IP Library Granted Patent US 10,468,371
Granted Patent B2
US 10,468,371 · App. 15/910,659 · Granted Nov 5, 2019

Wiring with external terminal

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Quick Facts
Patent No.
US 10,468,371
App. No.
15/910,659
Granted
Nov 5, 2019
Kind
B2
Abstract

Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Claims (17)

1. An apparatus comprising:

a first ring-shaped wiring coupled to a first external terminal and a first circuit node at first and second connection points, respectively; and

a second ring-shaped wiring coupled to a second external terminal and a second circuit node at third and fourth connection points, respectively,

wherein a first distance of a first straight line between the first and second connection points is different from a second distance of a second straight line between the third and fourth connection points, and

wherein a first impedance between the first and second connection points is substantially the same as a second impedance between the third and fourth connection points.

2. The apparatus of claim 1 , wherein the first impedance between the first connection point and the second connection point is substantially constant regardless of an actual distance between the first connection point and the second connection point.

3. The apparatus of claim 1 , wherein the first ring-shaped wiring further comprises a first portion, a second portion, a third portion and a fourth portion, the third portion couples the first portion and the second portion at a first end of the first ring-shaped wiring, and the fourth portion couples the first portion and the second portion at a second end of the first ring-shaped wiring,

wherein the first connection point is anywhere along the first portion and the second connection point is anywhere along the second portion, and

wherein a distance between the first connection point and the second connection point of the first ring-shaped wiring is constant.

4. The apparatus of claim 1 , wherein the first impedance between the first connection point and the second connection point of the first ring-shaped wiring is constant.

5. The apparatus of claim 1 , wherein the first ring-shaped wiring and the second ring-shaped wiring have substantially the same shape.

6. The apparatus of claim 1 , wherein each of the first ring-shaped wiring and the second ring-shaped wiring includes a portion having a shape of a ring, and the ring of the portion of the first ring-shaped wiring is the same in size as the ring of the portion of the second ring-shaped wiring.

7. An apparatus comprising;

a first ring-shaped wiring coupled to a first external terminal and a first circuit node at first and second connection points, respectively, the first ring-shaped wiring including a first portion, a second portion, a third portion and a fourth portion, the third portion couples the first portion and the second portion at a first end of the first ring-shaped wiring, and the fourth portion couples the first portion and the second portion at a second end of the first ring-shaped wiring, wherein the first connection point is anywhere along the first portion and the second connection point is anywhere along the second portion, and wherein a distance between the first connection point and the second connection point of the first ring-shaped wiring is constant, wherein a first distance of a first straight line between the first and second connection points is different from a second distance of a second straight line between the third and fourth connection points; and

a second ring-shaped wiring coupled to a second external terminal and a second circuit node at third and fourth connection points, respectively, the first ring-shaped wiring and the second ring-shaped wiring have substantially the same shape,

wherein a difference between a first impedance between the first and second connection points and a second impedance between the third and fourth connection points is substantially equal to, or less than, a quarter of a sheet resistance of a material of which the first and second ring-shaped wirings are made; and

wherein a first distance around a portion of the first ring-shaped wiring between the first and second connection points and a second distance around a portion of the second ring-shaped wiring between the third and fourth connection points are substantially the same.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
SUPPLEMENT NO. 9 TO PATENT SECURITY AGREEMENT Recorded Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2018
From: OTA, KEN
To: MICRON TECHNOLOGY, INC.
Reel/Frame 045512/0846 →