed in the trench, the tantalum oxide film disposed at an inner side of the hafnium oxide film,
a second silicon oxide film disposed in the trench, the second silicon oxide film disposed at an inner side of the tantalum oxide film, and
tungsten material disposed in the trench, the tungsten material disposed at an inner side of the second silicon oxide film,
wherein,
the first silicon oxide film is disposed over the first photoelectric conversion region and contacts the substrate,
the hafnium oxide film is disposed over the first photoelectric conversion region and contacts the first silicon oxide film,
the tantalum oxide film is disposed over the first photoelectric conversion region and contacts the hafnium oxide film,
the second silicon oxide film is disposed over the first photoelectric conversion region and contacts the tantalum oxide film, and
a thickness of the second silicon oxide film over the first photoelectric conversion region is larger than a thickness of the second silicon oxide film between the tantalum oxide film and the tungsten material in the trench; and
a lens configured to guide light toward a surface of the imaging device.
12. The apparatus according to claim 11 , wherein the hafnium oxide film is contiguous from a first side of the trench to a second side of the trench.
13. The apparatus according to claim 11 , further comprising:
a second trench including:
the first silicon oxide film;
the hafnium oxide film;
the tantalum oxide film;
the second silicon oxide film; and
second tungsten material.
14. The apparatus according to claim 11 , wherein a thickness of the first silicon oxide film is about 1 nm.
15. The apparatus according to claim 11 , further comprising a microlens disposed above the first photoelectric conversion region.
16. The apparatus according to claim 15 , further comprising second tungsten material located between the microlens and the substrate.
17. The apparatus according to claim 16 , wherein the second tungsten material is between the second silicon oxide film and the microlens.
18. The apparatus according to claim 11 , further comprising second tungsten material between the substrate and a film including silicon and oxygen.
19. The apparatus according to claim 11 , further comprising a wiring layer at a side of the substrate.
20. The apparatus according to claim 19 , wherein the wiring layer is located at a side of the substrate opposite to a side of the substrate contacting the first silicon oxide film.