Cooling electronic devices in a data center

1. A server tray package, comprising:

a motherboard assembly that comprises a plurality of data center electronic devices, the plurality of data center electronic devices comprising at least one heat generating processor device;

a liquid cold plate assembly that comprises:

a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices, the base portion comprising a ring member that circumscribes the volume; and

a top portion coupled to the ring member and mounted to the base portion and comprising a perimeter member coupled to a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member comprising an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the ring member coupled to the perimeter member and comprising a thickness less than a thickness of the heat transfer member, the perimeter member integrally formed with the heat transfer member to at least partially define the cooling liquid flow path; and

a seal positioned between the heat transfer member and the plurality of data center electronic devices.

2. The server tray package of claim 1 , wherein the liquid cold plate assembly further comprises a plurality of heat transfer surfaces enclosed within the cooling liquid flow path.

3. The server tray package of claim 1 , wherein the seal comprises a thermal interface material positioned to directly contact a bottom surface of the top portion and a top surface of each of the plurality of data center electronic devices.

4. The server tray package of claim 3 , wherein the thermal interface material comprises a metallization layer.

5. The server tray package of claim 4 , wherein the liquid cold plate assembly further comprises a plurality of heat transfer surfaces enclosed within the cooling liquid flow path.

6. The server tray package of claim 5 , wherein the metallization layer at least partially defines the cooling liquid flow path.

7. The server tray package of claim 6 , wherein the metallization layer is positioned through a plurality of flow channels formed on a top surface of the heat generating processor device, the plurality of flow channels in fluid communication with the cooling liquid flow path.

8. The server tray package of claim 7 , further comprising circulating the flow of cooling liquid through a plurality of flow channels formed on a top surface of the heat generating processor device, at least a portion of each of the plurality of flow channels filled with the metallization layer.

9. The server tray package of claim 1 , further comprising another seal positioned between the ring member and the plurality of data center electronic devices.

10. The server tray package of claim 1 , further comprising at least one mechanical fastener that couples the ring member to the top portion.

11. The server tray package of claim 1 , wherein the seal comprises a metallization layer that at least partially defines the cooling liquid flow path.

12. The server tray package of claim 11 , wherein the metallization layer is positioned through a plurality of flow channels formed on a top surface of the heat generating processor device, the plurality of flow channels in fluid communication with the cooling liquid flow path.

13. The server tray package of claim 12 , further comprising a gasket mounted between a bottom surface of the heat transfer member and top surfaces of fins that define the plurality of flow channels formed on the top surface of the heat generating processor device.

14. The server tray package of claim 1 , further comprising one or more fans mounted on or near the motherboard assembly.

15. The server tray package of claim 1 , wherein the motherboard assembly comprises a motherboard, a silicon interposer, and a substrate.

16. A method for cooling heat generating devices in a data center, comprising:

circulating a flow of a cooling liquid to a server tray package that comprises:

a motherboard assembly that comprises a plurality of data center electronic devices that include at least one heat generating processor device; and a liquid cold plate assembly that comprises a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices, and a top portion mounted to the base portion and comprising a heat transfer member shaped to thermally contact the heat generating processor device;

circulating the flow of the cooling liquid into an inlet port of the heat transfer member;

circulating the flow of the cooling liquid between the heat transfer member and a seal positioned between the heat transfer member and the heat generating processing device;

circulating the flow of the cooling liquid from the inlet port through a cooling liquid flow path defined through the heat transfer member to transfer heat from the at least one heat generating processor device to the cooling liquid; and

circulating the heated flow of the cooling liquid from the cooling liquid flow path to an outlet port of the heat transfer member.

17. The method of claim 16 , wherein circulating the flow of the cooling liquid through the cooling liquid flow path defined through the heat transfer member comprises circulating the cooling liquid through a plurality of flow channels defined by a plurality of heat transfer surfaces enclosed within the cooling liquid flow path.

18. The method of claim 16 , further comprising transferring the heat from the at least one heat generating processor device through the seal, the seal comprising a thermal interface material positioned to directly contact a bottom surface of the top portion and a top surface of the at least one heat generating processor device.

19. The method of claim 18 , wherein the thermal interface material comprises a metallization layer.

20. The method of claim 19 , further comprising circulating the heated flow of the cooling liquid through a portion of the cooling liquid flow path defined by a perimeter member of the top portion that is integrally formed with the heat transfer member and at least partially defines the cooling liquid flow path.

21. The method of claim 20 , wherein the metallization layer at least partially defines the cooling liquid flow path.

22. The method of claim 21 , further comprising circulating the flow of cooling liquid through a plurality of flow channels formed on a top surface of the heat generating processor device, at least a portion of each of the plurality of flow channels filled with the metallization layer.

23. The method of claim 22 , wherein the plurality of flow channels are formed by fins or ridges.

24. The method of claim 16 , further comprising circulating the heated flow of the cooling liquid through a portion of the cooling liquid flow path defined by a perimeter member of the top portion that is integrally formed with the heat transfer member and at least partially defines the cooling liquid flow path.

25. The method of claim 16 , wherein the seal comprises a metallization layer that at least partially defines the cooling liquid flow path.

26. The method of claim 25 , further comprising circulating the flow of cooling liquid through a plurality of flow channels formed on a top surface of the heat generating processor device, at least a portion of each of the plurality of flow channels filled with the metallization layer.

27. The method of claim 16 , further comprising circulating a cooling airflow over the motherboard assembly.

28. The method of claim 16 , wherein the motherboard assembly comprises a motherboard, a silicon interposer, and a substrate.