IP Library › Granted Patent US 11,462,444
Granted Patent B2
US 11,462,444 · App. 16/001,294 · Granted Oct 4, 2022

Substrate container, controller, and abnormality detection method

Inventor: Hiroshi Nagaike (Miyagi, JP)
Assignee: Tokyo Electron Limited
H01L22/10H01L21/67242H01L21/67253H01L21/67288H01L21/67383H01L21/67389H01L21/67393H01L21/67769H01L21/67772
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Quick Facts
Patent No.
US 11,462,444
App. No.
16/001,294
Granted
Oct 4, 2022
Kind
B2
Abstract

A substrate accommodating container that accommodates a substrate includes a monitor installed inside the substrate accommodating container so as to detect a contamination state inside the substrate accommodating container, wherein the contamination state inside the substrate accommodating container is detected.

Claims (76)

1. A substrate processing system comprising:

a loader module configured to transfer a substrate under an air atmosphere;

a load port connected to the loader module;

a substrate container mounted on the load port;

a monitor configured to detect a contamination state inside the substrate container;

a vacuum transfer chamber configured to transfer the substrate under a vacuum atmosphere;

a load lock chamber disposed between the loader module and the vacuum transfer chamber;

a plurality of substrate processing chambers connected to the vacuum transfer chamber

a controller configured to

process the substrate in one of the plurality of substrate processing chambers,

transfer the processed substrate to the substrate container through the vacuum transfer chamber, the load lock chamber, and the loader module,

detect a contamination state inside the substrate container by the monitor, and

perform a recovery process based on the detected contamination state,

wherein the recovery process includes transferring the processed substrate disposed inside the substrate container to any one of the plurality of substrate processing chambers through the loader module, the load lock chamber, and the vacuum transfer chamber, and cleaning the processed substrate.

2. The substrate processing system according to claim 1 ,

wherein the controller performs a report of error in a case where an abnormality is detected.

3. The substrate processing system according to claim 2 ,

wherein the controller performs, in a case where the abnormality inside the substrate container is detected outside the substrate processing apparatus, the recovery process by either

transferring the substrate container, in which the abnormality is detected, to the load port, a purge storage, the substrate container, a Front Opening Unified Pod (FOUP) purge apparatus, or a FOUP and introducing an inert gas into an inside of the load port, the purge storage, the substrate container, the FOUP purge apparatus, or the FOUP stocker, or

transferring the substrate inside the substrate container, in which the abnormality is detected, to the FOUP purge storage or the FOUP stocker and holding the transferred substrate in the purge storage or the FOUP stocker.

4. The substrate processing system according to claim 2 ,

wherein the controller performs another recovery process including

detecting the abnormality inside the substrate container again based on the information acquired after the recovery process as indicating the contamination state, and

processing the substrate in the substrate processing chamber using a predetermined gas or changing a processing condition for the substrate in the substrate processing chamber in a case where the abnormality is detected again.

5. The substrate processing system according to claim 1 ,

wherein the controller performs the recovery process in a case where an abnormality is detected.

6. The substrate processing system according to claim 5 ,

wherein the controller performs

detecting the abnormality inside the substrate container again based on the information indicating the contamination state acquired after the recovery process, and

conducting a pattern inspection for the substrate inside the substrate container using an apparatus of inspecting a defect of the substrate in a case where the abnormality is detected again.

7. The substrate processing system according to claim 1 ,

wherein the controller performs the recovery process in a case where an abnormality inside the substrate container is detected based on information indicating the contamination state during an accumulated predetermined time by referring to a memory unit, in which the information indicating the contamination state is accumulated.

8. The substrate processing system according to claim 1 ,

wherein the monitor is a crystal resonator.

9. The substrate processing system according to claim 8 ,

wherein any one of a resist, Si, SiO 2 , and SiN is coated on a surface of the crystal resonator.

10. The substrate processing system according to claim 1 ,

wherein the monitor is installed on at least any one of an inner upper surface, an inner lower surface, or an inner side surface inside the substrate container in response to a type of a predetermined gas used to process the substrate in the substrate processing chamber.

11. A substrate processing system comprising:

a loader module configured to transfer a substrate under an air atmosphere;

a load port connected to the loader module;

a substrate container mounted on the load port;

a monitor configured to detect a contamination state inside the substrate container;

a vacuum transfer chamber configured to transfer the substrate under a vacuum atmosphere;

a load lock chamber disposed between the loader module and the vacuum transfer chamber;

a plurality of substrate processing chambers that are connected to the vacuum transfer chamber; and

a controller configured to

process the substrate in one of the plurality of substrate processing chambers,

transfer the processed substrate to the substrate container through the vacuum transfer chamber, the load lock chamber, and the loader module,

detect a contamination state inside the substrate container by the monitor, and

perform a recovery process based on the detected contamination state,

wherein the recovery process changes a processing condition of the plurality of substrate processing chambers.

12. The substrate processing system according to claim 11 ,

wherein the controller performs a report of error in a case where an abnormality is detected.

13. The substrate processing system according to claim 12 ,

wherein the controller performs, in a case where the abnormality inside the substrate container is detected outside the substrate processing apparatus, the recovery process by either

transferring the substrate container, in which the abnormality is detected, to the load port, a purge storage, the substrate container, a FOUP purge apparatus, or a FOUP stocker and introducing an inert gas into an inside of the load port, the purge storage, the substrate container, the FOUP purge apparatus, or the FOUP stocker, or

transferring the substrate inside the substrate container, in which the abnormality is detected, to the FOUP purge storage or the FOUP stocker and holding the transferred substrate in the purge storage or the FOUP stocker.

14. The substrate processing system according to claim 12 ,

wherein the controller performs another recovery process including

detecting the abnormality inside the substrate container again based on the information acquired after the recovery process as indicating the contamination state, and

processing the substrate in the substrate processing chamber using a predetermined gas or changing a processing condition for the substrate in the substrate processing chamber in a case where the abnormality is detected auain.

15. The substrate processing system according to claim 11 ,

wherein the controller performs the recovery process in a case where an abnormality is detected.

16. The substrate processing system according to claim 15 ,

wherein the controller performs

detecting the abnormality inside the substrate container again based on the information indicating the contamination state acquired after the recovery process, and

conducting a pattern inspection for the substrate inside the substrate container using an apparatus of inspecting a defect of the substrate in a case where the abnormality is detected again.

17. The substrate processing system according to claim 11 ,

wherein the controller performs the recovery process in a case where an abnormality inside the substrate container is detected based on information indicating the contamination state during an accumulated predetermined time by referring to a memory unit, in which the information indicating the contamination state is accumulated.

18. The substrate processing system according to claim 11 ,

wherein the monitor is a crystal resonator.

19. The substrate processing system according to claim 18 ,

wherein any one of a resist, Si, SiO 2 , and SiN is coated on a surface of the crystal resonator.

20. The substrate processing system according to claim 11 ,

wherein the monitor is installed on at least any one of an inner upper surface, an inner lower surface, or an inner side surface inside the substrate container in response to a type of a predetermined gas used to process the substrate in the substrate processing chamber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2018
From: NAGAIKE, HIROSHI
To: TOKYO ELECTRON LIMITED
Reel/Frame 046002/0680 →
Priority Claims (1)
JP JP2017-113770 · Jun 8, 2017 · national
Continuity (1)
Related Publication 20180358249A1 · Dec 13, 2018
Cited By (1)
US 12,652,993