IP Library Granted Patent US 10,347,962
Granted Patent B1
US 10,347,962 · App. 16/000,178 · Granted Jul 9, 2019

Foldable, deployable and reconfigurable origami antennas using fabric, textile or other material encapsulation and/or scaffolding

Inventor: Stavros Georgakopoulos (Miami, FL)
Assignee: The Florida International University Board of Trustees
H01Q1/085H01Q1/362H01Q1/38
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,347,962
App. No.
16/000,178
Granted
Jul 9, 2019
Kind
B1
Abstract

A foldable antenna can comprise a bottom encapsulation layer, a plurality of origami substrates disposed on the bottom encapsulation layer, a top encapsulation layer disposed on the plurality of origami substrate, and a conductive trace disposed on the top encapsulation layer. The plurality of origami substrates can be spaced apart from each other. The bottom encapsulation layer and the top encapsulation layer can comprise a fabric, and each of the plurality of origami substrates can comprise at least one of foam, plastic, carton, FR4, laminate, and wood.

Claims (50)

1. A foldable antenna, comprising:

a bottom encapsulation layer;

a plurality of origami substrates disposed on the bottom encapsulation layer;

a top encapsulation layer disposed on the plurality of origami substrates; and

a conductive trace comprising conductive antenna elements disposed on the top encapsulation layer,

each origami substrate of the plurality of origami substrates being spaced apart from each other origami substrate of the plurality of origami substrates,

the bottom encapsulation layer being disposed on, and in direct physical contact with, each origami substrate of the plurality of origami substrates, and the top encapsulation layer being disposed on, and in direct physical contact with, each origami substrate of the plurality of origami substrates, and

the conductive trace being disposed on at least two origami substrates of the plurality of origami substrates that are spaced apart from each other.

2. The foldable antenna according to claim 1 , each origami substrate of the plurality of origami substrates comprising at least one of foam, plastic, carton, FR4, laminate, and wood.

3. The foldable antenna according to claim 1 , at least one of the bottom encapsulation layer and the top encapsulation layer comprising a fabric.

4. The foldable antenna according to claim 1 , the conductive trace comprising at least one of conductive cloth tape, conductive thread, conductive tape, conductive wire, and microfluidic channel with liquid metal.

5. The foldable antenna according to claim 4 , further comprising a fixing material on the conductive trace, the fixing material comprising at least one of glue, sewing, stitching, adhesive, epoxy, and soldering.

6. The foldable antenna according to claim 1 , the top encapsulation layer comprising a plurality of folding patterns corresponding to the plurality of origami substrates, respectively.

7. The foldable antenna according to claim 1 , a first side peripheral area of the bottom encapsulation layer or the top encapsulation layer being attached to a second side peripheral area of the bottom encapsulation layer or the top encapsulation layer such that the foldable antenna has a structure of at least one of a cylinder and a cone.

8. The foldable antenna according to claim 7 , the bottom encapsulation layer and the top encapsulation layer being attached to each other by at least one of glue, sewing, stitching, adhesive, and epoxy.

9. The foldable antenna according to claim 7 , the plurality of origami substrates being arranged in an array.

10. The foldable antenna according to claim 7 , further comprising a conductive ground plane supporting the cylinder structure or the cone structure.

11. The foldable antenna according to claim 7 , further comprising a scaffolding disposed on the top encapsulation layer.

12. The foldable antenna according to claim 7 , the plurality of origami substrates being arranged such that spaces are present between adjacent origami substrates of the plurality of origami substrates, such that the foldable antenna is configured to be folded.

13. A method of manufacturing a foldable antenna, the method comprising:

preparing a bottom encapsulation layer;

disposing a plurality of origami substrates on the bottom encapsulation layer;

preparing a top encapsulation layer;

disposing a conductive trace comprising conductive antenna elements on the top encapsulation layer; and

attaching the top encapsulation layer to the bottom encapsulation layer such that the plurality of origami substrates are encapsulated by the bottom encapsulation layer and the top encapsulation layer,

each origami substrate of the plurality of origami substrates being spaced apart from each other origami substrate of the plurality of origami substrates,

the bottom encapsulation layer being disposed on, and in direct physical contact with, each origami substrate of the plurality of origami substrates,

the top encapsulation layer being disposed on, and in direct physical contact with, each origami substrate of the plurality of origami substrates, and

the conductive trace being disposed on at least two origami substrates of the plurality of origami substrates that are spaced apart from each other.

14. The method according to claim 13 , further comprising forming a plurality of folding patterns on the top encapsulation layer by at least one of adhering, drawing, and stamping,

each of the plurality of folding patterns of the top encapsulation layer corresponding to each of the plurality of origami substrates, respectively.

15. The method according to claim 14 , further comprising attaching a first side peripheral area of the bottom encapsulation layer or the top encapsulation layer to a second side peripheral area of the bottom encapsulation layer or the top encapsulation layer such that the foldable antenna has a structure of at least one of a cylinder and a cone.

16. The method according to claim 15 , at least one of the bottom encapsulation layer and the top encapsulation layer comprising a fabric.

17. The method according to claim 16 , each origami substrate of the plurality of origami substrates comprising at least one of foam, plastic, carton, FR4, laminate, and wood.

18. The method according to claim 17 , the conductive trace comprising at least one of conductive cloth tape, conductive thread, conductive tape, conductive wire, and microfluidic channel with liquid metal.

19. The method according to claim 18 , attaching the top encapsulation layer to the bottom encapsulation layer comprising sewing the top encapsulation layer to the bottom encapsulation layer along the plurality of folding patterns.

20. A foldable antenna, comprising:

a bottom encapsulation layer;

a plurality of origami substrates disposed on the bottom encapsulation layer;

a top encapsulation layer disposed on the plurality of origami substrates and the bottom encapsulation layer; and

a conductive trace comprising conductive antenna elements disposed on the top encapsulation layer,

each origami substrate of the plurality of origami substrates being spaced apart from each other origami substrate of the plurality of origami substrates,

each origami substrate of the plurality of origami substrates being encapsulated by the bottom and top encapsulation layers,

the top encapsulation layer comprising a plurality of folding patterns corresponding to the plurality of origami substrates, respectively,

each of the bottom encapsulation layer and the top encapsulation layer comprising a fabric,

each origami substrate of the plurality of origami substrates comprising at least one of foam, plastic, carton, FR4, laminate, and wood,

the conductive trace comprising at least one of conductive cloth tape, conductive thread, conductive tape, conductive wire, and microfluidic channel with liquid metal,

the bottom encapsulation layer being disposed on, and in direct physical contact with, each origami substrate of the plurality of origami substrates,

the top encapsulation layer being disposed on, and in direct physical contact with, each origami substrate of the plurality of origami substrates, and

the conductive trace being disposed on at least two origami substrates of the plurality of origami substrates that are spaced apart from each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2018
From: GEORGAKOPOULOS, STAVROS
To: THE FLORIDA INTERNATIONAL UNIVERSITY BOARD OF TRUSTEES
Reel/Frame 046551/0296 →
Cited By (7)
US 12,235,082 US 12,409,953 US 12,431,607 US 12,444,826 US 12,500,326 US 12,549,126 US 12,583,629