IP Library › Granted Patent US 10,504,917

Granted Patent B2

US 10,504,917 · App. 15/975,893 · Granted Dec 10, 2019

Arrays of elevationally-extending strings of memory cells and methods of forming memory arrays

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Quick Facts

Patent No.: US 10,504,917
App. No.: 15/975,893
Granted: Dec 10, 2019
Kind: B2

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Abstract

An array of elevationally-extending strings of memory cells comprises a vertical stack of alternating insulative levels and wordline levels. The wordline levels have terminal ends corresponding to control-gate regions. Charge-storage material of individual memory cells extend elevationally along individual of the control-gate regions of the wordline levels and do not extend elevationally along the insulative levels. A charge-blocking region of the individual memory cells extends elevationally along the individual control-gate regions of the wordline levels laterally through which charge migration between the individual control-gate regions and the charge-storage material is blocked. Channel material extends elevationally along the stack and is laterally spaced from the charge-storage material by insulative charge-passage material. All of the charge-storage material of individual of the elevationally-extending strings of memory cells is laterally outward of all of the insulative charge-passage material of the individual elevationally-extending strings of memory cells. Other embodiments, including method embodiments, are disclosed.

Claims (45)

1. An array of elevationally-extending strings of memory cells, comprising:

a vertical stack of alternating insulative levels and wordline levels, the wordline levels having terminal ends corresponding to control-gate regions;

charge-storage material of individual memory cells extending elevationally along individual of the control-gate regions of the wordline levels and not extending elevationally along the insulative levels;

a charge-blocking region of the individual memory cells extending elevationally along the individual control-gate regions of the wordline levels;

channel material extending elevationally along the stack and being laterally spaced from the charge-storage material by insulative charge-passage and material;

all of the charge-storage material of individual of the elevationally-extending strings of memory cells being laterally outward of all of the insulative charge-passage material of the individual elevationally-extending strings of memory cells; and

intervening material laterally between the control-gate regions and the charge-storage material, the intervening material comprising at least one of a semi-metal, an elemental metal, and a metal compound.

2. The array of claim 1 wherein,

the insulative levels comprise insulator material; and

the charge-storage material of the individual elevationally-extending strings of memory cells and the insulator material of the insulative levels each have planar-laterally-innermost surfaces in vertical cross-section that are co-planar.

3. The array of claim 2 wherein the co-planar surfaces are vertical.

4. The array of claim 1 wherein the intervening material is directly against the charge-storage material.

5. The array of claim 1 wherein the intervening material is directly against the charge-blocking region.

6. The array of claim 1 wherein the intervening material is directly against the control-gate regions.

7. The array of claim 1 wherein the intervening material is laterally thinner than the charge-storage material.

8. The array of claim 1 wherein the intervening material has the same lateral thickness as that of the charge-storage material.

9. The array of claim 1 wherein the intervening material comprises a semi-metal, the semi-metal being at least one of doped and/or undoped silicon or germanium.

10. The array of claim 1 wherein the intervening material comprises an elemental metal, the elemental metal being at least one of indium, aluminum, cobalt, nickel, molybdenum, and tungsten.

11. The array of claim 10 wherein the elemental metal is indium.

12. The array of claim 10 wherein the elemental metal is aluminum.

13. The array of claim 10 wherein the elemental metal is cobalt.

14. The array of claim 10 wherein the elemental metal is nickel.

15. The array of claim 10 wherein the elemental metal is molybdenum.

16. The array of claim 10 wherein the elemental metal is tungsten.

17. An array of elevationally-extending strings of memory cells, comprising:

a vertical stack of alternating insulative levels and wordline levels, the wordline levels having terminal ends corresponding to control-gate regions, the insulative levels comprising insulator material;

a charge-blocking region of the individual memory cells extending elevationally along the individual control-gate regions of the wordline levels;

channel material extending elevationally along the stack and being laterally spaced from the charge-storage material by insulative charge-passage material extending elevationally along the stack;

the charge-storage material of individual of the elevationally-extending strings of memory cells and the insulator material of the insulative levels each having planar-laterally-innermost surfaces in vertical cross-section that are co-planar; and

18. The array of claim 17 wherein the co-planar surfaces are vertical.

19. The array of claim 17 wherein the intervening material is directly against the charge-storage material.

20. The array of claim 17 wherein the intervening material is directly against the charge-blocking region.

21. The array of claim 17 wherein the intervening material is directly against the control-gate regions.

22. The array of claim 17 wherein the intervening material is laterally thinner than the charge-storage material.

23. The array of claim 17 wherein the intervening material has the same lateral thickness as that of the charge-storage material.

24. The array of claim 17 wherein the intervening material comprises a semi-metal, the semi-metal being at least one of doped and/or undoped silicon or germanium.

25. The array of claim 17 wherein the intervening material comprises an elemental metal, the elemental metal being at least one of indium, aluminum, cobalt, nickel, molybdenum, and tungsten.

26. The array of claim 25 wherein the elemental metal is indium.

27. The array of claim 25 wherein the elemental metal is aluminum.

28. The array of claim 25 wherein the elemental metal is cobalt.

29. The array of claim 25 wherein the elemental metal is nickel.

30. The array of claim 25 wherein the elemental metal is molybdenum.

31. The array of claim 25 wherein the elemental metal is tungsten.

Assignments (4)

RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019

From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT

To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.

Reel/Frame 051028/0001 →

RELEASE OF SECURITY INTEREST Recorded Oct 11, 2019