Circuit board assembly and method of manufacturing the same, packaging structure having the same
A circuit board assembly and a packaging structure are provided. A method of manufacturing the circuit board includes: providing a circuit substrate, the circuit substrate having a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer; mounting an electronic component in the cavity, the electronic component electrically connected to the exposed wiring layer; filling a heat conductive medium in the cavity, the electronic component immersed in the heat conductive medium; forming a conductive cover on the conductive casing, the conductive cover enclosing the conductive casing.
1 . A circuit board assembly comprising:
a circuit substrate comprising a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer;
an electronic component mounted in the cavity, the electronic component electrically connected to the exposed wiring layer;
a heat conductive medium filled in the cavity, the electronic component immersed in the heat conductive medium;
a conductive cover formed on the conductive casing, the conductive cover enclosing the conductive casing; and
a first protective film on the first wiring layer, wherein the first protective film defines a window configured for the conductive casing to pass through.
2 . The circuit board assembly of claim 1 , wherein the wiring layer comprises a pad exposed from the cavity, the electronic component comprises a main body and a pin connected to the main body, and the pin is connected to the pad.
3 . The circuit board assembly of claim 1 , wherein the conductive cover comprises a first portion and a second portion wider than the first portion, the first portion is inserted into the conductive casing, and the second portion is located on a top end of the conductive casing.
4 . The circuit board assembly of claim 3 , wherein a thickness of the second portion is at least 10 microns.
5 . The circuit board assembly of claim 2 , wherein the circuit substrate further comprises a conductive body, and the conductive body extends through the base layer and connected to the pad.
6 . A packaging structure comprising:
a circuit board assembly comprising:
a circuit substrate comprising a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer;
an electronic component mounted in the cavity, the electronic component electrically connected to the exposed wiring layer;
a heat conductive medium filled in the cavity, the electronic component immersed in the heat conductive medium; and
a conductive cover formed on the conductive casing, the conductive cover enclosing the conductive casing; and
a packaging board formed on the circuit board assembly, the packaging board comprising an insulator and an inner wiring layer arranged in the insulator, the packaging board defining a slot for partially exposing the inner wiring layer, the conductive casing received in the slot and connected to the exposed inner wiring layer.
7 . The packaging structure of claim 6 , wherein the wiring layer comprises a pad exposed from the cavity, the electronic component comprises a main body and a pin connected to the main body, and the pin is connected to the pad.
8 . The packaging structure of claim 6 , wherein the conductive cover comprises a first portion and a second portion wider than the first portion, the first portion is inserted into the conductive casing, and the second portion is located on a top end of the conductive casing.
9 . The packaging structure of claim 8 , wherein a thickness of the second portion is at least 10 microns.
10 . The packaging structure of claim 7 , wherein the circuit substrate further comprises a conductive body, and the conductive body extends through the base layer and connected to the pad.
11 . The packaging structure of claim 6 , wherein the circuit board assembly further comprises a first protective film on the first wiring layer, and the first protective film defines a window for the conductive casing to extend through.
12 . The packaging structure of claim 6 , wherein the heat conductive medium comprises a fluorinated liquid.