Semiconductor structures
View Patent ↗A semiconductor structure is provided. The semiconductor structure includes a substrate, a metal layer, a gate, a drain, a source and a first doping region. The substrate has a first doping type. The metal layer is adjacent to the surface of the substrate. The gate is formed on the substrate. The drain is formed in the substrate and located at one side of the gate. The drain is adjacent to the metal layer. The source is formed in the substrate and located at another side of the gate. The first doping region is formed in the substrate and surrounds the metal layer and the drain. The first doping region has a second doping type. The second doping type is different from the first doping type.
1. A semiconductor structure, comprising:
a substrate having a surface and a first doping type;
a metal layer having a lower surface, the metal layer being formed in the substrate and coplanar with the substrate;
a first gate formed on the substrate;
a first drain formed in the substrate and located at one side of the first gate, the first drain being in contact with the metal layer;
a first source formed in the substrate and located at another side of the first gate;
a second gate formed on the substrate;
a second drain formed in the substrate and located at one side of the second gate, the second drain being adjacent to the first drain and in contact with the metal layer;
a second source formed in the substrate and located at another side of the second gate; and
a first doping region continuously formed in the substrate and surrounding the metal layer, the first drain and the second drain adjacent to the first drain, wherein the first doping region has a second doping type, and the second doping type is different from the first doping type, wherein the lower surface of the metal layer is in contact with the first drain, the second drain and the first doping region, so as to form a Schottky diode.
2. The semiconductor structure as claimed in claim 1 , wherein the metal layer comprises metal silicide.
3. The semiconductor structure as claimed in claim 1 , wherein the first and second sources and the first and second drains have an n-doping type.
4. The semiconductor structure as claimed in claim 3 , wherein the first doping type is a p-doping type.
5. The semiconductor structure as claimed in claim 4 , wherein the second doping type is an n-doping type.
6. The semiconductor structure as claimed in claim 5 , further comprising an isolation structure formed within the first doping region and located at one side of the first and second drains.
7. The semiconductor structure as claimed in claim 1 , wherein the first and second sources and the first and second drains have a p-doping type.
8. The semiconductor structure as claimed in claim 7 , wherein the first doping type is an n-doping type.
9. The semiconductor structure as claimed in claim 8 , wherein the second doping type is a p-doping type.
10. The semiconductor structure as claimed in claim 9 , further comprising an isolation structure formed within the first doping region and located at one side of the first and second drains.
11. The semiconductor structure as claimed in claim 1 , wherein the first doping region has a doping concentration which is the same as that of the first and second drains.
12. The semiconductor structure as claimed in claim 1 , wherein the first doping region has a doping concentration which is different from that of the first and second drains.
13. A semiconductor structure, comprising:
a substrate having a surface and a first doping type;
a metal layer having a lower surface, the metal layer being formed in the substrate and coplanar with the substrate;
two first doping regions formed in the substrate and adjacent to each other, and the two first doping regions being in contact with the metal layer;
two second doping regions formed in the substrate respectively opposite to the two first doping regions; and
a third doping region continuously formed in the substrate and surrounding the metal layer and the two first doping regions adjacent to each other, wherein the third doping region has a second doping type, and the second doping type is different from the first doping type, wherein the lower surface of the metal layer is in contact with the two first doping regions and the third doping region, so as to form a Schottky diode.
14. The semiconductor structure as claimed in claim 13 , wherein the metal layer comprises metal silicide.
15. The semiconductor structure as claimed in claim 13 , wherein the first doping regions and the second doping regions have an n-doping type.
16. The semiconductor structure as claimed in claim 15 , wherein the first doping type is a p-doping type.
17. The semiconductor structure as claimed in claim 16 , wherein the second doping type is an n-doping type.
18. The semiconductor structure as claimed in claim 17 , further comprising an isolation structure formed within the third doping region and located at one side of the first doping regions.
19. The semiconductor structure as claimed in claim 13 , wherein the first doping regions and the second doping regions have a p-doping type.
20. The semiconductor structure as claimed in claim 19 , wherein the first doping type is an n-doping type.
21. The semiconductor structure as claimed in claim 20 , wherein the second doping type is a p-doping type.
22. The semiconductor structure as claimed in claim 21 , further comprising an isolation structure formed within the third doping region and located at one side of the first doping regions.
23. The semiconductor structure as claimed in claim 13 , wherein the third doping region has a doping concentration which is the same as that of the first doping regions.
24. The semiconductor structure as claimed in claim 13 , wherein the third doping region has a doping concentration which is different from that of the first doping regions.
25. The semiconductor structure as claimed in claim 13 , wherein the first doping regions have a p-doping type, and the second doping regions have an n-doping type.
26. The semiconductor structure as claimed in claim 25 , wherein the first doping type is a p-doping type.
27. The semiconductor structure as claimed in claim 26 , wherein the second doping type is an n-doping type.
28. The semiconductor structure as claimed in claim 27 , further comprising an isolation structure formed within the third doping region and located at one side of the first doping regions.
29. The semiconductor structure as claimed in claim 13 , wherein the first doping regions have an n-doping type, and the second doping regions have a p-doping type.
30. The semiconductor structure as claimed in claim 29 , wherein the first doping type is an n-doping type.
31. The semiconductor structure as claimed in claim 30 , wherein the second doping type is a p-doping type.
32. The semiconductor structure as claimed in claim 31 , further comprising an isolation structure formed within the third doping region and located at one side of the first doping regions.