Source/drain parasitic capacitance reduction in FinFET-based semiconductor structure having tucked fins
A method of reducing parasitic capacitance includes providing a starting semiconductor structure, the starting semiconductor structure including a semiconductor substrate with fin(s) thereon, the fin(s) having at least two dummy transistors integrated therewith and separated by a dielectric region, the dummy transistors including dummy gates with spacers and gate caps, the fin(s) having ends tucked by the dummy gates. The method further includes removing the dummy gates and gate caps, resulting in gate trenches, protecting area(s) of the structure during fabrication process(es) where source/drain parasitic capacitance may occur, and forming air-gaps at a bottom portion of unprotected gate trenches to reduce parasitic capacitance. The resulting semiconductor structure includes a semiconductor substrate with fin(s) thereon, FinFET(s) integral with the fin(s), the FinFET(s) including a gate electrode, a gate liner lining the gate electrode, and air-gap(s) in gate trench(es) of the FinFET(s), reducing parasitic capacitance by at least about 75 percent as compared to no air-gaps.
1. A semiconductor structure, comprising:
a semiconductor substrate;
at least one fin on the semiconductor substrate;
at least one FinFET integral with the at least one fin, the at least one FinFET comprising:
a gate electrode;
a gate liner lining a bottom and side walls of the gate electrode; and
at least one air-gap in at least one gate trench of the at least one FinFET, wherein the air-gap comprises:
an upper portion positioned between the side walls of the gate electrode; and
a lower portion extending from the bottom of the gate electrode to the upper portion;
wherein the lower portion has a width less than half a width of the upper portion.
2. The semiconductor structure of claim 1 , wherein ends of the at least one fin are tucked by at least one gate.
3. The semiconductor structure of claim 1 , wherein a gate dielectric of the at least one FinFET comprises a low-k dielectric material.
4. The semiconductor structure of claim 3 , wherein the gate dielectric has a thickness of about 1 nm to about 10 nm.
5. The semiconductor structure of claim 1 , wherein the air-gaps are situated at a bottom region of the at least one gate trench.
6. The semiconductor structure of claim 5 , wherein the bottom region comprises about 50 percent of a height of each gate electrode.
7. The semiconductor structure of claim 1 , wherein a gate dielectric layer of the at least one FinFET has a thickness of about 1 nm to about 10 nm.