IP Library Granted Patent US 10,366,994
Granted Patent B2
US 10,366,994 · App. 15/975,598 · Granted Jul 30, 2019

Memory devices which include memory arrays

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Quick Facts
Patent No.
US 10,366,994
App. No.
15/975,598
Granted
Jul 30, 2019
Kind
B2
Abstract

Some embodiments include a memory device. The device has a fin with a first source/drain region, a second source/drain region and a channel region. The first source/drain region extends to a first height. The second source/drain region extends to a second height less than the first height. The channel region extends along a trough between the first and second source/drain regions. A charge-storage device is over the first source/drain region. A first sense/access line is along a sidewall of the fin and is spaced from the channel region by dielectric material. A second sense/access line is over the second source/drain region. An uppermost surface of the second sense/access line is beneath an uppermost surface of the first source/drain region. Some embodiments include memory arrays, and some embodiments include methods of forming memory arrays.

Claims (13)

1. A memory device comprising a memory array, wherein the memory array comprises:

a fin having a first source/drain region, a second source/drain region and a channel region between the first source/drain region and the second source/drain region; the first source/drain region extending to a first height; the second source/drain region extending to a second height less than the first height; the channel region extending along a trough between the first source/drain region and the second source/drain region;

a charge-storage device over the first source/drain region and electrically coupled with the first source/drain region;

a first sense/access line along a sidewall of the fin and spaced from the channel region by dielectric material; and

a second sense/access line over the second source/drain region and electrically coupled with the second source/drain region; an uppermost surface of the second sense/access line being beneath an uppermost surface of the first source/drain region.

2. The memory device of claim 1 wherein the second access/sense line comprises metal-containing material over conductively-doped semiconductor material.

3. The memory device of claim 1 wherein the charge-storage device is a capacitor.

4. The memory device of claim 1 wherein the first and second source/drain regions are p-type regions.

5. The memory device of claim 1 wherein the first and second source/drain regions are n-type regions.

6. The memory device of claim 3 wherein a portion of the capacitor extends to over the second access/sense line.

7. The memory device of claim 1 wherein the second access/sense line comprises metal and extends to a region peripheral to the memory array.

8. The memory device of claim 7 wherein the second access/sense line extends to sense amplifier circuitry within the region peripheral to the memory array.

9. The memory device of claim 7 wherein the second access/sense line extends to row driver circuitry within the region peripheral to the memory array.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
SUPPLEMENT NO. 9 TO PATENT SECURITY AGREEMENT Recorded Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →