IP Library Granted Patent US 10,546,636
Granted Patent B2
US 10,546,636 · App. 15/971,723 · Granted Jan 28, 2020

Apparatuses and methods for accessing variable resistance memory device

Inventors: Paolo Fantini (Vimercati, IT); Daniele Ielmini (Bergamo, IT); Nicola Ciocchini (Talamona, IT)
Assignee: Micron Technology, Inc.
G11C13/003G11C13/0004G11C13/0069G11C2013/0073G11C2013/0092G11C2213/76
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Quick Facts
Patent No.
US 10,546,636
App. No.
15/971,723
Granted
Jan 28, 2020
Kind
B2
Abstract

The disclosed technology generally relates to memory apparatuses and methods of operating the same, and more particularly to a memory device having a controller configured to cause a write operation to be performed on a variable resistance memory cell, which includes application of two successive access pulses having opposite polarities, and methods of using the same.

Claims (30)

1. An apparatus comprising:

a memory cell comprising a chalcogenide material; and

a memory controller configured to initiate a dual pulse for a single operation by:

applying a first pulse having a positive polarity and a first bias and a second bias different from the first bias, wherein the memory cell is in a reset state after application of the first pulse having the positive polarity; and

applying a second pulse having a magnitude lower than a magnitude of the first pulse and having a third bias and a fourth bias different from the third bias, wherein the memory cell is in the reset state after application of the second pulse.

2. The apparatus of claim 1 , wherein the memory controller is configured to increase a resistance of the memory cell from a low resistance state in a set state to a high resistance state in the reset state based at least in part on applying the first pulse.

3. The apparatus of claim 1 , wherein the memory controller is configured to apply the first pulse while the memory cell is in a set state.

4. The apparatus of claim 1 , wherein the memory controller is further configured to apply the second pulse having a negative polarity by reversing the polarities of the first and second electrodes following the first pulse.

5. The apparatus of claim 1 , wherein the first bias is higher than the second bias, and wherein the third bias is higher than the fourth bias.

6. The apparatus of claim 1 , wherein the memory cell is configured to remain in the reset state after application of the first pulse and during application of the second pulse.

7. The apparatus of claim 1 , wherein the memory controller is configured to change the chalcogenide material from a first phase to a second phase based at least in part on applying the first pulse.

8. The apparatus of claim 1 , wherein the single operation is a RESET operation.

9. The apparatus of claim 1 , wherein the memory cell comprises at least one of a storage element or a selector element.

10. The apparatus of claim 1 , wherein the memory cell comprises a first electrode and a second electrode, and wherein the memory controller is configured to apply the first pulse with the positive polarity and to apply the second pulse with a negative polarity.

11. A method comprising:

accessing a memory cell comprising a chalcogenide material;

applying a dual pulse to perform a single access operation, wherein applying the dual pulse comprises:

applying a first pulse having a positive polarity and a first bias and a second bias different from the first bias, wherein the memory cell is in a reset state after application of the first pulse having the positive polarity; and

applying a second pulse having a magnitude lower than a magnitude of the first pulse and having a third bias and a fourth bias different from the third bias, wherein the memory cell is in the reset state after application of the second pulse.

12. The method of claim 11 , further comprising:

increasing a resistance of the memory cell from a low resistance state in a set state to a high resistance state in the reset state based at least in part on applying the first pulse.

13. The method of claim 11 , further comprising:

applying the second pulse immediately after the first pulse.

14. The method of claim 11 , further comprising:

maintaining the memory cell in the reset state after application of the first pulse and during application of the second pulse.

15. The method of claim 11 , wherein applying the first pulse comprises:

initiating a phase change of the chalcogenide material from a first phase to a second phase that is different from the first phase.

16. The method of claim 11 , wherein the first bias is higher than the second bias, and wherein the third bias is higher than the fourth bias.

17. The method of claim 11 , wherein applying the first pulse comprises applying the first pulse with the positive polarity between a first electrode and a second electrode;

the method further comprising reversing the polarities of the first electrode and the second electrode after applying the first pulse, wherein applying the second pulse comprises applying the second pulse with a negative polarity.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
SUPPLEMENT NO. 9 TO PATENT SECURITY AGREEMENT Recorded Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Continuity (2)
Continuation 14535099 · Nov 6, 2014
Related Publication 20180261284A1 · Sep 13, 2018