Granted Patent B2

US 12,451,584 · App. 18/218,369 · Granted Oct 21, 2025

Inventors: Sangyoon Lee (Suwon-si, KR); Junsig Kum (Suwon-si, KR); Sanghoon Park (Suwon-si, KR); Seungtae Ko (Suwon-si, KR); Jungyub Lee (Suwon-si, KR)

Assignee: SAMSUNG ELECTRONICS CO., LTD.

H01Q1/085H01Q1/246H01Q3/02

Abstract

Claims (95)

1. An electronic device comprising:

a first radio frequency (RF) component;

a second RF component;

a ground structure having a first elasticity; and

a signal structure having a second elasticity,

wherein the signal structure electrically connects the first RF component and the second RF component,

wherein the ground structure comprises a plurality of protrusion portions and a connection portion including an opening,

wherein the signal structure comprises a substrate portion and a plurality of contact portions for electric connection, and

wherein the substrate portion of the signal structure and the plurality of contact portions of the signal structure are disposed in a space formed based on the opening of the connection portion of the ground structure.

2. The electronic device of claim 1 ,

wherein the ground structure further comprises a plurality of support portions arranged along an edge region of the connection portion of the ground structure, and

wherein each of the plurality of support portions of the ground structure has a plate shape.

3. The electronic device of claim 2 ,

wherein the plurality of contact portions of the signal structure are in contact with a first side of the first RF component,

wherein the substrate portion of the signal structure is disposed on a first side of the second RF component,

wherein an antenna is disposed on a second side of the first RF component opposite to the first side of the first RF component, and

wherein the first side of the second RF component is disposed to face the first side of the first RF component.

4. The electronic device of claim 3 ,

wherein the plurality of protrusion portions of the ground structure are in contact with the first side of the first RF component, and

wherein the plurality of support portions of the ground structure are disposed on the first side of the second RF component.

5. The electronic device of claim 1 ,

wherein the substrate portion of the signal structure is in contact with a first side of the first RF component,

wherein the plurality of contact portions of the signal structure are disposed on a first side of the second RF component,

wherein an antenna is disposed on a second side of the first RF component opposite to the first side of the first RF component, and

wherein the first side of the second RF component is disposed to face the first side of the first RF component.

6. The electronic device of claim 5 ,

wherein the plurality of protrusion portions of the ground structure are in contact with the first side of the first RF component, and

wherein the plurality of support portions of the ground structure are disposed on the first side of the second RF component.

7. The electronic device of claim 1 ,

wherein the plurality of contact portions of the signal structure are disposed to have a flexible height from the substrate portion of the signal structure based on a pressure in a direction perpendicular to the first RF component.

8. The electronic device of claim 1 ,

wherein the connection portion of the ground structure and the plurality of protrusion portions of the ground structure are integrally formed, and

wherein the substrate portion of the signal structure and the plurality of contact portions of the signal structure are integrally formed.

9. The electronic device of claim 1 ,

wherein the plurality of contact portions of the signal structure include a first contact portion and a second contact portion,

wherein a first one end of the first contact portion of the signal structure is connected to the substrate portion of the signal structure, and a first another end of the first contact portion of the signal structure is disposed in a first space corresponding to the substrate portion of the signal structure between the first RF component and the second RF component,

wherein a second one end of the second contact portion of the signal structure is connected to the substrate portion of the signal structure, and a second another end of the second contact portion of the signal structure is disposed in a second space corresponding to the substrate portion of the signal structure between the first RF component and the second RF component,

wherein, based on a first pressure, being less than a threshold, provided in a direction toward one side of the substrate portion of the signal structure, the first another end of the first contact portion of the signal structure and the second another end of the second contact portion of the signal structure are in contact with each other, and

wherein, based on a second pressure, being greater than or equal to the threshold, provided in the direction toward one side of the substrate portion of the signal structure, the first another end of the first contact portion of the signal structure and the second another end of the second contact portion of the signal structure are physically spaced apart from each other.

10. The electronic device of claim 1 ,

wherein the first RF component comprises a first printed circuit board (PCB) for an antenna,

wherein the second RF component comprises a second PCB for an RF filter,

wherein a first side of the second RF component is disposed to face a first side of the first RF component,

wherein the antenna is disposed on a second side of the first RF component opposite to the first side of the first RF component, and

wherein the RF filter is disposed on a second side of the second RF component opposite to the first side of the second RF component.

11. An electronic device comprising:

a first radio frequency (RF) component;

a second RF component;

a plurality of connection assemblies disposed between the first RF component and the second RF component,

wherein, each connection assembly of the plurality of connection assemblies comprises:

a ground structure having a first elasticity, and

a signal structure having a second elasticity,

wherein the signal structure electrically connects the first RF component and the second RF component,

wherein the ground structure comprises a plurality of protrusion portions and a connection portion including an opening,

wherein the signal structure comprises a substrate portion and a plurality of contact portions for electric connection, and

wherein the substrate portion of the signal structure and the plurality of contact portions of the signal structure are disposed in a space formed based on the opening of the connection portion of the ground structure.

12. The electronic device of claim 11 ,

wherein the second RF component further comprises, for the connection portion of the ground structure and the plurality of protrusion portions of the ground structure, a ground board for a mounting of each of the plurality of connection assemblies.

13. The electronic device of claim 11 ,

wherein the plurality of contact portions of the signal structure are in contact with a first side of the first RF component,

wherein the substrate portion of the signal structure is disposed in on a first side of the second RF component,

wherein an antenna is disposed on a second side of the first RF component opposite to the first side of the first RF component, and

wherein the first side of the second RF component is disposed to face the first side of the first RF component.

14. The electronic device of claim 13 ,

wherein the ground structure further comprises a plurality of support portions arranged along an edge region of the connection portion of the ground structure,

wherein the plurality of protrusion portions of the ground structure are in contact with the first side of the first RF component, and

wherein the plurality of support portions of the ground structure are disposed on the first side of the second RF component.

15. The electronic device of claim 11 ,

wherein the substrate portion of the signal structure is in contact with a first side of the first RF component,

wherein the plurality of contact portions of the signal structure are disposed on a first side of the second RF component,

wherein an antenna is disposed on a second side of the first RF component opposite to the first side of the first RF component, and

wherein the first side of the second RF component is disposed to face the first side of the first RF component.

16. The electronic device of claim 15 ,

wherein the ground structure further comprises a plurality of support portions arranged along an edge region of the connection portion of the ground structure,

wherein the plurality of protrusion portions of the ground structure are in contact with the first side of the first RF component, and

wherein the plurality of support portions of the ground structure are disposed on the first side of the second RF component.

17. The electronic device of claim 11 ,

wherein the plurality of contact portions of the signal structure are disposed to have a flexible height from the substrate portion of the signal structure, based on a pressure in a direction perpendicular to the first RF component.

18. The electronic device of claim 11 ,

wherein the plurality of connection assemblies includes a plurality of signal structures and a plurality of ground structures,

wherein the plurality of ground structures are formed on one ground plate,

wherein the opening and the plurality of protrusion portions of each of the plurality of ground structures are integrally formed with the one ground plate, and

wherein the substrate portion of the signal structure and the plurality of contact portions of each of the plurality of signal structures are integrally formed.

19. The electronic device of claim 11 ,

wherein the plurality of contact portions of the signal structure include a first contact portion and a second contact portion,

wherein a first one end of the first contact portion is connected to the substrate portion of the signal structure, and a first another end of the first contact portion of the signal structure is disposed in a first space corresponding to the substrate portion of the signal structure between the first RF component and the second RF component,

wherein a second one end of the second contact portion is connected to the substrate portion of the signal structure, and a second another end of the second contact portion of the signal structure is disposed in a second space corresponding to the substrate portion of the signal structure between the first RF component and the second RF component,

wherein, based on a first pressure, being less than a threshold, provided in a direction toward one side of the substrate portion of the signal structure, the first another end of the first contact portion of the signal structure and the second another end of the second contact portion of the signal structure are in contact with each other, and

wherein, based on a second pressure, being greater than or equal to the threshold, provided in the direction toward one side of the substrate portion of the signal structure, the first another end of the first contact portion of the signal structure and the second another end of the second contact portion of the signal structure are physically spaced apart from each other.

20. The electronic device of claim 11 ,

wherein the first RF component comprises a first printed circuit board (PCB) for an antenna,

wherein the second RF component comprises a second PCB for an RF filter,

wherein a first side of the second RF component is disposed to face a first side of the first RF component,

wherein the antenna is disposed on a second side of the first RF component opposite to the first side of the first RF component, and

wherein the RF filter is disposed on a second side of the second RF component opposite to the first side of the second RF component.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (24)