Methods of forming an array of elevationally-extending strings of memory cells, methods of forming polysilicon, elevationally-extending strings of memory cells individually comprising a programmable charge storage transistor, and electronic components comprising polysilicon
View Patent ↗A method of forming polysilicon comprises forming a first polysilicon-comprising material over a substrate, with the first polysilicon-comprising material comprising at least one of elemental carbon and elemental nitrogen at a total of 0.1 to 20 atomic percent. A second polysilicon-comprising material is formed over the first polysilicon-comprising material. The second polysilicon-comprising material comprises less, if any, total elemental carbon and elemental nitrogen than the first polysilicon-comprising material. Other aspects and embodiments, including structure independent of method of manufacture, are disclosed.
1. An elevationally-extending string of memory cells individually comprising a programmable charge storage transistor, comprising:
vertically-alternating tiers of insulative material and control gate material;
a channel pillar extending elevationally through multiple of the vertically-alternating tiers; the channel pillar comprising radially outer first polysilicon-comprising material comprising elemental carbon at a total of 0.1 to 20 atomic percent, the first polysilicon-comprising material not comprising elemental-form nitrogen; the channel pillar comprising second polysilicon-comprising material radially inward of the first polysilicon-comprising material, the second polysilicon-comprising material comprising total elemental carbon that is from zero to less than the total of the elemental carbon that is in first polysilicon-comprising material; and
tunnel insulator, programmable charge storage material, and control gate blocking insulator between the channel pillar and the control gate material of individual of the tiers of the control gate material.
2. The elevationally-extending string of memory cells of claim 1 wherein the second polysilicon-comprising material is directly against the first polysilicon-comprising material.
3. The elevationally-extending string of memory cells of claim 1 wherein the total elemental carbon in the second polysilicon-comprising material is zero to 0.001 atomic percent.
4. The elevationally-extending string of memory cells of claim 1 wherein the total elemental carbon in the first polysilicon-comprising material is 0.5 to 2 atomic percent.
5. The elevationally-extending string of memory cells of claim 4 wherein the total elemental carbon in the second polysilicon-comprising material is zero to 0.001 atomic percent.
6. The elevationally-extending string of memory cells of claim 1 wherein the channel pillar is vertical or within 10° vertical.
7. The elevationally-extending string of memory cells of claim 6 wherein the channel pillar is vertical.
8. An elevationally-extending string of memory cells individually comprising a programmable charge storage transistor, comprising:
vertically-alternating tiers of insulative material and control gate material;
a channel pillar extending elevationally through multiple of the vertically-alternating tiers; the channel pillar comprising radially outer first polysilicon-comprising material comprising at least one of elemental carbon and elemental nitrogen at a total of 0.1 to 20 atomic percent; the channel pillar comprising second polysilicon-comprising material radially inward of the first polysilicon-comprising material, the second polysilicon-comprising material comprising less, if any, total elemental carbon and elemental nitrogen than the first polysilicon-comprising material;
tunnel insulator, programmable charge storage material, and control gate blocking insulator between the channel pillar and the control gate material of individual of the tiers of the control gate material; and
the first polysilicon-comprising material comprising both elemental carbon and elemental nitrogen.
9. The elevationally-extending string of memory cells of claim 8 wherein the total of the at least one of elemental carbon and elemental nitrogen in the first polysilicon-comprising material is 0.5 to 2 atomic percent.
10. The elevationally-extending string of memory cells of claim 8 wherein the channel pillar is vertical or within 10° vertical.
11. The elevationally-extending string of memory cells of claim 10 wherein the channel pillar is vertical.
12. An elevationally-extending string of memory cells individually comprising a programmable charge storage transistor, comprising: vertically-alternating tiers of insulative material and control gate material; a channel pillar extending elevationally through multiple of the vertically-alternating tiers; the channel pillar comprising radially outer first polysilicon-comprising material comprising at least one of elemental carbon and elemental nitrogen at a total of 0.1 to 20 atomic percent; the channel pillar comprising second polysilicon-comprising material radially inward of the first polysilicon-comprising material, the second polysilicon-comprising material comprising less, if any, total elemental carbon and elemental nitrogen than the first polysilicon-comprising material; tunnel insulator, programmable charge storage material, and control gate blocking insulator between the channel pillar and the control gate material of individual of the tiers of the control gate material; and the first polysilicon-comprising material and the second polysilicon-comprising material having at least 30 percent 111 crystal orientation as measured by EBSD.
13. The elevationally-extending string of memory cells of claim 12 wherein the first polysilicon-comprising material and the second polysilicon-comprising material have at least 50 percent 111 crystal orientation as measured by EBSD.
14. The elevationally-extending string of memory cells of claim 12 wherein the channel pillar is vertical or within 10° vertical.
15. The elevationally-extending string of memory cells of claim 14 wherein the channel pillar is vertical.