Systems for printing three-dimensional objects
The present disclosure provides a system for printing at least a portion of a three-dimensional (3D) object. The system may comprise a source of at least one feedstock, a support for supporting at least a portion of the 3D object, a feeder for directing at least one feedstock from the source towards the support, and a power supply for supplying electrical current. The system may comprise a controller operatively coupled to the power supply. The controller may receive a computational representation of the 3D object. The controller may direct the at least one feedstock through a feeder towards the support and may direct electrical current through the at least one feedstock and into the support. The controller may subject such feedstock to Joule heating such that at least a portion of such feedstock may deposit adjacent to the support, thereby printing the 3D object in accordance with the computational representation.
1. A method for forming a three-dimensional structure, comprising:
(a) bringing a feedstock in contact with a solid object; and
(b) subjecting electrical current to flow from said feedstock to said solid object, or vice versa, while said feedstock and a surface of said solid object are moving relative to one another and while said feedstock is in contact with said surface of said solid object, which flow of said electrical current from said feedstock to said solid object, or vice versa, is sufficient to melt a portion of said feedstock to deposit said portion of said feedstock on said surface of said solid object, thereby forming at least a portion of said three-dimensional structure.
2. The method of claim 1 , wherein said feedstock comprises a metal.
3. The method of claim 1 , wherein said feedstock comprises a plurality of metals.
4. The method of claim 3 , wherein said plurality of metals is a plurality of different metals.
5. The method of claim 1 , wherein said feedstock comprises a polymeric material.
6. The method of claim 1 , wherein said feedstock comprises a non-conductive material and a conductive material.
7. The method of claim 6 , wherein said conductive material heats said non-conductive material upon application of said electrical current.
8. The method of claim 1 , wherein said solid object is a previously deposited portion of said feedstock or another feedstock.
9. The method of claim 1 , further comprising removing said three-dimensional structure from said solid object.
10. The method of claim 1 , wherein said solid object is a support that does not form part of said three-dimensional structure.
11. The method of claim 1 , wherein said solid object is a sacrificial structure that is removed from said three-dimensional structure.
12. The method of claim 1 , wherein said feedstock is a wire.
13. The method of claim 1 , wherein said solid object comprises a metal or a polymer.
14. The method of claim 1 , wherein in (a), said feedstock is brought in contact with said solid object in accordance with a computer design of said three-dimensional structure.
15. A system for forming a three-dimensional structure adjacent to a solid object, comprising:
a source of a feedstock; and
a controller that is configured to subject electrical current to flow from said feedstock to said solid object, or vice versa, while said feedstock and a surface of said solid object are moving relative to one another and while said feedstock is in contact with said surface of said solid object, which flow of said electrical current from said feedstock to said solid object, or vice versa, is sufficient e portion of said feedstock to deposit said portion of said feedstock on said surface of said solid object, thereby forming at least a portion of said three-dimensional structure.
16. The system of claim 15 , wherein said feedstock comprises a metal.
17. The system of claim 15 , wherein said feedstock comprises a plurality of metals.
18. The system of claim 17 , wherein said plurality of metals is a plurality of different metals.
19. The system of claim 15 , wherein said feedstock comprises a polymeric material.
20. The system of claim 15 , wherein said feedstock comprises a non-conductive material and a conductive material.
21. The system of claim 20 , wherein said conductive material heats said non-conductive material upon application of said electrical current.
22. The system of claim 15 , wherein said solid object is a previously deposited portion of said feedstock or another feedstock.
23. The system of claim 15 , wherein said three-dimensional structure is removable from said solid object.
24. The system of claim 15 , wherein said solid object is a support that does not form part of said three-dimensional structure.
25. The system of claim 15 , wherein said solid object is a sacrificial structure that is removed from said three-dimensional structure.
26. The system of claim 15 , wherein said feedstock is a wire.
27. The system of claim 15 , wherein said solid object comprises a metal or a polymer.
28. The system of claim 15 , wherein said controller is configured to bring said feedstock in contact with said solid object.
29. The system of claim 28 , wherein said controller is configured to bring said feedstock in contact with said solid object in accordance with a computer design of said three-dimensional structure.
30. The method of claim 1 , wherein during printing, said portion of said feedstock is deposited in accordance with a computer model of said three-dimensional structure.
31. The method of claim 1 , wherein (b) comprises subjecting said electrical current to flow from said feedstock to said solid object, or vice versa, while said feedstock is moving relative to said surface of said solid object and while said solid object is stationary.
32. The method of claim 1 , wherein (b) comprises subjecting said electrical current to flow from said feedstock to said solid object, or vice versa, while said surface of said solid object is moving relative to said feedstock and while said feedstock is stationary.
33. The system of claim 15 , wherein during printing, said portion of said feedstock is deposited in accordance with a computer model of said three-dimensional structure.
34. The system of claim 15 , wherein said controller is configured to subject said electrical current to flow from said feedstock to said solid object, or vice versa, while said feedstock is moving relative to said surface of said solid object and while said solid object is stationary.
35. The system of claim 15 , wherein said controller is configured to subject said electrical current to flow from said feedstock to said solid object, or vice versa, while said surface of said solid object is moving relative to said feedstock and while said feedstock is stationary.
36. The method of claim 1 , wherein, over a period of time, (1) said feedstock is continuously directed from a source of said feedstock to and in contact with said surface of said solid object, and (2) said electrical current is subjected to flow from said feedstock to said solid object, or vice versa.
37. The system of claim 15 , wherein said controller is configured to, over a period of time, (1) continuously direct said feedstock from said source of said feedstock to and in contact with said surface of said solid object, and (2) subject said electrical current to flow from said feedstock to said solid object, or vice versa.