Air gap spacer with controlled air gap height
A FinFET and method for fabricating an air gap spacer in a FinFET is disclosed. The FinFET includes a sidewall spacer between a gate material and an interlayer dielectric material. The sidewall spacer includes a lower portion that extends fully between the gate and the interlayer dielectric material and an upper portion that includes an airgap. The sidewall spacer is fabricated by depositing a sacrificial gate structure in a gate region having an upper sacrificial layer and a lower sacrificial layer, and removing the upper sacrificial layer to expose a sidewall spacer region. Airgap spacer material is deposited in the exposed sidewall spacer region to form an upper portion of the sidewall spacer having the air gap.
1. A method for fabricating an air gap spacer in a FinFET, the method comprising:
depositing a sacrificial gate structure in a gate region, the sacrificial gate structure having an upper sacrificial layer, a lower sacrificial layer, and an etch stop layer between the upper sacrificial layer and the lower sacrificial layer;
removing the upper sacrificial layer selective to the etch stop layer to expose a sidewall spacer region; and
depositing an airgap spacer material in the exposed sidewall spacer region to form an upper portion of a sidewall spacer, the upper portion having the air gap.
2. The method of claim 1 further comprising removing the lower sacrificial layer, and filling the gate with gate material.
3. The method of claim 2 further comprising depositing the airgap spacer material in the sidewall spacer region adjacent the gate material.
4. The method of claim 1 further comprising separating the upper sacrificial layer and lower sacrificial layer using a layer of silicon nitride.
5. The method of claim 1 wherein the upper sacrificial layer and the lower sacrificial layer include amorphous silicon.
6. The method of claim 5 , wherein the sacrificial gate structure is confined by a first sidewall spacer material, further comprising removing an upper portion of the first sidewall spacer material exposed by removal of the upper sacrificial layer material and retaining an unexposed lower portion of the sidewall spacer.
7. The method of claim 6 , further comprising depositing a temporary airgap spacer material on top of the lower portion of the sidewall spacer to form the upper portion of the sidewall spacer.
8. The method of claim 7 , wherein the temporary airgap spacer material includes one of: (i) an inner sacrificial layer and an outer etch-resistant layer; (ii) an inner etch-resistant layer and an outer sacrificial layer; and (iii) a sacrificial layer sandwiched between two etch-resistant layer, further comprising removing the sacrificial layer to form an airgap for the airgap spacer material.
9. A method for fabricating a FinFET, the method comprising:
depositing a sacrificial gate structure to mark a gate region of the FinFET, the sacrificial gate structure having an upper sacrificial layer, a lower sacrificial layer, and an etch stop layer between the upper sacrificial layer and the lower sacrificial layer;
removing the upper sacrificial layer selective to the etch stop layer to expose an upper portion of a sidewall spacer;
removing the upper portion of the sidewall spacer; and
depositing an air gap spacer material in a region vacated by removal of the upper portion of the sidewall spacer.
10. The method of claim 9 further comprising removing the lower sacrificial layer and filling the gate region with gate material.
11. The method of claim 10 further comprising depositing the airgap spacer material in the sidewall spacer region adjacent the gate material.
12. The method of claim 9 further comprising separating the upper sacrificial layer and lower sacrificial layer via a layer of silicon nitride.
13. The method of claim 9 , wherein the upper sacrificial layer and the lower sacrificial layer include amorphous silicon.
14. The method of claim 9 , wherein the sacrificial gate structure is confined by a first sidewall spacer material, wherein the method further comprises removing an upper portion of the first sidewall spacer material exposed by removal of the upper sacrificial layer material and retaining an unexposed lower portion of the sidewall spacer.
15. The method of claim 14 further comprising depositing the airgap spacer material on top of the lower portion of the sidewall spacer to form the upper portion of the sidewall spacer.