Post-etch residue removal for advanced node beol processing
The disclosure relates to a cleaning composition that aids in the removal of post-etch residues and aluminum-containing material, e.g., aluminum oxide, in the production of semiconductors that utilize an aluminum-containing etch stop layer. The compositions have a high selectivity for post-etch residue and aluminum-containing materials relative to low-k dielectric materials, cobalt-containing materials and other metals on the microelectronic device.
1. A cleaning composition comprising (a) a concentrate comprising at least one metal corrosion inhibitor, at least one etchant source, at least one silica source, at least one chelating agent, and at least one solvent, and (b) at least one oxidizing agent, wherein the cleaning composition is suitable for removing both post-etch residue and aluminum-containing etch stop materials from a surface of a microelectronic device having same thereon; wherein the cleaning composition is devoid of metal halide.
2. The cleaning composition of claim 1 , wherein the post-etch residue comprises at least one species selected from the group consisting of titanium-containing residues, polymeric residues, copper-containing residues, cobalt-containing residues, silicon-containing residues, and combinations thereof.
3. The cleaning composition of claim 1 , wherein the at least one etchant source comprises ammonium hydroxide or a tetraalkylammonium hydroxide.
4. The cleaning composition of claim 3 , wherein the at least one etchant source comprises choline hydroxide.
5. The cleaning composition of claim 1 , wherein the at least one metal corrosion inhibitor comprises 1,2,4-triazole (TAZ), 5-methyl-benzotriazole (mBTA), tolyltriazole, or combinations thereof.
6. The cleaning composition of claim 1 , wherein the at least one chelating agent is ethylenediaminetetraacetic acid (EDTA), 1,2-cyclohexanediamine-N,N,N′,N′-tetraacetic acid (CDTA), 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP), oxalic acid, or 4-methylmorpholine-N-oxide (NMMO).
7. The cleaning composition of claim 6 , wherein the at least one chelating agent is 1,2-cyclohexanediamine-N,N,N′,N′-tetraacetic acid (CDTA), 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP), or 4-methylmorpholine-N-oxide (NMMO).
8. The cleaning composition of claim 1 , wherein the at least one silica source comprises fluorosilicic acid (H 2 SiF 6 ).
9. The cleaning composition of claim 8 , wherein the fluorosilicic acid is generated in situ by combining at least one fluoride source and at least one silicon-containing compound.
10. The cleaning composition of claim 1 , wherein the at least one oxidizing agent comprises hydrogen peroxide.
11. The cleaning composition of claim 1 , wherein the cleaning composition comprises 10 parts of the concentrate with between from about 0.1 parts to about 1 part oxidizing agent.
12. The cleaning composition of claim 1 , wherein the amount of the at least one oxidizing agent is less than about 10 wt% based on a total weight of the cleaning composition.
13. The cleaning composition of claim 1 , wherein the at least one solvent comprises water.
14. The cleaning composition of claim 1 , wherein the microelectronic device comprises cobalt-containing layers, low-k dielectric layers, and copper.