Cooling electronic devices in a data center
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
1. A thermosiphon cooling system for a rack-mounted device in a data center, comprising:
an evaporator;
a condenser fluidly coupled to the evaporator with a fluid pathway that slopes downward from the condenser to the evaporator;
a working fluid enclosed within the evaporator, the condenser, and the fluid pathway;
means for determining at least one parameter associated with an amount of heat generated by the rack-mounted device; and
means for adjusting a liquid level of the working fluid in the evaporator based, at least in part, on the parameter associated with the amount of heat generated by the rack-mounted device.
2. The thermosiphon cooling system of claim 1 , wherein the means for adjusting a liquid level of the working fluid in the evaporator comprises means for vibrating the condenser.
3. The thermosiphon cooling system of claim 1 , wherein the means for adjusting a liquid level of the working fluid in the evaporator comprises means for adjusting a vertical distance between the condenser and the evaporator.
4. The thermosiphon cooling system of claim 1 , wherein the means for adjusting a liquid level of the working fluid in the evaporator comprises means for adjusting a rate of liquid flowing in the fluid pathway from the condenser to the evaporator.
5. The thermosiphon cooling system of claim 4 , wherein the means for adjusting a rate of liquid flowing in the fluid pathway from the condenser to the evaporator is mounted in a liquid line of the fluid pathway.
6. The thermosiphon cooling system of claim 4 , wherein the means for adjusting a rate of liquid flowing in the fluid pathway comprises an adjustable valve and a wick member.
7. The thermosiphon cooling system of claim 1 , wherein the parameter comprises at least one of: a temperature of air adjacent the rack-mounted device, a temperature of air adjacent the condenser, a temperature of the rack-mounted device, a temperature of a surface that supports the rack-mounted device, the liquid level of the working fluid in the evaporator, a pressure of the working fluid, a temperature of the working fluid, the power usage of the rack-mounted device, a frequency of the rack-mounted device, or a utilization of the rack-mounted device.
8. The thermosiphon cooling system of claim 1 , further comprising a fan positioned to circulate an airflow over the condenser.
9. The thermosiphon cooling system of claim 1 , further comprising one or more heat transfer surfaces mounted to the condenser.
10. The thermosiphon cooling system of claim 1 , wherein the working fluid comprises water or a refrigerant.