Removal of metal
View Patent ↗Methods of removing metal from a portion of a substrate include exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent, determining whether metal remaining on the portion of the substrate is less than or equal to a particular level, and exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent if the metal remaining on the portion of the substrate is deemed to be greater than the particular level.
1. A method of removing metal from a portion of a substrate, the method comprising:
exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent;
determining whether metal remaining on the portion of the substrate is less than or equal to a particular level;
if the metal remaining on the portion of the substrate is deemed to be greater than the particular level, exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent.
2. The method of claim 1 , wherein the reducing environment is a reducing plasma and the oxidizing environment is a first oxidizing plasma, the method further comprising:
exposing the substrate to a second oxidizing plasma comprising at least one oxidizing agent and at least one reducing agent prior to exposing the substrate to the reducing plasma and prior to determining whether the metal remaining on the portion of the substrate is less than or equal to the particular level; and
if the metal remaining on the portion of the substrate is deemed to be greater than the particular level, exposing the substrate to a second reducing plasma comprising at least one reducing agent and at least one oxidizing agent subsequent to exposing the substrate to the first oxidizing plasma.
3. The method of claim 1 , wherein the reducing environment is a first reducing environment and the oxidizing environment is a first oxidizing environment, and wherein determining whether the metal remaining on the portion of the substrate after exposing the substrate to the first reducing environment is less than or equal to the particular level occurs prior to exposing the substrate to the first oxidizing environment, the method further comprising:
after exposing the substrate to the first oxidizing environment, exposing the substrate to a second reducing environment comprising at least one reducing agent and at least one oxidizing agent;
after exposing the substrate to the second reducing environment, determining whether the metal remaining on the portion of the substrate is less than or equal to the particular level; and
if the metal remaining on the portion of the substrate after exposure to the second reducing environment is deemed to be greater than the particular level, exposing the substrate to a second oxidizing environment comprising at least one oxidizing agent and at least one reducing agent.
4. The method of claim 3 , further comprising:
repeating cycles of exposing the substrate to additional reducing environments and additional oxidizing environments until it is determined, between exposing the substrate to the additional reducing environment of a particular cycle and exposing the substrate to the additional oxidizing environment of the particular cycle, that the metal remaining on the portion of the substrate is less than or equal to the particular level.
5. The method of claim 4 , wherein determining whether the metal remaining on the portion of the substrate is less than or equal to the particular level comprises a method selected from a group consisting of determining whether the portion of the substrate has been exposed to an oxidizing environment for a particular number of exposures, determining whether the portion of the substrate has been exposed to an oxidizing environment for a particular amount of total exposure time, and determining whether the portion of the substrate has been exposed to an oxidizing environment for at least a particular number of times and for a particular amount of total exposure time.
6. The method of claim 1 , wherein determining whether the metal remaining on the portion of the substrate is less than or equal to the particular level comprises determining whether the metal remaining on the portion of the substrate is deemed to be acceptable for proper operation of an integrated circuit device under formation.
7. The method of claim 1 , wherein determining whether the metal remaining on the portion of the substrate is less than or equal to the particular level comprises determining whether the metal remaining on the portion of the substrate is less than or equal to 1E10 atoms/cm 2 .
8. The method of claim 1 , wherein exposing the substrate to the reducing environment comprises exposing the substrate to a reducing environment comprising 20-98% ammonia and 2-65% by volume oxygen.
9. The method of claim 1 , wherein exposing the substrate to the reducing environment comprises exposing the substrate to a reducing environment consisting essentially of ammonia and oxygen.
10. The method of claim 1 , wherein exposing the substrate to the oxidizing environment comprises exposing the substrate to an oxidizing environment comprising 60-99% oxygen and 0.4-20% by volume hydrogen.
11. The method of claim 1 , wherein exposing the substrate to the oxidizing environment further comprises exposing the substrate to an oxidizing environment comprising an inert gas.
12. The method of claim 1 , wherein exposing the substrate to the oxidizing environment comprises exposing the substrate to an oxidizing environment consisting essentially of oxygen, hydrogen and nitrogen.
13. A method of removing metal from a portion of a substrate, the method comprising:
exposing the substrate to a first reducing environment comprising at least one reducing agent and at least one oxidizing agent;
after exposing the substrate to the first reducing environment, determining whether metal remaining on the portion of the substrate is less than or equal to a particular level;
if the metal remaining on the portion of the substrate after exposure to the first reducing environment is deemed to be greater than the particular level, exposing the substrate to a first oxidizing environment comprising at least one oxidizing agent and at least one reducing agent;
after exposing the substrate to the first oxidizing environment, exposing the substrate to a second reducing environment comprising at least one reducing agent and at least one oxidizing agent;
after exposing the substrate to the second reducing environment, determining whether the metal remaining on the portion of the substrate is less than or equal to the particular level; and
if the metal remaining on the portion of the substrate after exposure to the second reducing environment is deemed to be greater than the particular level, exposing the substrate to a second oxidizing environment comprising at least one oxidizing agent and at least one reducing agent.
14. The method of claim 13 , wherein an exposure time for exposing the substrate to the first or second reducing environment is different than an exposure time for exposing the substrate to the first or second oxidizing environment, respectively.
15. The method of claim 13 , wherein removing metal comprises removing a metal selected from a group consisting of ruthenium, osmium and iridium.
16. The method of claim 13 , wherein exposing the substrate to the first and second reducing environments each comprising at least one reducing agent and at least one oxidizing agent, and exposing the substrate to the first and second oxidizing environments each comprising at least one oxidizing agent and at least one reducing agent, comprises exposing the substrate to reducing agents selected from a group consisting of gases comprising elemental hydrogen, and exposing the substrate to oxidizing agents selected from a group consisting of gases comprising elemental oxygen and gases comprising halogens.
17. The method of claim 13 , wherein exposing the substrate to a reducing environment comprises exposing the substrate to a reducing environment comprising ammonia and oxygen.
18. The method of claim 13 , wherein exposing the substrate to an oxidizing environment comprises exposing the substrate to an oxidizing environment comprising oxygen and hydrogen.
19. A method of removing metal from a portion of a substrate, the method comprising:
exposing the substrate to a first reducing plasma comprising at least one reducing agent and at least one oxidizing agent;
after exposing the substrate to the first reducing plasma, determining whether metal remaining on the portion of the substrate is less than or equal to a particular level;
if the metal remaining on the portion of the substrate after exposure to the first reducing plasma is deemed to be greater than the particular level, exposing the substrate to a first oxidizing plasma comprising at least one oxidizing agent and at least one reducing agent;
after exposing the substrate to the first oxidizing plasma, exposing the substrate to a second reducing plasma comprising at least one reducing agent and at least one oxidizing agent;
after exposing the substrate to the second reducing plasma, determining whether the metal remaining on the portion of the substrate is less than or equal to the particular level; and
if the metal remaining on the portion of the substrate after exposure to the second reducing plasma is deemed to be greater than the particular level, exposing the substrate to a second oxidizing plasma comprising at least one oxidizing agent and at least one reducing agent.
20. The method of claim 19 , wherein exposing the substrate to the first reducing plasma comprises exposing the substrate to a reducing plasma comprising ammonia and oxygen, and wherein exposing the substrate to the first oxidizing plasma comprises exposing the substrate to an oxidizing plasma comprising oxygen and hydrogen.