IP Library Granted Patent US 10,347,322
Granted Patent B1
US 10,347,322 · App. 15/900,403 · Granted Jul 9, 2019

Apparatuses having memory strings compared to one another through a sense amplifier

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Quick Facts
Patent No.
US 10,347,322
App. No.
15/900,403
Filed
Feb 20, 2018
Granted
Jul 9, 2019
Kind
B1
Examiner
CHO, SUNG IL
Art Unit
2825
USPC
365/145
Abstract

Some embodiments include an apparatus having first and second comparative bitlines extending horizontally and coupled with a sense amplifier. First memory cell structures are coupled with the first comparative bitline. Each of the first memory cell structures has a first transistor associated with a first capacitor. Second memory cell structures are coupled with the second comparative bitline. Each of the second memory cell structures has a second transistor associated with a second capacitor. Each of the first capacitors has a container-shaped first node and is vertically offset from an associated first sister capacitor which is a mirror image of its associated first capacitor along a horizontal plane. Each of the second capacitors has a container-shaped first node and is vertically offset from an associated second sister capacitor which is a mirror image of its associated second capacitor along the horizontal plane.

Claims (15)

1. An apparatus comprising:

a first comparative bitline extending horizontally and being coupled with a first sense amplifier;

a second comparative bitline under the first comparative bitline, extending horizontally, and being coupled with a second sense amplifier which is different from the first sense amplifier;

a third comparative bitline extending horizontally and being coupled with the first sense amplifier;

a fourth comparative bitline extending horizontally and being coupled with the second sense amplifier;

a common plate between the first and second comparative bitlines and extending horizontally;

first memory cell structures between the first comparative bitline and the common plate; the first memory cell structures being horizontally spaced from one another and together being arranged in a first memory cell string; each of the first memory cell structures having a first transistor associated with a first capacitor; the first transistors being proximate the first comparative bitline; the first capacitors being proximate the common plate; each of the first capacitors having a first node coupled with a source/drain region of its associated first transistor, and having a second node coupled with the common plate;

second memory cell structures between the second comparative bitline and the common plate; the second memory cell structures being horizontally spaced from one another and together being arranged in a second memory cell string; each of the second memory cell structures having a second transistor associated with a second capacitor; the second transistors being proximate the second comparative bitline; the second capacitors being proximate the common plate; each of the second capacitors having a first node coupled with a source/drain region of its associated second transistor, and having a second node coupled with the common plate;

third memory cell structures along the third comparative bitline; the third memory cell structures being horizontally spaced from one another and together being arranged in a complement to the first memory cell string; the first memory cell string and its complement being configured to be compared to one another through the first sense amplifier;

fourth memory cell structures along the fourth comparative bitline; the fourth memory cell structures being horizontally spaced from one another and together being arranged in a complement to the second memory cell string; the second memory cell string and its complement being configured to be compared to one another through the second sense amplifier;

wherein the first node of each of the first capacitors is configured as a downwardly-opening container structure;

wherein the second nodes of the first capacitors extend upwardly into the downwardly-opening container structures;

wherein the first node of each of the second capacitors is configured as an upwardly-opening container structure;

wherein the second nodes of the second capacitors extend downwardly into the upwardly-opening container structures; and

wherein the downwardly-opening container structures are aligned with the upwardly-opening container structures so that each of the downwardly-opening container structures is a mirror image of one of the upwardly-opening container structures across a plane extending horizontally along the common plate.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
SUPPLEMENT NO. 9 TO PATENT SECURITY AGREEMENT Recorded Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2018
From: KIM, TAE H.; HWANG, SANGMIN; LEE, SI-WOO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 044981/0841 →
Cited By (1)
US 12,720,721