Cooling device having a boiling chamber with submerged condensation and method
A device and method including a boiling chamber in which boiling occurs in a pool of liquid and condensation occurs in the same chamber to remove the heat from the condensation process of the bubbles generated during the boiling process mainly through submerged condensation are disclosed.
1. A cooling device, comprising:
a thermally conductive boiling chamber comprising a section configured to contain liquid, a section configured to contain vapor in contact with the section configured to contain liquid, and a heating section comprising a boiling surface in communication with a heat source and the section configured to contain liquid; and
a cooling element configured to communicate with an external cooling source and disposed in at least the section configured to contain liquid and above the boiling surface, wherein when liquid is present in the section configured to contain liquid the cooling element is at least partially submerged and the boiling surface is submerged in the liquid, wherein the liquid that comes in contact with a surface of the cooling element is subcooled and the liquid that comes in contact with the boiling surface is heated resulting in boiling and vapor generation forming bubbles, the bubbles condense in at least subcooled liquid or at least on the surface of the cooling element submerged in the liquid and heat is exchanged between the heat source and the cooling element.
2. The device of claim 1 , wherein a closest part of the cooling element to the heat source is less than 15 mm away from a surface of the heat source.
3. The device of claim 1 , wherein a closest part of the cooling element to the heat source is less than 30 mm away from a surface of the heat source.
4. The device of claim 1 , wherein a closest part of the cooling element to the heat source is less than 50 mm away from a surface of the heat source.
5. The device of claim 1 , wherein a portion of the cooling element is in direct contact with a surface of the boiling chamber.
6. The device of claim 1 , wherein a height of an enclosed space within the boiling chamber above the heat source is in a range of from 10 mm to 30 mm.
7. The device of claim 1 , further comprising pool boiling enhancement features in the boiling chamber.
8. The device of claim 1 , further comprising at least one diverter within the boiling chamber configured to divert liquid towards the heating section.
9. The device of claim 1 , further comprising at least one diverter within the boiling chamber configured to divert vapor towards the cooling element.
10. A process for dissipating heat, comprising:
heating a first portion of liquid within a partially liquid-filled thermally conductive sealed boiling chamber with a boiling surface in communication with a heat source to generate bubbles;
subcooling a second portion of the liquid with an external cooling source in communication with a cooling element at least partially submerged in the partially liquid-filled boiling chamber; and
condensing the bubbles in at least subcooled liquid or at least on the partially submerged cooling element, thereby exchanging heat between the heat source and the cooling element.
11. The process of claim 10 , wherein the heat source dissipates heat at a heat transfer rate in a range of from 50 W to 4000 W in the boiling chamber.
12. The process of claim 10 , wherein the heat source dissipates heat at a heat transfer rate of at least 50 Watts in the boiling chamber.
13. The process of claim 10 , further comprising directing the bubbles to flow towards the cooling element by at least one diverter within the boiling chamber.
14. The process of claim 10 , further comprising diverting the liquid towards the heat source by at least one diverter within the boiling chamber.
15. The process of claim 10 , further comprising diverting the bubbles and creating motion of the liquid over the cooling element by at least one diverter within the boiling chamber.
16. The process of claim 10 , wherein the liquid is water.
17. The process of claim 10 , wherein the liquid is a dielectric fluid.
18. The process of claim 10 , further comprising supplementing the external cooling source by an interface with a second external cooling source as part of a secondary cooling loop.
19. The process of claim 10 , further comprising maintaining a height of the liquid in the partially filled boiling chamber in a range of from 5 mm to 100 mm.
20. The process of claim 10 , further comprising maintaining a percentage of a surface area of the at least partially submerged cooling element exchanging heat with liquid in the boiling chamber in a range of from 10% to 100% of a total surface area of the cooling element.