IP Library Granted Patent US 10,192,984
Granted Patent B1
US 10,192,984 · App. 15/865,138 · Granted Jan 29, 2019

Dual threshold voltage devices with stacked gates

Inventors: Gian Sharma (Fremont, CA); Amitay Levi (Cupertino, CA); Kuk-Hwan Kim (San Jose, CA)
Assignee: SPIN TRANSFER TECHNOLOGIES
H01L29/7831H01L27/228H01L29/42392H01L29/495H01L29/4916H01L29/7827H01L43/08G11C11/412H01L21/82345H01L27/2472H01L29/78642
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,192,984
App. No.
15/865,138
Granted
Jan 29, 2019
Kind
B1
Abstract

A device having two transistors with dual thresholds, and a method of fabricating the device, including fabricating a silicide source, a conductive layer, and contacts to a plurality of layers of the device, is provided. The device has a core and a plurality of layers that surround the core in succession, including a first layer, a second layer, a third layer, and a fourth layer. The device further comprises a first input terminal coupled to the core, the first input terminal being configured to receive a first voltage and a second input terminal coupled to the fourth layer, the second input terminal being configured to receive a second voltage. The device comprises a common source terminal coupled to the core and the fourth layer. A memory device, such as an MTJ, may be coupled to the device.

Claims (34)

1. An annular device, comprising:

a core composed of conductive material; and

a plurality of layers surrounding a sidewall of the core in succession, the plurality of layers comprising:

a first layer composed of dielectric material and surrounding a sidewall portion of the core,

a second layer composed of semiconductor material and surrounding a sidewall portion of the first layer,

a third layer composed of dielectric material and surrounding a sidewall portion of the second layer, and

a fourth layer composed of conductive material and surrounding a sidewall portion of the third layer;

wherein:

the core, the first layer, and the second layer correspond to a first transistor including a first input terminal; and

the second layer, the third layer, and the fourth layer correspond to a second transistor including a second input terminal;

the second layer is a common channel;

the first input terminal is coupled to the core, the first input terminal being configured to receive a first voltage for the first transistor;

the second input terminal is coupled to the fourth layer, the second input terminal being configured to receive a second voltage for the second transistor; and

the first input terminal and the second input terminal extend radially outward from the annular device, and wherein the first input terminal is aligned with the second input terminal.

2. The device of claim 1 , further comprising a magnetic tunnel junction (MTJ) coupled to a drain of the common channel.

3. The device of claim 2 , wherein:

the MTJ includes a storage layer, a spacer layer, and a reference layer; and

the reference layer of the MTJ is coupled to the drain of the common channel.

4. The device of claim 1 , wherein:

the core is vertical and cylindrical in shape;

the plurality of layers annularly surround the vertical cylindrical core; and

the core surrounded by the plurality of layers creates a cylindrical pillar.

5. The device of claim 4 , wherein:

the first transistor is configured to have a first threshold voltage having a first magnitude;

the second transistor is configured to have a second threshold voltage having a second magnitude; and

the second magnitude is distinct from the first magnitude.

6. The device of claim 5 , wherein:

the first threshold voltage and the second threshold voltage are based on a respective thickness for each of the plurality of dielectric layers.

7. The device of claim 5 , wherein the first threshold voltage and the second threshold voltage are selected by changing one or more properties of the device selected from the group consisting of: a dopant of the device, a thickness of one or more of the plurality of dielectric layers, and material compositions of the first transistor's gate material and work function and the second transistor's gate material and work function.

8. The device of claim 1 , wherein the fourth layer is composed of a polycide.

9. The device of claim 1 , wherein the core is composed of a Tantalum.

10. The device of claim 1 , further comprising a cylindrical source contact coupled to a source of the common channel.

11. The device of claim 1 , wherein the second layer has a height that is distinct from a height of the core.

12. The device of claim 1 , wherein the second layer has a height that is distinct from respective heights of the third layer and the fourth layer.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2021
From: SPIN (ASSIGNMENT FOR BENEFIT OF CREDITORS), LLC
To: INTEGRATED SILICON SOLUTION, (CAYMAN) INC.
Reel/Frame 057473/0319 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2021
From: SPIN MEMORY, INC.
To: SPIN (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 056927/0038 →
CHANGE OF NAME Recorded Jan 17, 2019
From: SPIN TRANSFER TECHNOLOGIES, INC.
To: SPIN MEMORY, INC.
Reel/Frame 048054/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2018
From: SHARMA, GIAN; LEVI, AMITAY; KIM, KUK-HWAN
To: SPIN TRANSFER TECHNOLOGIES
Reel/Frame 045138/0688 →