Semiconductor device and method for manufacturing the same
View Patent ↗A semiconductor device includes a metal column that extends in a stretching direction; a polymer layer that surrounds the metal column from a direction crossing the stretching direction; and a guide that surrounds the polymer layer in the crossing direction so as to be spaced from the metal column with the polymer layer interposed therebetween. A method for manufacturing semiconductor devices includes a step of filling a mixture containing metal particles and polymers in a guide; and a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column that stretches in a stretching direction of the guide from the metal particles.
1. A method for manufacturing semiconductor devices comprising:
a step of filling a mixture containing metal particles and polymers in a guide; and
a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column that stretches in a stretching direction of the guide from the metal particles, wherein
a pair of the guides is provided so as to extend in a horizontal direction, and
the mixture is filled between the guide and a heat treatment is performed whereby the polymer layer that makes contact with the guides is formed and the metal column that stretches in a horizontal direction is formed so as to be spaced from the guides with the polymer layer interposed therebetween.
2. The method for manufacturing semiconductor devices according to claim 1 , wherein
the step of subjecting the mixture to the heat treatment is a step of subjecting the mixture to a heat treatment at a higher temperature than a melting point of the polymers.
3. A method for manufacturing semiconductor devices comprising:
a step of filling a mixture containing metal particles and polymers in a guide; and
a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column that stretches in a stretching direction of the guide from the metal particles, wherein
the guide is hydrophilic, and
the polymers include at least hydrophilic polymers.
4. The method for manufacturing semiconductor devices according to claim 3 , wherein
the polymers include hydrophilic polymers and hydrophobic polymers, and
in the step of subjecting the mixture to the heat treatment, the hydrophilic polymers agglomerate to the guide and the hydrophobic polymers agglomerate away from the guide.
5. The method for manufacturing semiconductor devices according to claim 3 , wherein
the step of subjecting the mixture to the heat treatment is a step of subjecting the mixture to a heat treatment at a higher temperature than a melting point of the polymers.
6. A method for manufacturing semiconductor devices comprising:
a step of filling a mixture containing metal particles and polymers in a guide; and
a step of subjecting the mixture to a heat treatment so that the polymers agglomerate to the guide to form a polymer layer that makes contact with the guide and the metal particles agglomerate away from the guide with the polymer layer interposed therebetween to form a metal column that stretches in a stretching direction of the guide from the metal particles, wherein
the guide is hydrophobic, and
the polymers include at least hydrophobic polymers.
7. The method for manufacturing semiconductor devices according to claim 6 , wherein
the polymers include hydrophilic polymers and hydrophobic polymers, and
in the step of subjecting the mixture to the heat treatment, the hydrophobic polymers agglomerate to the guide and the hydrophilic polymers agglomerate away from the guide.
8. The method for manufacturing semiconductor devices according to claim 6 , wherein
the step of subjecting the mixture to the heat treatment is a step of subjecting the mixture to a heat treatment at a higher temperature than a melting point of the polymers.