IP Library Granted Patent US 10,497,640
Granted Patent B2
US 10,497,640 · App. 16/005,776 · Granted Dec 3, 2019

Heat pipe

Inventor: Nobuyuki Kurashima (Nagano, JP)
Assignee: Shinko Electric Industries Co., LTD.
H01L23/427F28D15/0233F28D15/046F28D2015/0225
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Quick Facts
Patent No.
US 10,497,640
App. No.
16/005,776
Granted
Dec 3, 2019
Kind
B2
Abstract

A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.

Claims (23)

1. A heat pipe containing a working fluid, the heat pipe comprising:

a first metal layer including an upper surface and a plurality of bottomed holes depressed from the upper surface; and

a second metal layer including a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface, wherein

the recess forms a vapor layer in which vapor vaporized from the working fluid moves, and

adjacent ones of the plurality of bottomed holes are in communication with each other so that the plurality of bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.

2. The heat pipe according to claim 1 , wherein

the adjacent ones of the plurality of bottomed holes are partially overlapped with each other and form a communication portion through which the adjacent ones of the plurality of bottomed holes are in communication,

the communication portion has a width that is smaller than an inner diameter of each of the plurality of bottomed holes, and

the communication portion has a depth that is smaller than a depth of each of the plurality of bottomed holes.

3. The heat pipe according to claim 1 , wherein

the first metal layer includes a support having a height that is the same as that of the upper surface of the first metal layer,

the second metal layer includes a post located inside the recess, and

the post extends from a ceiling surface of the recess to the lower surface of the second metal layer and is joined with the support.

4. The heat pipe according to claim 1 , wherein the plurality of bottomed holes include

a plurality of first bottomed holes arranged in a grid-like array, and

a plurality of second bottomed holes arranged between the plurality of first bottomed holes in an arrayed direction of the plurality of first bottomed holes,

wherein each of the plurality of second bottomed holes has an inner diameter that is smaller than that of each of the plurality of first bottomed holes.

5. The heat pipe according to claim 1 , wherein the plurality of bottomed holes include

a plurality of first bottomed holes located in a first region of the first metal layer,

a plurality of second bottomed holes located in a second region of the first metal layer,

wherein each of the plurality of second bottomed holes has an inner diameter that is smaller than that of each of the plurality of first bottomed holes.

6. The heat pipe according to claim 1 , wherein each of the plurality of bottomed holes in a plan view has a circular shape, a quadrangular shape, or a polygonal shape.

7. The heat pipe according to claim 1 , wherein the heat pipe has a thickness that is a sum of a thickness of the first metal layer and a thickness of the second metal layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2018
From: KURASHIMA, NOBUYUKI
To: SHINKO ELECTRIC INDUSTRIES CO., LTD
Reel/Frame 046051/0703 →
Priority Claims (1)
JP 2017-130943 · Jul 4, 2017 · national
Continuity (1)
Related Publication 20190013257A1 · Jan 10, 2019
Cited By (1)
US 12,557,247