Imaging system and imaging method
An imaging system having a scanning electron microscope capable of rapidly obtaining clear images of inspection targets at different heights is disclosed. The imaging system includes a computer having a memory storing design data including two-dimensional design information of each of layers of a three-dimensional multilayer structure constituting a surface of the specimen, the design data further including height information of each of the layers. The computer is configured to: read the two-dimensional design information and the height information from the memory; calculate a height of an image acquisition position on the specimen from the two-dimensional design information and the height information; and instruct the scanning electron microscope to focus the electron beam on the image acquisition position based on the calculated height of the image acquisition position.
1. An imaging system comprising:
a scanning electron microscope configured to generate an image of a specimen by detecting secondary electrons and backscattered electrons emitted from the specimen while scanning the specimen with an electron beam;
a computer having a memory storing design data including two-dimensional design information of each of layers of a three-dimensional multilayer structure constituting a surface of the specimen, the design data further including height information of each of the layers, the computer is configured to:
read the two-dimensional design information and the height information from the memory;
calculate a height of an image acquisition position on the specimen from the two-dimensional design information and the height information; and
instruct the scanning electron microscope to focus the electron beam on the image acquisition position based on the calculated height of the image acquisition position.
2. The imaging system according to claim 1 , wherein the computer is configured to calculate a distribution of surface heights of the specimen from the two-dimensional design information and the height information.
3. The imaging system according to claim 1 , wherein the computer is configured to:
calculate a scanning magnification change and a rotational angle change of the electron beam which occur with a change in the focus of the electron beam; and
instruct the scanning electron microscope to correct a scanning magnification and a rotational angle of the electron beam based on the calculated magnification change and the calculated rotational angle change.
4. An imaging method comprising:
reading design data including two-dimensional design information of each of layers of a three-dimensional multilayer structure constituting a surface of a specimen, the design data further including height information of each of the layers;
calculating a height of an image acquisition position on the specimen from the two-dimensional design information and the height information; and
instructing a scanning electron microscope to focus an electron beam on the image acquisition position based on the calculated height of the image acquisition position.
5. The imaging method according to claim 4 , further comprising:
calculating a distribution of surface heights of the specimen from the two-dimensional design information and the height information.
6. The imaging method according to claim 4 , further comprising:
calculating a scanning magnification change and a rotational angle change of the electron beam which occur with a change in the focus of the electron beam; and
instructing the scanning electron microscope to correct a scanning magnification and a rotational angle of the electron beam based on the calculated magnification change and the calculated rotational angle change.
7. A non-transitory computer-readable storage medium storing a program for causing a computer to perform the steps of:
reading design data including two-dimensional design information of each of layers of a three-dimensional multilayer structure constituting a surface of a specimen, the design data further including height information of each of the layers;
calculating a height of an image acquisition position on the specimen from the two-dimensional design information and the height information; and
instructing a scanning electron microscope to focus an electron beam on the image acquisition position based on the calculated height of the image acquisition position.