IP Library › Granted Patent US 10,225,958
Granted Patent B1
US 10,225,958 · App. 15/970,620 · Granted Mar 5, 2019

Liquid cooling system for a data center

Inventor: Tianyi Gao (Sunnyvale, CA)
Assignee: BAIDU USA LLC
H05K7/20772
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Quick Facts
Patent No.
US 10,225,958
App. No.
15/970,620
Filed
May 3, 2018
Granted
Mar 5, 2019
Kind
B1
Art Unit
2847
USPC
361/679.53
Abstract

Embodiments are disclosed of a server rack including a rack adapted to accommodate one or more servers, each server including one or more components. An inlet manifold is positioned in or on the rack, the inlet manifold including an embedded supply pump having an inlet and an outlet, the inlet being coupled to a main supply line and the outlet being coupled to at least one sub-loop supply line. An outlet manifold is also positioned in or on the rack, the outlet manifold including an embedded return pump having an inlet and an outlet, the pump inlet being coupled to at least one sub-loop return line and the pump outlet being coupled to a main return line. A total liquid cooling architecture is proposed for liquid cooled electronic racks and data centers.

Claims (36)

1. A server rack comprising:

a rack adapted to accommodate one or more servers, each server including one or more components;

an inlet manifold positioned in or on the rack, the inlet manifold including an embedded supply pump having an inlet and an outlet, the inlet being coupled to a main supply line and the outlet being coupled to at least one sub-loop supply line; and

an outlet manifold positioned in or on the rack, the outlet manifold including an embedded return pump having an inlet and an outlet, the pump inlet being coupled to at least one sub-loop return line and the pump outlet being coupled to a main return line.

2. The server rack of claim 1 , further comprising an inlet manifold housing within which the inlet manifold is positioned and an outlet manifold housing within which the outlet manifold is positioned.

3. The server rack of claim 1 , further comprising a single housing within which the inlet manifold and the outlet manifold are positioned.

4. The server rack of claim 1 , further comprising one more servers positioned in the rack.

5. The server rack of claim 4 wherein at least one component on each server is coupled to a liquid-cooled cooling module, each liquid-cooled cooling module being coupled to a sub-loop supply line and a sub-loop return line so that each liquid-cooled cooling module and its sub-loop supply line and sub-loop return line form a cooling sub-loop.

6. The server rack of claim 5 wherein the embedded supply pump and the embedded return pump are variable-speed pumps, such that the supply pump and return pump can control the flow rate of a working fluid through each cooling sub-loop.

7. The server rack of claim 1 wherein the main supply line extends from outside the rack to the embedded supply pump and the main return line extends from the embedded return pump to outside the rack.

8. A data center comprising:

a facility;

a plurality of server racks positioned within the facility, each server rack including:

a rack housing therein one or more servers, each server including one or more components,

an inlet manifold positioned in or on the rack, the inlet manifold including an embedded supply pump having an inlet and an outlet, the inlet being coupled to a main supply line and the outlet being coupled to at least one sub-loop supply line,

an outlet manifold positioned in or on the rack, the outlet manifold including an embedded return pump having an inlet and an outlet, the pump inlet being coupled to at least one sub-loop return line and the pump outlet being coupled to a main return line, and

wherein at least one component on each server is coupled to a liquid-cooled cooling module, each liquid-cooled cooling module being coupled to a sub-loop supply line and a sub-loop return line so that each liquid-cooled cooling module and its sub-loop supply line and sub-loop return line form a cooling sub-loop;

a facility supply line coupled to the main supply line of each inlet manifold;

a facility return line coupled to the main return line of each outlet manifold;

a heat exchanger positioned outside the facility and coupled to the facility supply line and the facility return line;

a facility pump coupled in the facility supply line.

9. The data center of claim 8 wherein the heat exchanger is a liquid-to-liquid heat exchanger or a liquid-to-atmosphere heat exchanger.

10. The data center of claim 8 wherein each server rack further comprises an inlet manifold housing within which the inlet manifold is positioned and an outlet manifold housing within which the outlet manifold is positioned.

11. The data center of claim 8 wherein each server rack further comprises a single housing within which the inlet manifold and the outlet manifold are positioned.

12. The data center of claim 11 wherein at least one component on each server is coupled to a liquid-cooled cooling module, each liquid-cooled cooling module being coupled to a sub-loop supply line and a sub-loop return line so that each liquid-cooled cooling module and its sub-loop supply line and sub-loop return line form a cooling sub-loop.

13. The data center of claim 12 wherein the embedded supply pump and the embedded return pump are variable-speed pumps, such that the supply pump and return pump can control the flow rate of a working fluid through each cooling sub-loop.

14. The data center of claim 8 wherein the main supply line extends from outside the rack to the embedded supply pump and the main return line extends from the embedded return pump to outside the rack.

15. A server rack comprising:

a rack housing therein one or more servers, each server including one or more components;

an inlet manifold positioned in or on the rack, the inlet manifold including an embedded supply pump having an inlet and an outlet, the inlet being coupled to a main supply line and the outlet being coupled to at least one sub-loop supply line; and

an outlet manifold positioned in or on the rack, the outlet manifold including an embedded return pump having an inlet and an outlet, the pump inlet being coupled to at least one sub-loop return line and the pump outlet being coupled to a main return line;

wherein at least one component on each server is coupled to a liquid-cooled cooling module, each liquid-cooled cooling module being coupled to a sub-loop supply line and a sub-loop return line so that each liquid-cooled cooling module and its sub-loop supply line and sub-loop return line form a cooling sub-loop.

16. The server rack of claim 15 , further comprising an inlet manifold housing within which the inlet manifold is positioned and an outlet manifold housing within which the outlet manifold is positioned.

17. The server rack of claim 15 , further comprising a single housing within which the inlet manifold and the outlet manifold are positioned.

18. The server rack of claim 17 wherein the embedded supply pump and the embedded return pump are variable-speed pumps, such that the supply pump and return pump can control the flow rate of a working fluid through each cooling sub-loop.

19. The server rack of claim 15 wherein the main supply line extends from outside the rack to the embedded supply pump and the main return line extends from the embedded return pump to outside the rack.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2018
From: GAO, TIANYI
To: BAIDU USA LLC
Reel/Frame 045882/0603 →
Cited By (14)
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