Integrated assemblies comprising stud-type capacitors
View Patent ↗Some embodiments include an integrated capacitor assembly having a conductive pillar supported by a base, with the conductive pillar being included within a first electrode of a capacitor. The conductive pillar has a first upper surface. A dielectric liner is along an outer surface of the conductive pillar and has a second upper surface. A conductive liner is along the dielectric liner and is included within a second electrode of the capacitor. The conductive liner has a third upper surface. One of the first and third upper surfaces is above the other of the first and third upper surfaces. The second upper surface is at least as high above the base as said one of the first and third upper surfaces. Some embodiments include memory arrays having capacitors with pillar-type first electrodes.
1. An integrated assembly, comprising:
conductive pillars supported by a base and included within first electrodes of capacitors; the conductive pillars having first upper surfaces;
dielectric liners along outer surfaces of the conductive pillars; the dielectric liners having second upper surfaces;
conductive liners along the dielectric liners and included within second electrodes of the capacitors; the conductive liners having third upper surfaces;
the first upper surfaces being beneath the third upper surfaces;
insulative pads being over the first upper surfaces and having fourth upper surfaces;
the second upper surfaces, third upper surfaces and fourth upper surfaces being substantially coplanar with one another; and
a conductive plate extending across the insulative pads and laterally outwardly from the conductive liners; the conductive plate electrically coupling the conductive liners to one another.
2. The integrated assembly of claim 1 wherein the capacitors are in an hexagonally packed arrangement.
3. The integrated assembly of claim 1 wherein the capacitors are electrically coupled with source/drain regions of transistors and are comprised by memory cells of a memory array.
4. The integrated assembly of claim 1 wherein the conductive plate comprises a metal-containing material over a conductively-doped semiconductor material, and wherein both the metal-containing material and the conductively-doped semiconductor material vertically overlap the conductive liners.
5. The integrated assembly of claim 1 wherein the conductive plate comprises a metal-containing material over a conductively-doped semiconductor material, and wherein only the conductively-doped semiconductor material vertically overlaps the conductive liners.
6. The integrated assembly of claim 1 wherein the conductive plate contacts at least one of the following upper surfaces:
a) the second upper surfaces of the dielectric liners;
b) the third upper surfaces of the conductive liners; and
c) the fourth upper surfaces of the insulative pads.
7. The integrated assembly of claim 6 wherein the conductive plate contacts at least two of the upper surfaces.
8. The integrated assembly of claim 6 wherein the conductive plate contacts all three of the upper surfaces.
9. The integrated assembly of claim 1 wherein the insulative pads contact only one of the upper surfaces.
10. The integrated assembly of claim 9 wherein the only one of the upper surfaces contacted is the first upper surfaces of the conductive pillars.
11. The integrated assembly of claim 1 wherein the dielectric liners comprise sidewall surfaces and the conductive liners extend along the sidewall surfaces of the dielectric liners.
12. The integrated assembly of claim 1 wherein the dielectric liners comprise sidewall surfaces and the conductive liners contact the sidewall surfaces of the dielectric liners.
13. The integrated assembly of claim 1 wherein the dielectric liners comprise sidewall surfaces and wherein the conductive liners comprise sidewall surfaces, the two sidewall surfaces contacting each other.
14. The integrated assembly of claim 1 wherein the dielectric liners comprise sidewall surfaces and the conductive liners comprise sidewall surfaces, wherein the two sidewall surfaces extend along each other in a parallel relationship.
15. The integrated assembly of claim 1 wherein the first electrodes comprise the conductive pillars and an another set of conductive liners that extend along outer lateral surfaces of the conductive pillars.
16. The integrated assembly of claim 15 wherein the another set of conductive liners of the first electrodes and the conductive liners of the second electrodes extend along each other in a parallel relationship.
17. The integrated assembly of claim 15 wherein the another set of conductive liners of the first electrodes and the conductive liners of the second electrodes both comprise the same electrically conductive compositions.
18. The integrated assembly of claim 15 wherein the another set of conductive liners of the first electrodes and the conductive liners of the second electrodes comprise different electrically conductive compositions.