IP Library Granted Patent US 11,612,087
Granted Patent B2
US 11,612,087 · App. 15/929,394 · Granted Mar 21, 2023

Connection structure for radio frequency components and electronic device including same

Inventors: Dongjoo Kim (Suwon-si, KR); Bonmin Koo (Suwon-si, KR); Jonghwa Kim (Suwon-si, KR); Seunghwan Yoon (Suwon-si, KR); Youngju Lee (Suwon-si, KR); Jongwook Zeong (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H05K9/0032H05K9/0026H05K9/0039H05K2201/10371
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Quick Facts
Patent No.
US 11,612,087
App. No.
15/929,394
Granted
Mar 21, 2023
Kind
B2
Abstract

The present disclosure relates to a pre-5 th -Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4 th -Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

Claims (26)

1. A connection assembly for radio frequency (RF) components, the connection assembly comprising:

a filter comprising an opening section and a protrusion formed in the opening section;

a printed circuit board (PCB) including a feeding line;

an elastic structure attached to a first surface of the PCB and extended along with a direction perpendicular to the first surface of the PCB; and

an RF component connected to the PCB,

wherein a first portion of the elastic structure is disposed on the first surface of the PCB and is connected to the feeding line to the RF component,

wherein a second portion of the elastic structure is configured to detachably engage a concave structure of the protrusion, to form an electrical connection between the filter and the RF component,

wherein a first surface of the filter comprises the opening section and is coupled to the first surface of the PCB,

wherein the opening section forms a guide region wider than a region of the elastic structure, in respect to a plane for the first surface of the PCB,

wherein the concave structure of the protrusion is disposed within the guide region, and

wherein the guide region comprises a space to guide flexible arrangement between the protrusion and the elastic structure according to a first range in the direction perpendicular to the first surface of the PCB and a second range in a region parallel to the first surface of the PCB,

wherein the concave structure comprises a contact surface concavely formed toward inside of the protrusion, and

wherein the contact surface is contacted with the second portion of the elastic structure.

2. The connection assembly of claim 1 , wherein

the elastic structure is capable of being flexibly arranged in the first surface of the PCB corresponding to the guide region.

3. The connection assembly of claim 1 , wherein the first range is determined based on at least one among a height of the elastic structure, a degree of elasticity of the elastic structure, or a shape of the concave structure of the protrusion; and

wherein the second range is determined based on at least one of an area of the at least one surface of the protrusion or an area of the opening section on the region parallel to the first surface of the filter.

4. The connection assembly of claim 1 , wherein the elastic structure is a structure which is capable of being deformed from a basic shape into a contracted shape based on pressure of the protrusion, and

wherein the pressure is associated with a difference between a height of the elastic structure from the first surface of the PCB and a height of the concave structure of the protrusion from the first surface of the filter.

5. The connection assembly of claim 1 , wherein the second portion of the elastic structure comprises an outer surface, a contact part, and an inner surface,

wherein the contact part comprises a ring-shaped contact part, to contact with the concave structure of the protrusion, and

wherein the inner surface is disposed in a ring-shaped inner region.

6. The connection assembly of claim 5 , wherein the outer surface forms an acute angle from the first surface of the PCB,

wherein, in case that a first pressure is provided to the elastic structure, the formed acute angle corresponds to a first value, and

wherein, in case that a second pressure which is greater than the first pressure is provided to the elastic structure, the formed acute angle corresponds to a second value which is smaller than the first value.

7. The connection assembly of claim 5 , wherein the outer surface further comprises a plurality of wrinkle parts for reducing a pressure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2020
From: KIM, DONGJOO; KOO, BONMIN; KIM, JONGHWA; YOON, SEUNGHWAN; LEE, YOUNGJU; ZEONG, JONGWOOK
To: SAMSUNG ELECTRONICS CO., LTD
Reel/Frame 052538/0228 →
Priority Claims (1)
KR 10-2019-0052562 · May 3, 2019 · national
Continuity (1)
Related Publication 20200352060A1 · Nov 5, 2020
Cited By (1)
US 12,451,584