IP Library Granted Patent US 10,643,672
Granted Patent B2
US 10,643,672 · App. 15/933,687 · Granted May 5, 2020

Memory with non-volatile configurations for efficient power management and operation of the same

Inventors: Jonathan S. Parry (Boise, ID); George B. Raad (Boise, ID); James S. Rehmeyer (Boise, ID); Timothy B. Cowles (Boise, ID)
Assignee: Micron Technology, Inc.
G11C5/14G11C7/22
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Quick Facts
Patent No.
US 10,643,672
App. No.
15/933,687
Granted
May 5, 2020
Kind
B2
Abstract

A memory device is provided. The memory device comprises a memory array and circuitry configured to determine one or more settings for the memory array corresponding to a powered-on state of the memory device, to store the one or more settings in a non-volatile memory location, and in response to returning to the powered-on state from a reduced-power state, to read the one or more settings from the non-volatile memory location.

Claims (45)

1. A memory device, comprising:

a memory array; and

circuitry configured to:

determine one or more settings for the memory array corresponding to a powered-on state of the memory device;

communicate the one or more settings to a connected host device;

store the one or more settings in a non-volatile memory location; and

in response to returning to the powered-on state from a reduced-power state, read the one or more settings from the non-volatile memory location.

2. The memory device of claim 1 , wherein the circuitry is further configured, in response to returning to the powered-on state from the reduced-power state, to read the one or more settings from the non-volatile memory location without re-determining the one or more settings.

3. The memory device of claim 1 , wherein the one or more settings include a read timing setting, a write timing setting, a CMD/CTL/ADDR timing setting, an ODT setting, a voltage setting, a latency setting, a ZQ calibration, an RCOMP resistance, or a combination thereof.

4. The memory device of claim 1 , wherein the circuitry is configured to determine the one or more settings for the memory array in response to receiving a command from the connected host device.

5. The memory device of claim 4 , wherein the circuitry is configured to communicate the one or more settings to the connected host device in response to the command.

6. The memory device of claim 1 , wherein the circuitry is configured to determine the one or more settings for the memory array in response to entering the powered-on state from a powered-off state.

7. The memory device of claim 1 , wherein the circuitry is further configured to cause the memory device to enter the reduced-power state in response to receiving a command from the connected host device.

8. The memory device of claim 1 , wherein the circuitry is further configured to cause the memory device to enter the reduced-power state in response to a determination that the memory device is idle.

9. The memory device of claim 1 , wherein the circuitry is further configured to cause the memory device to return to the powered-on state from the reduced-power state in response to receiving a command from the connected host device.

10. The memory device of claim 1 , wherein the reduced-power state corresponds to a disconnection of at least a portion of the memory array from an applied voltage.

11. The memory device of claim 1 , wherein the memory array comprises a non-volatile memory.

12. The memory device of claim 11 , wherein the non-volatile memory is one of NAND flash, NOR flash, MRAM, FeRAM or PCM.

13. The memory device of claim 11 , wherein the non-volatile memory comprises the non-volatile memory location.

14. The memory device of claim 1 , wherein a single semiconductor chip comprises the circuitry and the memory array.

15. The memory device of claim 1 , wherein a first semiconductor chip comprises the circuitry and a second one or more semiconductor chips comprise the memory array.

16. A method of operating a memory device including a memory array, the method comprising:

determining one or more settings for the memory array corresponding to a powered-on state of the memory device;

communicating the one or more settings to a connected host device;

storing the one or more settings in a non-volatile memory location; and

in response to returning to the powered-on state from a reduced-power state, reading the one or more settings from the non-volatile memory location.

17. The method of claim 16 , further comprising:

in response to returning to the powered-on state from the reduced-power state, reading the one or more settings from the non-volatile memory location without re-determining the one or more settings.

18. The method of claim 16 , wherein the one or more settings include a read timing setting, a write timing setting, a CMD/CTL/ADDR timing setting, an ODT setting, a voltage setting, a latency setting, a ZQ calibration, an RCOMP resistance, or a combination thereof.

19. The method of claim 16 , wherein determining the one or more settings for the memory array is performed in response to receiving a command from the connected host device.

20. The method of claim 19 ,

wherein the one or more settings are communicated to the connected host device in response to the command.

21. The method of claim 16 , wherein determining the one or more settings for the memory array is performed in response to entering the powered-on state from a powered-off state.

22. The method of claim 16 , further comprising:

entering the reduced-power state in response to a determination that the memory device is idle.

23. The method of claim 22 , further comprising:

returning to the powered-on state from the reduced-power state in response to receiving a command from the connected host device.

24. A memory system, comprising:

a host device; and

a memory device including a memory array operably coupled to the host device, the memory device configured to:

determine one or more settings for the memory array corresponding to a powered-on state of the memory device;

communicate the one or more settings to the host device;

store the one or more settings in a non-volatile memory location; and

in response to returning to the powered-on state from a reduced-power state, read the one or more settings from the non-volatile memory location.

25. The memory system of claim 24 , wherein the memory device is further configured to, in response to returning to the powered-on state from the reduced-power state, communicate the one or more settings to the host device after reading the one or more settings from the non-volatile memory location.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
SUPPLEMENT NO. 9 TO PATENT SECURITY AGREEMENT Recorded Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2018
From: PARRY, JONATHAN S.; RAAD, GEORGE B.; REHMEYER, JAMES S.; COWLES, TIMOTHY B.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 045325/0288 →
Continuity (1)
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