Methods and apparatus for depositing aluminum by physical vapor deposition (PVD) with controlled cooling
Methods and apparatus for performing physical vapor deposition in a reactor chamber to form aluminum material on a substrate including: depositing a first aluminum layer atop a substrate to form a first aluminum region having a first grain size and a first temperature; and cooling the first aluminum region atop a substrate to a second temperature at a rate sufficient to increase the first grain size to a second grain size.
1. A method of performing physical vapor deposition in a reactor chamber to form an aluminum layer on a substrate comprising:
depositing the aluminum layer atop the substrate to form a first aluminum region having a first grain size and a first temperature; and
cooling the first aluminum region atop the substrate in a process gas consisting of one or more inert gases to a second temperature at a rate sufficient to increase the first grain size to a second grain size.
2. The method of claim 1 , further comprising delaying cooling for a first duration.
3. The method of claim 2 , wherein the first duration is about 5 to 120 seconds.
4. The method of claim 1 , wherein cooling is performed at a cooling rate of 20 to 40 degrees Celsius per second.
5. The method of claim 1 , wherein the first temperature is about 375 to 450 degrees Celsius and the second temperature is less than 100 degrees Celsius.
6. The method of claim 1 , wherein depositing the aluminum layer atop the substrate to form a first aluminum region having a first grain size and a first temperature is performed atop a heated surface, and wherein cooling is performed by moving the substrate away from the heated surface.
7. The method of claim 1 , wherein cooling the first aluminum region to a second temperature at a rate sufficient to increase the first grain size to a second grain size further comprises delaying a transfer of the first aluminum region atop the substrate to a rapid cooling chamber.
8. The method of claim 1 , wherein depositing the aluminum layer is performed at a first DC power in an amount of 4 kW to 60 kW.
9. The method of claim 1 , wherein the aluminum layer is deposited by exposing the substrate to aluminum and argon in a physical vapor deposition process.
10. The method of claim 1 , wherein cooling the first aluminum region atop the substrate to a second temperature at a rate sufficient to increase the first grain size to a second grain size further comprises increasing a flow of gas adjacent a backside of the substrate to cool the substrate.
11. The method of claim 1 , wherein the aluminum layer comprises an aluminum alloy comprising other metals in an amount of less than about 1% weight of the total weight of the aluminum layer.
12. A method of performing physical vapor deposition in a reactor chamber on a substrate positioned on a workpiece support underlying an aluminum sputter target, the method comprising:
maintaining the substrate at a first temperature of 200 to 400° C. and a first pressure below 10 mTorr atop a heated workpiece support;
sputtering atoms from the aluminum sputter target by applying a first DC power of about 4 kW to 60 kW to the aluminum sputter target and a first AC target bias power of at least 600 W;
maintaining reaction conditions for a duration sufficient to form a first layer of aluminum having a first grain size;
delaying a cooling of the substrate for a first duration; and
cooling the first layer of aluminum in a process gas consisting of one or more inert gases to a second temperature at a rate sufficient to increase the first grain size to a second grain size.
13. The method of claim 12 , wherein cooling the first layer of aluminum to a second temperature comprises providing a flow of gas adjacent a backside of the substrate to cool the substrate.
14. The method of claim 12 , wherein cooling is performed at a cooling rate of 10 to 40 degrees Celsius per second.
15. The method of claim 12 , wherein delaying further comprises moving the substrate away from the workpiece support.
16. The method of claim 15 , wherein delaying further comprises moving the substrate away from the workpiece support by contacting the substrate with one or more lift pins.
17. The method of claim 12 , wherein delaying comprises delaying a transfer of the substrate to a rapid cooling chamber.
18. A physical vapor depositing chamber, comprising:
a reaction chamber configured for physical vapor depositing a first aluminum layer atop a substrate to form a first aluminum region having a first grain size and a first temperature;
and cooling the first aluminum region atop the substrate in a process gas consisting of one or more inert gases to a second temperature at a rate sufficient to increase the first grain size to a second grain size, wherein the reaction chamber is configured to provide a flow of gas adjacent a backside of the substrate to cool the substrate, and wherein cooling is performed by moving the substrate away from a heated surface.