Semiconductor device assemblies with lids including circuit elements
A semiconductor device package is provided. The semiconductor device package includes a stack of semiconductor dies over a substrate, the substrate including a plurality of electrical contacts, and an annular lower lid disposed over the substrate and surrounding the stack of semiconductor dies. The annular lower lid includes a lower surface coupled to the substrate, an upper surface coupled to an upper lid, and an outer surface in which is formed an opening. The semiconductor device assembly further includes a circuit element disposed in the opening and electrically coupled to at least a first one of the plurality of electrical contacts. The semiconductor device assembly further includes the upper lid disposed over the annular lower lid and the stack of semiconductor dies.
1. A semiconductor device package, comprising:
a stack of semiconductor dies over a substrate;
the substrate including a plurality of electrical contacts;
an annular lower lid disposed over the substrate and surrounding the stack of semiconductor dies, the annular lower lid including a lower surface coupled to the substrate, an upper surface coupled to an upper lid, and an outer surface in which is formed an opening;
a circuit element disposed in the opening and electrically coupled to at least a first one of the plurality of electrical contacts; and
the upper lid disposed over the annular lower lid and the stack of semiconductor dies.
2. The semiconductor device package of claim 1 , wherein the lower lid comprises a metal.
3. The semiconductor device package of claim 1 , wherein the upper lid comprises a metal.
4. The semiconductor device package of claim 1 , wherein the circuit element is configured for wireless communication.
5. The semiconductor device package of claim 1 , wherein the circuit element is a sensor.
6. The semiconductor device package of claim 1 , wherein the circuit element is a first circuit element, and wherein the semiconductor device package includes a second circuit element disposed in the opening and electrically coupled to at least a second one of the plurality of electrical contacts.
7. The semiconductor device package of claim 1 , wherein the lower lid includes at least one via electrically coupling the circuit element to the first one of the plurality of electrical contacts.
8. The semiconductor device package of claim 7 , wherein the at least one via is electrically isolated from the lower lid.
9. The semiconductor device package of claim 7 , wherein the at least one via is electrically coupled to the first one of the plurality of electrical contacts by a solder joint.
10. A semiconductor device package, comprising:
a stack of semiconductor dies over a substrate;
the substrate including a plurality of electrical contacts;
a lid disposed over the substrate and surrounding the die stack, the lid including a lower surface coupled to the substrate, an upper surface above the stack of semiconductor dies, and an outer surface in which is formed an opening;
a circuit element disposed in the opening and electrically coupled to at least a first one of the plurality of electrical contacts.
11. The semiconductor device package of claim 10 , wherein the lid comprises a metal.
12. The semiconductor device package of claim 10 , wherein the circuit element is configured for wireless communication.
13. The semiconductor device package of claim 10 , wherein the circuit element is a sensor.
14. The semiconductor device package of claim 10 , wherein the circuit element is a first circuit element, and wherein the semiconductor device package includes a second circuit element disposed in the opening and electrically coupled to at least a second one of the plurality of electrical contacts.
15. The semiconductor device package of claim 10 , wherein the lid includes at least one via electrically coupling the circuit element to the first one of the plurality of electrical contacts.
16. The semiconductor device package of claim 15 , wherein the at least one via is electrically isolated from the lid.
17. The semiconductor device package of claim 15 , wherein the at least one via is electrically coupled to the first one of the plurality of electrical contacts by a solder joint.
18. The semiconductor device package of claim 10 , wherein the lid is a two-piece lid comprising an annular lower lid and an upper lid.
19. A semiconductor device assembly, comprising:
a semiconductor device package, including:
a stack of semiconductor dies over a substrate,
the substrate including a plurality of electrical contacts,
a lid disposed over the substrate and surrounding the die stack, the lid including a lower surface coupled to the substrate, an upper surface above the stack of semiconductor dies, and an outer surface in which is formed an opening, and
a first circuit element disposed in the opening and electrically coupled to at least a first one of the plurality of electrical contacts; and
a second circuit element disposed outside of the semiconductor device package and configured to wirelessly communicate with the first circuit element.