In situ vapor deposition polymerization to form polymers as precursors to viscoelastic fluids for particle removal from substrates

1. A method for cleaning a substrate comprising:

supplying a vapor to a processing chamber to grow a polymer film on the substrate in the processing chamber using initiated chemical vapor deposition (iCVD);

supplying a water vapor and optionally an additive to the processing chamber while supplying the vapor;

adding a solution to the polymer film on the substrate to create a viscoelastic fluid on the substrate; and

removing the viscoelastic fluid to remove particle contaminants from the substrate.

2. The method of claim 1 , wherein the vapor further comprises at least one monomer and an initiator.

3. The method of claim 2 , further comprising using a source of energy to decompose the initiator.

4. The method of claim 1 , wherein the solution includes at least one of water, buffered water, an acid, a base, buffer salts and surfactants.

5. The method of claim 1 , further comprising:

creating a temperature differential between the substrate and other surfaces in the processing chamber while growing the polymer film,

wherein the substrate is maintained at a lower temperature than the other surfaces to promote adsorption of the polymer film on the substrate.

6. The method of claim 1 , wherein a predetermined volume of the solution is added.

7. The method of claim 1 , wherein the solution is added to produce a final desired concentration of polymer.

8. The method of claim 1 , wherein after supplying the vapor and growing the polymer film and before adding the solution, moving the substrate to a second processing chamber.

9. The method of claim 1 , wherein pressure in the processing chamber is maintained at a predetermined pressure in a pressure range from 50 mTorr to 10 Torr while growing the polymer film.

10. The method of claim 1 , further comprising supplying the water vapor and optionally the additive to the processing chamber after supplying the vapor.

11. The method of claim 1 , wherein the water vapor and optionally the additive at least partially hydrate the polymer film.

12. The method of claim 11 , wherein the additive comprises at least one of ammonia vapor and a vapor of a volatile amine.

13. The method of claim 1 , further comprising agitating the substrate at least one of while supplying the solution and after supplying the solution.

14. The method of claim 1 , wherein adding the solution includes dispensing the solution onto the substrate.

15. The method of claim 1 , further comprising:

monitoring a weight of the substrate while the solution is added; and

controlling addition of the solution to the substrate based on the weight.

16. The method of claim 3 , wherein the source of energy includes a heated surface.

17. The method of claim 16 , wherein the heated surface comprises a wire filament.

18. A method for cleaning a substrate comprising:

supplying a vapor including at least one monomer and an initiator to a processing chamber including the substrate;

using a source of energy to trigger a reaction in the vapor and to cause a polymer film to be deposited on the substrate in the processing chamber using initiated chemical vapor deposition (iCVD),

supplying a water vapor to the processing chamber while supplying the vapor; and

adding a solution to the polymer film on the substrate to create a viscoelastic fluid on the substrate.

19. The method of claim 18 , further comprising removing the viscoelastic fluid to remove particle contaminants from the substrate.

20. The method of claim 18 , wherein the solution includes at least one of water, buffered water, an acid, a base, buffer salts and surfactants.

21. The method of claim 18 , further comprising:

creating a temperature differential between the substrate and other surfaces of the processing chamber while depositing the polymer film,

wherein the substrate is maintained at a lower temperature than the other surfaces to promote adsorption of the polymer film on the substrate.

22. The method of claim 18 , further comprising, prior to adding the solution, supplying an additive to the processing chamber to modify the polymer film.

23. The method of claim 18 , wherein adding the solution includes:

dispensing the solution onto the substrate;

monitoring a weight of the substrate while the solution is added; and

controlling addition of the solution to the substrate based on the weight.

24. The method of claim 18 , wherein the source of energy includes a heat source.